Продукція > KESTER SOLDER > Всі товари виробника KESTER SOLDER (763) > Сторінка 13 з 13
Фото | Назва | Виробник | Інформація |
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92-7068-7645 | Kester Solder |
Description: SOLDER FLUX-CORED/275 .047" 500G Packaging: Bulk Diameter: 0.045" (1.14mm) Wire Gauge: 17 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7068-7678 | Kester Solder | Description: SOLDER FLUX-CORED/275 .078 500G |
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92-7068-8800 | Kester Solder | Description: SOLDER FLUX-CORED/245 .031" 500G |
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92-7068-8801 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .031" 500G Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7068-8820 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .020 500G Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7068-8825 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .040 500G Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7068-8840 | Kester Solder | Description: SOLDER FLUX-CORED/245 .0240" 500 |
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92-7068-8845 | Kester Solder | Description: SOLDER FLUX-CORED/245 .015" 500G |
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92-7068-8860 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .025" 500G Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7068-8861 | Kester Solder | Description: SOLDER FLUX-CORED/245 .025" 500G |
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92-7068-9014 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .031" 500G Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7068-9030 | Kester Solder | Description: SOLDER FLUX-CORED/245 .025" 500G |
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92-7080-0018 | Kester Solder |
Description: SOLDER FLUX-CORED/44 .025" 500G Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn95Sb5 (95/5) Type: Wire Solder Melting Point: 450 ~ 464°F (232 ~ 240°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: Rosin Activated (RA) Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7150-8800 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .031" 500G Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7150-8806 | Kester Solder | Description: SOLDER FLUX-CORED/245 .015" 500G |
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92-7150-8807 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .020 500G Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7150-8850 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .050" 500G Packaging: Bulk Diameter: 0.050" (1.27mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-7150-9702 | Kester Solder | Description: SOLDER FLUX-CORED/285 63/37 .020 |
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92-7150-9703 | Kester Solder |
Description: SOLDER FLUX-CORED/285 63/37 .015 Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Mildly Activated (RMA) Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-9574-7601 | Kester Solder |
Description: SOLDER FLUX-CORED/275 .031" 500G Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-9574-7611 | Kester Solder |
Description: SOLDER FLUX-CORED/275 .024" 500G Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-9574-7618 | Kester Solder |
Description: SOLDER FLUX-CORED/275 .031" 500G Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-9574-7619 | Kester Solder |
Description: SOLDER FLUX-CORED/275 .025" 500G Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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92-9574-7650 | Kester Solder |
Description: SOLDER FLUX-CORED/275 .047" 500G Packaging: Bulk Diameter: 0.047" (1.19mm) Wire Gauge: 17 AWG, 18 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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93-6337-9744 | Kester Solder |
Description: SN63PB37 2.2%/285 .010 113 G Packaging: Bulk |
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93-7069-9510 | Kester Solder |
Description: SN96.5AG3.0CU0.5 3.3%/268 .010 Packaging: Spool Diameter: 0.010" (0.25mm) Wire Gauge: 30 AWG, 33 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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96-6040-8832 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .031" 500 Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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96-6337-9515 | Kester Solder |
Description: SN63PB37 3.3%/268 .015 500 G Packaging: Spool Diameter: 0.015" (0.38mm) Wire Gauge: 26 AWG, 27 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 103 шт: термін постачання 21-31 дні (днів) |
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96-6337-9531 | Kester Solder |
Description: SN63PB37 3.3%/268 .031 500 G Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 AWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 158 шт: термін постачання 21-31 дні (днів) |
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96-7068-8815 | Kester Solder | Description: SOLDER FLUX-CORED/245 .015" 500 |
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96-7068-8820 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .020 500G Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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96-7068-8832 | Kester Solder |
Description: SOLDER FLUX-CORED/245 .031" 500 Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
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96-7068-8840 | Kester Solder | Description: SOLDER FLUX-CORED/245 .040 500G |
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96-7069-9515 | Kester Solder |
Description: SN96.5AG3.0CU0.5 3.3%/268 .015 5 Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 333 шт: термін постачання 21-31 дні (днів) |
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96-7069-9520 | Kester Solder |
Description: SN96.5AG3.0CU0.5 3.3%/268 .020 5 Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 212 шт: термін постачання 21-31 дні (днів) |
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96-7069-9525 | Kester Solder |
Description: SN96.5AG3.0CU0.5 3.3%/268 .025 5 Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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96-7069-9531 | Kester Solder |
Description: SN96.5AG3.0CU0.5 3.3%/268 .031 5 Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 100 шт: термін постачання 21-31 дні (днів) |
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96-7069-9540 | Kester Solder |
Description: SN96.5AG3.0CU0.5 3.3%/268 .040 5 Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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96-9574-9515 | Kester Solder |
Description: K100LD 3.3%/268 .015 500 G ROBO Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 111 шт: термін постачання 21-31 дні (днів) |
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96-9574-9520 | Kester Solder |
Description: K100LD 3.3%/268 .020 500 G ROBO Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 143 шт: термін постачання 21-31 дні (днів) |
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96-9574-9525 | Kester Solder |
Description: K100LD 3.3%/268 .025 500 G ROBO Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 100 шт: термін постачання 21-31 дні (днів) |
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96-9574-9531 | Kester Solder |
Description: K100LD 3.3%/268 .031 500 G ROBO Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 51 шт: термін постачання 21-31 дні (днів) |
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96-9574-9540 | Kester Solder |
Description: K100LD 3.3%/268 .040 500 G ROBO Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 98 шт: термін постачання 21-31 дні (днів) |
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92-7068-7645 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/275 .047" 500G
Packaging: Bulk
Diameter: 0.045" (1.14mm)
Wire Gauge: 17 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/275 .047" 500G
Packaging: Bulk
Diameter: 0.045" (1.14mm)
Wire Gauge: 17 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7068-8801 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7068-8820 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .020 500G
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .020 500G
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7068-8825 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .040 500G
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .040 500G
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7068-8860 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .025" 500G
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .025" 500G
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7068-9014 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7080-0018 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/44 .025" 500G
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn95Sb5 (95/5)
Type: Wire Solder
Melting Point: 450 ~ 464°F (232 ~ 240°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/44 .025" 500G
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn95Sb5 (95/5)
Type: Wire Solder
Melting Point: 450 ~ 464°F (232 ~ 240°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7150-8800 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7150-8807 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .020 500G
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .020 500G
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7150-8850 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .050" 500G
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .050" 500G
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-7150-9703 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/285 63/37 .015
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/285 63/37 .015
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-9574-7601 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/275 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/275 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-9574-7611 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/275 .024" 500G
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/275 .024" 500G
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-9574-7618 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/275 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/275 .031" 500G
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-9574-7619 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/275 .025" 500G
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/275 .025" 500G
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
92-9574-7650 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/275 .047" 500G
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Wire Gauge: 17 AWG, 18 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/275 .047" 500G
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Wire Gauge: 17 AWG, 18 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
93-6337-9744 |
товар відсутній
93-7069-9510 |
Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .010
Packaging: Spool
Diameter: 0.010" (0.25mm)
Wire Gauge: 30 AWG, 33 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .010
Packaging: Spool
Diameter: 0.010" (0.25mm)
Wire Gauge: 30 AWG, 33 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6326.14 грн |
5+ | 5525.07 грн |
10+ | 4958.37 грн |
25+ | 4254.43 грн |
96-6040-8832 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 500
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 500
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
96-6337-9515 |
Виробник: Kester Solder
Description: SN63PB37 3.3%/268 .015 500 G
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 26 AWG, 27 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN63PB37 3.3%/268 .015 500 G
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 26 AWG, 27 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 103 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8447.79 грн |
5+ | 7475.26 грн |
10+ | 7035.59 грн |
25+ | 6189.91 грн |
50+ | 5777.27 грн |
96-6337-9531 |
Виробник: Kester Solder
Description: SN63PB37 3.3%/268 .031 500 G
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 AWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN63PB37 3.3%/268 .031 500 G
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 AWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 158 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4729.3 грн |
5+ | 4130.72 грн |
10+ | 3707.01 грн |
25+ | 3180.69 грн |
50+ | 2981.9 грн |
100+ | 2783.11 грн |
96-7068-8820 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .020 500G
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .020 500G
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
96-7068-8832 |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 500
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 500
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товар відсутній
96-7069-9515 |
Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .015 5
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .015 5
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 333 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 12027.43 грн |
5+ | 10642.96 грн |
10+ | 10016.81 грн |
25+ | 8812.91 грн |
50+ | 8225.37 грн |
96-7069-9520 |
Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .020 5
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .020 5
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 212 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 10071.51 грн |
5+ | 8912.46 грн |
10+ | 8388.18 грн |
25+ | 7379.96 грн |
50+ | 6887.98 грн |
96-7069-9525 |
Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .025 5
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .025 5
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 41 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 10339.51 грн |
5+ | 9149.26 грн |
10+ | 8611.03 грн |
30+ | 7576.08 грн |
96-7069-9531 |
Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .031 5
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .031 5
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 9822.17 грн |
5+ | 8691.19 грн |
10+ | 8179.99 грн |
25+ | 7196.78 грн |
50+ | 6717.01 грн |
96-7069-9540 |
Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .040 5
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .040 5
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8094.68 грн |
5+ | 7162.98 грн |
10+ | 6741.78 грн |
96-9574-9515 |
Виробник: Kester Solder
Description: K100LD 3.3%/268 .015 500 G ROBO
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .015 500 G ROBO
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 111 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8663.54 грн |
5+ | 7665.77 грн |
10+ | 7214.81 грн |
25+ | 6347.67 грн |
50+ | 5924.49 грн |
96-9574-9520 |
Виробник: Kester Solder
Description: K100LD 3.3%/268 .020 500 G ROBO
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .020 500 G ROBO
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 143 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7445.2 грн |
5+ | 6502.32 грн |
10+ | 5835.41 грн |
25+ | 5006.93 грн |
50+ | 4694 грн |
100+ | 4381.07 грн |
96-9574-9525 |
Виробник: Kester Solder
Description: K100LD 3.3%/268 .025 500 G ROBO
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .025 500 G ROBO
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7370.54 грн |
5+ | 6437.05 грн |
10+ | 5776.82 грн |
30+ | 4956.61 грн |
50+ | 4646.85 грн |
100+ | 4337.05 грн |
96-9574-9531 |
Виробник: Kester Solder
Description: K100LD 3.3%/268 .031 500 G ROBO
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .031 500 G ROBO
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 51 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7012.95 грн |
5+ | 6125.2 грн |
10+ | 5496.96 грн |
25+ | 4716.51 грн |
50+ | 4421.74 грн |
96-9574-9540 |
Виробник: Kester Solder
Description: K100LD 3.3%/268 .040 500 G ROBO
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .040 500 G ROBO
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 98 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6682.24 грн |
5+ | 5913.12 грн |
10+ | 5565.18 грн |
30+ | 4896.29 грн |
50+ | 4569.88 грн |