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Виробник: Amphenol Aerospace Operations
Description: CAP ASSY
Packaging: Bulk

Виробник: Yazaki
Yazaki

Виробник: Yazaki
Yazaki

Виробник: Caplugs
Conduit Fittings & Accessories STC-08-PLUG TEO70 BLK002 MINI

Виробник: On Shore Technology Inc.
Description: TERM BLK 19P SIDE ENT 7.62MM PCB
Packaging: Bulk
Features: Interlocking (Side)
Color: Green
Mounting Type: Through Hole
Wire Gauge: 12-30 AWG
Pitch: 0.300" (7.62mm)
Mating Orientation: Horizontal with Board
Positions Per Level: 19
Wire Termination: Screw - Rising Cage Clamp
Current: 20 A
Number of Levels: 1
Voltage: 300 V

Виробник: Pflitsch
Description: CABLE GLAND MULT M25 PVDF
Packaging: Bag
Color: Opaque
Material: Polyvinylidene Fluoride (PVDF)
Thread Size: M25x1.5
Type: Cable Gland - Multiple Openings

Виробник: Pflitsch
Description: CABLE GLAND MULT M25 PVDF
Packaging: Bag
Color: Black
Material: Polyvinylidene Fluoride (PVDF)
Thread Size: M25x1.5
Type: Cable Gland - Multiple Openings

Виробник: Pflitsch
Description: CABLE GLAND MULT M25 BRASS
Packaging: Bag
Color: Silver
Material: Brass, Nickel Plated
Thread Size: M25x1.5
Type: Cable Gland - Multiple Openings
Includes: Sealing Ring

Виробник: Pflitsch
Description: CABLE GLAND MULT M25 S STEEL
Packaging: Bag
Color: Silver
Material: Stainless Steel
Thread Size: M25x1.5
Type: Cable Gland - Multiple Openings
Includes: Sealing Ring

Виробник: TE Connectivity / Raychem
Circular MIL Spec Strain Reliefs & Adapters TXR76AB00-1205AI

Виробник: Hirose Connector
D-Sub Standard Connectors

Виробник: Hirose Electric Co Ltd
Description: CONN D-SUB PLUG 15POS R/A SLDR
Packaging: Tray
Features: Board Lock
Connector Type: Plug, Male Pins
Contact Finish: Gold
Current Rating (Amps): 3A
Mounting Type: Panel Mount, Through Hole, Right Angle
Number of Positions: 15
Number of Rows: 2
Contact Type: Signal
Flange Feature: Housing/Shell (M2.6)
Termination: Solder
Connector Style: D-Sub
Contact Finish Thickness: 8.00µin (0.203µm)
Material Flammability Rating: UL94 V-0
Shell Material, Finish: Steel, Nickel Plated
Shell Size, Connector Layout: 2 (DA, A)
Part Status: Active

Виробник: NXP Semiconductors
S32K358GHT1VPCST

Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100