DF9-11S-1V(32) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
| Кількість | Ціна |
|---|---|
| 1000+ | 53.04 грн |
| 2000+ | 48.63 грн |
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Технічний опис DF9-11S-1V(32) Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Receptacle, Outer Shroud Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 11, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції DF9-11S-1V(32) за ціною від 41.08 грн до 74.09 грн
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DF9-11S-1V(32) | Hirose Electric Co Ltd |
Description: CONN RCPT 11POS SMD TIN Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Receptacle, Outer Shroud Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 11 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Part Status: Active Number of Rows: 2 |
на замовлення 2174 шт: термін постачання 21-31 дні (днів) |
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DF9-11S-1V(32) | Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING |
на замовлення 1213 шт: термін постачання 21-30 дні (днів) |
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| DF9-11S-1V(32) |
|
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 11POS SMD TIN
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
Description: CONN RCPT 11POS SMD TIN
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Receptacle, Outer Shroud Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 11
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
на замовлення 2174 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 71.20 грн |
| 10+ | 58.66 грн |
| 25+ | 55.01 грн |
| 50+ | 49.15 грн |
| 100+ | 46.80 грн |
| 250+ | 43.87 грн |
| 500+ | 41.08 грн |
| DF9-11S-1V(32) |
|
Виробник: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING
Board to Board & Mezzanine Connectors 1.0MM V SMT RECPT 11P TIN PLATING
на замовлення 1213 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 74.09 грн |
| 10+ | 62.27 грн |
| 25+ | 48.31 грн |
| 100+ | 47.12 грн |
| 250+ | 45.99 грн |
| 500+ | 44.87 грн |
| 1000+ | 43.53 грн |