Результат пошуку "ae1005" : 18
Вид перегляду :
Мінімальне замовлення: 4
Мінімальне замовлення: 3
Мінімальне замовлення: 3
Мінімальне замовлення: 2
-7.00-mm-x-5.00-mm.jpg "DSC1033AE1-005.0000")
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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A-CCS 028-Z-T | Assmann WSW Components |
 Description: CONN SOCKET PLCC 28POS TINFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (4 x 7) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 292 шт: термін постачання 21-31 дні (днів) |
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A-CCS 044-Z-T | Assmann WSW Components |
Description: CONN SOCKET PLCC 44POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 44 (4 x 11) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 4314 шт: термін постачання 21-31 дні (днів) |
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A-CCS 068-Z-T | Assmann WSW Components |
Description: CONN SOCKET PLCC 68POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 160.0µin (4.06µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 160.0µin (4.06µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 1760 шт: термін постачання 21-31 дні (днів) |
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AR 20-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 20POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
на замовлення 625 шт: термін постачання 21-31 дні (днів) |
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DSC1033AE1-005.0000 | Microchip Technology |
Description: MEMS OSC XO 5.0000MHZ CMOS SMD Packaging: Tube Package / Case: 4-SMD, No Lead Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 3.3V Current - Supply (Max): 3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 5 MHz Base Resonator: MEMS |
товар відсутній |
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DSC1033AE1-005.0000T | Microchip Technology |
Description: MEMS OSC XO 5.0000MHZ CMOS SMD Packaging: Tape & Reel (TR) Package / Case: 4-SMD, No Lead Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 3.3V Current - Supply (Max): 3mA (Typ) Height - Seated (Max): 0.035" (0.90mm) Frequency: 5 MHz Base Resonator: MEMS |
товар відсутній |
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DSC1122AE1-005.0000 | Microchip Technology |
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5 Packaging: Tube Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 58mA Height - Seated (Max): 0.035" (0.90mm) Absolute Pull Range (APR): ±50ppm Frequency: 5 MHz Base Resonator: MEMS |
товар відсутній |
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DSC1122AE1-005.0000 | Microchip Technology |
Description: MEMS OSC XO 5.0000MHZ LVPECL SMD Packaging: Strip Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.63V Current - Supply (Max): 58mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 5 MHz Base Resonator: MEMS |
товар відсутній |
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DSC1122AE1-005.0000T | Microchip Technology |
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5 Packaging: Strip Package / Case: 6-VDFN Exposed Pad Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: LVPECL Function: Enable/Disable Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Current - Supply (Max): 58mA Height - Seated (Max): 0.035" (0.90mm) Frequency: 5 MHz Base Resonator: MEMS |
товар відсутній |
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SI5386A-E10051-GM | Skyworks Solutions, Inc. |
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier |
товар відсутній |
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SI5386A-E10051-GMR | Skyworks Solutions, Inc. |
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier |
товар відсутній |
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A-CCS20-Z-R | Assmann WSW Components |
Description: CONN SOCKET PLCC 20POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 20 (4 x 5) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150.0µin (3.81µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150.0µin (3.81µm) Contact Material - Post: Phosphor Bronze |
товар відсутній |
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A-CCS32-Z-R | Assmann WSW Components |
Description: CONN SOCKET PLCC 32POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150.0µin (3.81µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150.0µin (3.81µm) Contact Material - Post: Phosphor Bronze |
товар відсутній |
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A-CCS52-Z-R | Assmann WSW Components |
Description: CONN SOCKET PLCC 52POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: PLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 52 (4 x 13) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150.0µin (3.81µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 150.0µin (3.81µm) Contact Material - Post: Phosphor Bronze |
товар відсутній |
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AK430-3 | Assmann WSW Components |
Description: CABLE CENTRONICS M-F 3M Packaging: Bulk Length: 9.84' (3.00m) Shielding: Shielded Style: Bidirectional Configuration: Centronics 36 pos Female to Male Cable Type: Round, Beige |
товар відсутній |
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AR 24-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товар відсутній |
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AR 28-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товар відсутній |
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AR 40-HZW/TN | Assmann WSW Components |
Description: CONN IC DIP SOCKET 40POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Wire Wrap Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper |
товар відсутній |
| A-CCS 028-Z-T |
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Виробник: Assmann WSW Components
Description: CONN SOCKET PLCC 28POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET PLCC 28POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 292 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 95.57 грн |
| 10+ | 77.77 грн |
| 33+ | 74.58 грн |
| 66+ | 68.5 грн |
| 132+ | 65.52 грн |
| 264+ | 59.56 грн |
| A-CCS 044-Z-T |
|
Виробник: Assmann WSW Components
Description: CONN SOCKET PLCC 44POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 44 (4 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET PLCC 44POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 44 (4 x 11)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 4314 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 107.78 грн |
| 10+ | 89.95 грн |
| 25+ | 86.13 грн |
| 50+ | 79.03 грн |
| 100+ | 75.44 грн |
| 250+ | 68.25 грн |
| 500+ | 61.83 грн |
| 1000+ | 53 грн |
| 2500+ | 49.47 грн |
| A-CCS 068-Z-T |
|
Виробник: Assmann WSW Components
Description: CONN SOCKET PLCC 68POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: CONN SOCKET PLCC 68POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 1760 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 139.4 грн |
| 19+ | 116.72 грн |
| 38+ | 111.75 грн |
| 57+ | 102.54 грн |
| 114+ | 97.88 грн |
| 266+ | 88.55 грн |
| 513+ | 80.23 грн |
| 1007+ | 68.77 грн |
| AR 20-HZW/TN |
|
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
на замовлення 625 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 148.74 грн |
| 24+ | 124.72 грн |
| 48+ | 116.75 грн |
| 120+ | 104.58 грн |
| 264+ | 94.62 грн |
| 504+ | 87.15 грн |
| DSC1033AE1-005.0000 |
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Виробник: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
товар відсутній
| DSC1033AE1-005.0000T |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 5.0000MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
товар відсутній
| DSC1122AE1-005.0000 |
|
Виробник: Microchip Technology
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Tube
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Absolute Pull Range (APR): ±50ppm
Frequency: 5 MHz
Base Resonator: MEMS
товар відсутній
| DSC1122AE1-005.0000 |
|
Виробник: Microchip Technology
Description: MEMS OSC XO 5.0000MHZ LVPECL SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 5.0000MHZ LVPECL SMD
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
товар відсутній
| DSC1122AE1-005.0000T |
|
Виробник: Microchip Technology
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
Description: MEMS OSC 5MHZ LVPECL 50PPM 7.0X5
Packaging: Strip
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 5 MHz
Base Resonator: MEMS
товар відсутній
| SI5386A-E10051-GM |
|
Виробник: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
товар відсутній
| SI5386A-E10051-GMR |
|
Виробник: Skyworks Solutions, Inc.
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
Clock Synthesizer/Jitter Cleaner Ultra-low phase noise, wireless jitter attenuating clock multiplier
товар відсутній
| A-CCS20-Z-R |
|
Виробник: Assmann WSW Components
Description: CONN SOCKET PLCC 20POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET PLCC 20POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
| A-CCS32-Z-R |
|
Виробник: Assmann WSW Components
Description: CONN SOCKET PLCC 32POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET PLCC 32POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
| A-CCS52-Z-R |
|
Виробник: Assmann WSW Components
Description: CONN SOCKET PLCC 52POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 52 (4 x 13)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Description: CONN SOCKET PLCC 52POS TIN
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 52 (4 x 13)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150.0µin (3.81µm)
Contact Material - Post: Phosphor Bronze
товар відсутній
| AK430-3 |
Виробник: Assmann WSW Components
Description: CABLE CENTRONICS M-F 3M
Packaging: Bulk
Length: 9.84' (3.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
Description: CABLE CENTRONICS M-F 3M
Packaging: Bulk
Length: 9.84' (3.00m)
Shielding: Shielded
Style: Bidirectional
Configuration: Centronics 36 pos Female to Male
Cable Type: Round, Beige
товар відсутній
| AR 24-HZW/TN |
|
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
| AR 28-HZW/TN |
|
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній
| AR 40-HZW/TN |
|
Виробник: Assmann WSW Components
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
товар відсутній