BDN09-3CB CTS Thermal Management Products
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Виробник: CTS Thermal Management ProductsDescription: HEATSINK CPU .91" SQ
Packaging: Box
Material: Aluminum
Length: 0.910" (23.11mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.910" (23.11mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM
Thermal Resistance @ Natural: 26.90°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
на замовлення 513 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 99.66 грн |
| 10+ | 91.38 грн |
| 25+ | 88.99 грн |
| 50+ | 81.25 грн |
| 100+ | 76.74 грн |
| 250+ | 72.22 грн |
| 500+ | 66.6 грн |
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Технічний опис BDN09-3CB CTS Thermal Management Products
Description: HEATSINK CPU .91" SQ, Packaging: Box, Material: Aluminum, Length: 0.910" (23.11mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.910" (23.11mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 400 LFM, Thermal Resistance @ Natural: 26.90°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized.