CC9601031PAG3 Canfield Technologies
Виробник: Canfield Technologies
Description: SAC 305 NO CLEAN 1 LB. .031 DIA
Packaging: Spool
Part Status: Active
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SAC 305 NO CLEAN 1 LB. .031 DIA
Packaging: Spool
Part Status: Active
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6455.54 грн |
Відгуки про товар
Написати відгук
Технічний опис CC9601031PAG3 Canfield Technologies
Description: SAC 305 NO CLEAN 1 LB. .031 DIA, Packaging: Spool, Part Status: Active, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 22 SWG, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 423 ~ 424°F (217 ~ 218°C), Form: Spool, 1 lb (453.59g), Process: Lead Free, Flux Type: No-Clean, Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C), Shelf Life Start: Date of Manufacture, Shelf Life: 24 Months.