CN0073 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: USB - C (USB 3.1 GEN 2, SUPERSPE
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: Connector to DIP
Package Accepted: USB - C
Part Status: Active
Description: USB - C (USB 3.1 GEN 2, SUPERSPE
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: Connector to DIP
Package Accepted: USB - C
Part Status: Active
на замовлення 65 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 1436.38 грн |
Відгуки про товар
Написати відгук
Технічний опис CN0073 Chip Quik Inc.
Description: USB - C (USB 3.1 GEN 2, SUPERSPE, Packaging: Bulk, Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 24, Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: Connector to DIP, Package Accepted: USB - C, Part Status: Active.