CP788X-BC556B-WR Central Semiconductor Corp
Виробник: Central Semiconductor Corp
Description: TRANS PNP DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Supplier Device Package: Die
Part Status: Active
Description: TRANS PNP DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Supplier Device Package: Die
Part Status: Active
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Технічний опис CP788X-BC556B-WR Central Semiconductor Corp
Description: TRANS PNP DIE, Packaging: Tray, Package / Case: Die, Mounting Type: Surface Mount, Supplier Device Package: Die, Part Status: Active.