D17760BP200ADQ Renesas Electronics America Inc
Виробник: Renesas Electronics America Inc
Description: 32-BIT, 200MHZ, SH4 CPU
Packaging: Bulk
Package / Case: 256-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: SH-4
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: Audio Codec, CANbus, EBI/EMI, FIFO, I²C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
Peripherals: DMA, LCD, POR, WDT
Supplier Device Package: 256-LFBGA (17x17)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: 32-BIT, 200MHZ, SH4 CPU
Packaging: Bulk
Package / Case: 256-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: SH-4
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: Audio Codec, CANbus, EBI/EMI, FIFO, I²C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
Peripherals: DMA, LCD, POR, WDT
Supplier Device Package: 256-LFBGA (17x17)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
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Технічний опис D17760BP200ADQ Renesas Electronics America Inc
Description: 32-BIT, 200MHZ, SH4 CPU, Packaging: Bulk, Package / Case: 256-LFBGA, Mounting Type: Surface Mount, Speed: 200MHz, RAM Size: 48K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: SH-4, Data Converters: A/D 4x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V, Connectivity: Audio Codec, CANbus, EBI/EMI, FIFO, I²C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB, Peripherals: DMA, LCD, POR, WDT, Supplier Device Package: 256-LFBGA (17x17), Part Status: Active, Number of I/O: 69, DigiKey Programmable: Not Verified.