DE02018 Dreyer Electronics LLC
Виробник: Dreyer Electronics LLCDescription: SOP-18/SSOP-18/SOIC-18 TO DIP-18
Packaging: Bag
Size / Dimension: 0.905" L x 0.744" W (23.00mm x 18.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
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Технічний опис DE02018 Dreyer Electronics LLC
Description: SOP-18/SSOP-18/SOIC-18 TO DIP-18, Packaging: Bag, Size / Dimension: 0.905" L x 0.744" W (23.00mm x 18.90mm), Material: FR4 Epoxy Glass, Number of Positions: 18, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, SOP, SSOP, Part Status: Active.