DE02020 Dreyer Electronics LLC
Виробник: Dreyer Electronics LLCDescription: SOP-20/SSOP-20/SOIC-20 TO DIP-20
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
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Технічний опис DE02020 Dreyer Electronics LLC
Description: SOP-20/SSOP-20/SOIC-20 TO DIP-20, Packaging: Bag, Material: FR4 Epoxy Glass, Number of Positions: 20, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, SOP, SSOP, Part Status: Active.