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DPAF-08-03.0-H-3-2-A Samtec Inc.

dpaf-xx-03.0-x-x-x-xx%20footprint.pdf Виробник: Samtec Inc.
Description: CONN DIFF ARRAY RCP 36P SMD GOLD
Packaging: Tray
Features: Board Guide
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 36 Signal (18 Pair)
Pitch: 0.085" (2.16mm)
Height Above Board: 0.254" (6.45mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 10mm, 14mm, 17mm
Number of Rows: 3
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Технічний опис DPAF-08-03.0-H-3-2-A Samtec Inc.

Description: CONN DIFF ARRAY RCP 36P SMD GOLD, Packaging: Tray, Features: Board Guide, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 36 Signal (18 Pair), Pitch: 0.085" (2.16mm), Height Above Board: 0.254" (6.45mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 10mm, 14mm, 17mm, Number of Rows: 3.