DR100DR254P18 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: DUAL ROW 1.00MM PITCH 18-PIN TO
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: 1mm Connector
Part Status: Active
Description: DUAL ROW 1.00MM PITCH 18-PIN TO
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: 1mm Connector
Part Status: Active
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Технічний опис DR100DR254P18 Chip Quik Inc.
Description: DUAL ROW 1.00MM PITCH 18-PIN TO, Packaging: Bulk, Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 18, Pitch: 0.039" (1.00mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: 1mm Connector, Part Status: Active.