FTMH-110-03-H-DV Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD 20POS 1MM
Packaging: Tube
Connector Type: Header
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.039" (1.00mm)
Contact Length - Mating: 0.065" (1.65mm)
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 711.36 грн |
| 10+ | 616.24 грн |
| 100+ | 550.77 грн |
Відгуки про товар
Написати відгук
Технічний опис FTMH-110-03-H-DV Samtec Inc.
Description: CONN HEADER SMD 20POS 1MM, Packaging: Tube, Connector Type: Header, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Part Status: Active, Contact Shape: Square, Insulation Height: 0.059" (1.50mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.039" (1.00mm), Contact Length - Mating: 0.065" (1.65mm).