HPF-12-01-TM-S Samtec Inc.
Виробник: Samtec Inc.
Description: .200 HI POWER SOCKET ASSEMBLY
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.102" (2.60mm)
Insulation Height: 0.351" (8.92mm)
Number of Rows: 1
Description: .200 HI POWER SOCKET ASSEMBLY
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.102" (2.60mm)
Insulation Height: 0.351" (8.92mm)
Number of Rows: 1
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Технічний опис HPF-12-01-TM-S Samtec Inc.
Description: .200 HI POWER SOCKET ASSEMBLY, Packaging: Bulk, Connector Type: Receptacle, Mounting Type: Through Hole, Number of Positions: 12, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.200" (5.08mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.102" (2.60mm), Insulation Height: 0.351" (8.92mm), Number of Rows: 1.