ME-XU9-4CG-1E-D11E-R3.0 Enclustra FPGA Solutions
Виробник: Enclustra FPGA Solutions
Description: SOM XU9 ZYNQ 4CG REV2.1
Packaging: Bulk
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1FBVB900E
Flash Size: 16GB
Description: SOM XU9 ZYNQ 4CG REV2.1
Packaging: Bulk
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1FBVB900E
Flash Size: 16GB
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Технічний опис ME-XU9-4CG-1E-D11E-R3.0 Enclustra FPGA Solutions
Description: SOM XU9 ZYNQ 4CG REV2.1, Packaging: Bulk, Connector Type: 168 Pin, Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm), RAM Size: 2GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, Co-Processor: Xilinx Zynq UltraScale+ XCZU4CG-1FBVB900E, Flash Size: 16GB.