| Фото | Назва | Виробник | Інформація |
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XC7VX485T-1FFG1761I | AMD |
 Description: IC FPGA 700 I/O 1761FCBGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1761-FCBGA (42.5x42.5) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 700 DigiKey Programmable: Not Verified |
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XC7VX485T-1FFG1927C | AMD |
Description: IC FPGA 600 I/O 1927FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1927-FCBGA (45x45) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX485T-1FFG1927I | AMD |
Description: IC FPGA 600 I/O 1927FCBGA |
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XC7VX485T-1FFG1930C | AMD |
Description: IC FPGA 700 I/O 1930FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1930-FCBGA (45x45) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 700 DigiKey Programmable: Not Verified |
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XC7VX485T-1FFG1930I | AMD |
Description: IC FPGA 700 I/O 1930FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1930-FCBGA (45x45) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 700 DigiKey Programmable: Not Verified |
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XC7VX485T-2FF1157C | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX485T-2FFG1157C | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX690T-1FFG1157I | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX690T-1FFG1158C | AMD |
Description: IC FPGA 350 I/O 1158FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1158-FCBGA (35x35) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 350 DigiKey Programmable: Not Verified |
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XC7VX690T-1FFG1761C | AMD |
Description: IC FPGA 850 I/O 1761FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1761-FCBGA (42.5x42.5) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Part Status: Active Number of I/O: 850 |
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XC7VX690T-1FFG1930C | AMD |
Description: IC FPGA 1000 I/O 1930FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1930-FCBGA (45x45) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 1000 DigiKey Programmable: Not Verified |
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XC7VX415T-3FFG1157E | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 412160 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 32200 Total RAM Bits: 32440320 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX690T-1FFG1930I | AMD |
Description: IC FPGA 1000 I/O 1930FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1930-FCBGA (45x45) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 1000 DigiKey Programmable: Not Verified |
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XC7VX690T-2FF1930I | AMD |
Description: IC FPGA 1000 I/O 1930FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1930-FCBGA (45x45) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 1000 DigiKey Programmable: Not Verified |
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XC7VX690T-2FFG1157C | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX690T-2FFG1157I | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX690T-2FFG1158C | AMD |
Description: IC FPGA 350 I/O 1158FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1158-FCBGA (35x35) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 350 DigiKey Programmable: Not Verified |
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XC7VX690T-2FFG1158I | AMD |
Description: IC FPGA 350 I/O 1158FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 693120 Supplier Device Package: 1158-FCBGA (35x35) Number of LABs/CLBs: 54150 Total RAM Bits: 54190080 Number of I/O: 350 DigiKey Programmable: Not Verified |
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XC7VX330T-2FFG1761C | AMD |
Description: IC FPGA 700 I/O 1761FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1761-FCBGA (42.5x42.5) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 700 DigiKey Programmable: Not Verified |
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XC7VX330T-2FFG1761I | AMD |
Description: IC FPGA 700 I/O 1761FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1761-FCBGA (42.5x42.5) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 700 DigiKey Programmable: Not Verified |
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XC7VX330T-3FFG1157E | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX330T-3FFG1761E | AMD |
Description: IC FPGA 700 I/O 1761FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1761-FCBGA (42.5x42.5) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 700 DigiKey Programmable: Not Verified |
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XC7VX415T-1FFG1157C | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 412160 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 32200 Total RAM Bits: 32440320 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX415T-1FFG1157I | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 412160 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 32200 Total RAM Bits: 32440320 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX415T-1FFG1158I | AMD |
Description: IC FPGA 350 I/O 1158FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 412160 Supplier Device Package: 1158-FCBGA (35x35) Number of LABs/CLBs: 32200 Total RAM Bits: 32440320 Number of I/O: 350 DigiKey Programmable: Not Verified |
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XC7VX485T-1FF1157I | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX485T-1FFG1157C | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7V2000T-1FLG1925C | AMD |
Description: IC FPGA 1200 I/O 1925FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 1954560 Supplier Device Package: 1925-FCBGA (45x45) Number of LABs/CLBs: 152700 Total RAM Bits: 47628288 Part Status: Active Number of I/O: 1200 DigiKey Programmable: Not Verified |
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XC7VX330T-1FFG1157C | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX330T-1FFG1157I | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX330T-1FFG1761I | AMD |
Description: IC FPGA 700 I/O 1761FCBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1761-FCBGA (42.5x42.5) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 700 DigiKey Programmable: Not Verified |
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XC7VX330T-2FFG1157C | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7VX330T-2FFG1157I | AMD |
Description: IC FPGA 600 I/O 1157FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 326400 Supplier Device Package: 1157-FCBGA (35x35) Number of LABs/CLBs: 25500 Total RAM Bits: 27648000 Number of I/O: 600 DigiKey Programmable: Not Verified |
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XC7Z010-2CLG400I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 128 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-1CLG400C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA |
на замовлення 1162 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-1CLG484C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 1383 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-1CLG484I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 368 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-2CLG400I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 1216 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-2CLG484E | AMD |
Description: IC SOC CORTEX-A9 766MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 120 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-2CLG484I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 401 шт: термін постачання 21-31 дні (днів) |
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XC7Z020-3CLG484E | AMD |
Description: IC SOC CORTEX-A9 866MHZ 484BGA Packaging: Tray Package / Case: 484-LFBGA, CSPBGA Speed: 866MHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 85K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-CSPBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 243 шт: термін постачання 21-31 дні (днів) |
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XC7Z030-1FBG484C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 164 шт: термін постачання 21-31 дні (днів) |
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XC7Z030-1FBG484I | AMD |
Description: IC SOC CORTEX-A9 667MHZ 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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XC7Z030-1FBG676C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 676-FCBGA (27x27) Architecture: MCU, FPGA Part Status: Active |
на замовлення 369 шт: термін постачання 21-31 дні (днів) |
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XC7Z030-1FFG676C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 676-FCBGA (27x27) Architecture: MCU, FPGA Part Status: Active |
на замовлення 81 шт: термін постачання 21-31 дні (днів) |
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XC7Z030-2FBG484I | AMD |
Description: IC SOC CORTEX-A9 800MHZ 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Speed: 800MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XC7Z030-2FFG676I | AMD |
Description: IC SOC CORTEX-A9 800MHZ 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Speed: 800MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 676-FCBGA (27x27) Architecture: MCU, FPGA Part Status: Active |
на замовлення 927 шт: термін постачання 21-31 дні (днів) |
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XC7Z030-3FBG484E | AMD |
Description: IC SOC CORTEX-A9 1GHZ 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Speed: 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 484-FCBGA (23x23) Architecture: MCU, FPGA |
товар відсутній |
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XC7Z045-1FFG676C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 676-FCBGA (27x27) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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XC7Z045-1FFG900C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
товар відсутній |
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XC7Z045-2FFG676I | AMD |
Description: IC SOC CORTEX-A9 800MHZ 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Speed: 800MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 676-FCBGA (27x27) Architecture: MCU, FPGA Part Status: Active |
на замовлення 111 шт: термін постачання 21-31 дні (днів) |
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XC7A200T-2FBG676I | AMD |
Description: IC FPGA 400 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 400 DigiKey Programmable: Not Verified |
на замовлення 521 шт: термін постачання 21-31 дні (днів) |
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XC7Z045-2FFG900I | AMD |
Description: IC SOC CORTEX-A9 800MHZ 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 800MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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XC7A200T-2FFG1156C | AMD |
Description: IC FPGA 500 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 500 DigiKey Programmable: Not Verified |
на замовлення 105 шт: термін постачання 21-31 дні (днів) |
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XC7A200T-3FBG484E | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (23x23) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 285 DigiKey Programmable: Not Verified |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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XC7A200T-3FFG1156E | AMD |
Description: IC FPGA 500 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 500 DigiKey Programmable: Not Verified |
на замовлення 82 шт: термін постачання 21-31 дні (днів) |
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XC7VX485T-1FFG1158C | AMD |
Description: IC FPGA 350 I/O 1158FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 485760 Supplier Device Package: 1158-FCBGA (35x35) Number of LABs/CLBs: 37950 Total RAM Bits: 37969920 Number of I/O: 350 DigiKey Programmable: Not Verified |
товар відсутній |
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XC7Z010-1CLG225C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
на замовлення 603 шт: термін постачання 21-31 дні (днів) |
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XC7Z010-1CLG400C | AMD |
Description: IC SOC CORTEX-A9 667MHZ 400BGA Packaging: Tray Package / Case: 400-LFBGA, CSPBGA Speed: 667MHz RAM Size: 256KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 400-CSPBGA (17x17) Architecture: MCU, FPGA Part Status: Active |
на замовлення 1005 шт: термін постачання 21-31 дні (днів) |
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XC7Z010-2CLG225I | AMD |
Description: IC SOC CORTEX-A9 766MHZ 225BGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Speed: 766MHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Supplier Device Package: 225-CSPBGA (13x13) Architecture: MCU, FPGA Part Status: Active |
на замовлення 390 шт: термін постачання 21-31 дні (днів) |
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| XC7VX485T-1FFG1761I |
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Виробник: AMD
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 700
DigiKey Programmable: Not Verified
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 700
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX485T-1FFG1927C |
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Виробник: AMD
Description: IC FPGA 600 I/O 1927FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1927-FCBGA (45x45)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1927FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1927-FCBGA (45x45)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX485T-1FFG1930C |
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Виробник: AMD
Description: IC FPGA 700 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 700
DigiKey Programmable: Not Verified
Description: IC FPGA 700 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 700
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX485T-1FFG1930I |
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Виробник: AMD
Description: IC FPGA 700 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 700
DigiKey Programmable: Not Verified
Description: IC FPGA 700 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 700
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX485T-2FF1157C |
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Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX485T-2FFG1157C |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-1FFG1157I |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-1FFG1158C |
|
Виробник: AMD
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 350
DigiKey Programmable: Not Verified
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 350
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-1FFG1761C |
|
Виробник: AMD
Description: IC FPGA 850 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Part Status: Active
Number of I/O: 850
Description: IC FPGA 850 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Part Status: Active
Number of I/O: 850
товар відсутній
| XC7VX690T-1FFG1930C |
|
Виробник: AMD
Description: IC FPGA 1000 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 1000
DigiKey Programmable: Not Verified
Description: IC FPGA 1000 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 1000
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX415T-3FFG1157E |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-1FFG1930I |
|
Виробник: AMD
Description: IC FPGA 1000 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 1000
DigiKey Programmable: Not Verified
Description: IC FPGA 1000 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 1000
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-2FF1930I |
|
Виробник: AMD
Description: IC FPGA 1000 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 1000
DigiKey Programmable: Not Verified
Description: IC FPGA 1000 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 1000
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-2FFG1157C |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-2FFG1157I |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-2FFG1158C |
|
Виробник: AMD
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 350
DigiKey Programmable: Not Verified
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 350
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX690T-2FFG1158I |
|
Виробник: AMD
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 350
DigiKey Programmable: Not Verified
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 693120
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 54150
Total RAM Bits: 54190080
Number of I/O: 350
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-2FFG1761C |
|
Виробник: AMD
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-2FFG1761I |
|
Виробник: AMD
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-3FFG1157E |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-3FFG1761E |
|
Виробник: AMD
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX415T-1FFG1157C |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX415T-1FFG1157I |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX415T-1FFG1158I |
|
Виробник: AMD
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 350
DigiKey Programmable: Not Verified
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 412160
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 32200
Total RAM Bits: 32440320
Number of I/O: 350
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX485T-1FF1157I |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX485T-1FFG1157C |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7V2000T-1FLG1925C |
|
Виробник: AMD
Description: IC FPGA 1200 I/O 1925FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 1954560
Supplier Device Package: 1925-FCBGA (45x45)
Number of LABs/CLBs: 152700
Total RAM Bits: 47628288
Part Status: Active
Number of I/O: 1200
DigiKey Programmable: Not Verified
Description: IC FPGA 1200 I/O 1925FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 1954560
Supplier Device Package: 1925-FCBGA (45x45)
Number of LABs/CLBs: 152700
Total RAM Bits: 47628288
Part Status: Active
Number of I/O: 1200
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-1FFG1157C |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-1FFG1157I |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-1FFG1761I |
|
Виробник: AMD
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
Description: IC FPGA 700 I/O 1761FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1761-FCBGA (42.5x42.5)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 700
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-2FFG1157C |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7VX330T-2FFG1157I |
|
Виробник: AMD
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1157FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 326400
Supplier Device Package: 1157-FCBGA (35x35)
Number of LABs/CLBs: 25500
Total RAM Bits: 27648000
Number of I/O: 600
DigiKey Programmable: Not Verified
товар відсутній
| XC7Z010-2CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 128 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7062.83 грн |
| XC7Z020-1CLG400C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
на замовлення 1162 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9649.82 грн |
| XC7Z020-1CLG484C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 1383 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9899.34 грн |
| XC7Z020-1CLG484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 368 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 11350.3 грн |
| XC7Z020-2CLG400I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 1216 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 11862.15 грн |
| XC7Z020-2CLG484E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 120 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12386.08 грн |
| XC7Z020-2CLG484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 401 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13056.47 грн |
| XC7Z020-3CLG484E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 866MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 866MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 866MHZ 484BGA
Packaging: Tray
Package / Case: 484-LFBGA, CSPBGA
Speed: 866MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 243 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14239.41 грн |
| XC7Z030-1FBG484C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 164 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 18320.71 грн |
| XC7Z030-1FBG484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 21420.26 грн |
| XC7Z030-1FBG676C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 369 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 20481.15 грн |
| XC7Z030-1FFG676C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 81 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25362.93 грн |
| XC7Z030-2FBG484I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 800MHZ 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 26385.21 грн |
| XC7Z030-2FFG676I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 800MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 927 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36951.38 грн |
| XC7Z030-3FBG484E |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 1GHZ 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Speed: 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1GHZ 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Speed: 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (23x23)
Architecture: MCU, FPGA
товар відсутній
| XC7Z045-1FFG676C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XC7Z045-1FFG900C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 667MHZ 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
товар відсутній
| XC7Z045-2FFG676I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 800MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 676-FCBGA (27x27)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 111 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 168518.43 грн |
| XC7A200T-2FBG676I |
|
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
на замовлення 521 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25601.79 грн |
| XC7Z045-2FFG900I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 800MHZ 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 44 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 193799.62 грн |
| XC7A200T-2FFG1156C |
|
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 105 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25003.92 грн |
| XC7A200T-3FBG484E |
|
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
на замовлення 32 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25003.92 грн |
| XC7A200T-3FFG1156E |
|
Виробник: AMD
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 82 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33111.08 грн |
| XC7VX485T-1FFG1158C |
|
Виробник: AMD
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 350
DigiKey Programmable: Not Verified
Description: IC FPGA 350 I/O 1158FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 485760
Supplier Device Package: 1158-FCBGA (35x35)
Number of LABs/CLBs: 37950
Total RAM Bits: 37969920
Number of I/O: 350
DigiKey Programmable: Not Verified
товар відсутній
| XC7Z010-1CLG225C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 603 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5035.33 грн |
| XC7Z010-1CLG400C |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 1005 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5339.6 грн |
| XC7Z010-2CLG225I |
|
Виробник: AMD
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 766MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 390 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6497.66 грн |