| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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|---|---|---|---|---|---|---|---|
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XC5215-5PQG160C | AMD |
 Description: FPGA, 484 CLBS, 15000 GATESPackaging: Bulk Package / Case: 160-BQFP Mounting Type: Surface Mount Number of Gates: 23000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1936 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 484 Number of I/O: 133 DigiKey Programmable: Not Verified |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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XC5215-6HQ208C | AMD |
Description: FPGA, 484 CLBS, 15000 GATES Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 23000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1936 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 484 Number of I/O: 164 DigiKey Programmable: Not Verified |
на замовлення 773 шт: термін постачання 21-31 дні (днів) |
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XC5215-5HQ208CO359 | AMD |
Description: FPGA, 324 CLBS, 10000 GATES Packaging: Bulk DigiKey Programmable: Not Verified Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 23000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1936 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 484 Number of I/O: 164 |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
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XC5215-5BG225CO359 | AMD |
Description: FPGA, 324 CLBS, 10000 GATES Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 225-BEBGA Mounting Type: Surface Mount Number of Gates: 23000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1936 Supplier Device Package: 225-PBGA (27x27) Number of LABs/CLBs: 484 Number of I/O: 196 |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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XC5215-6HQ208I | AMD |
Description: FPGA, 484 CLBS, 15000 GATES Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 23000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Logic Elements/Cells: 1936 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 484 Number of I/O: 164 DigiKey Programmable: Not Verified |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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A-U200-P64G-PQ-G | AMD |
Description: BOARD DCAB SERVER U200 PASSIVE Packaging: Box Power (Watts): 225W Memory Size: 64GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 77GB/s Cooling Type: Heat Sink LUTs: 892k INT8 TOPs: 18.6 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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XC7A25T-2CSG325I | AMD |
Description: IC FPGA 150 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TA) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Part Status: Active Number of I/O: 150 DigiKey Programmable: Not Verified |
на замовлення 685 шт: термін постачання 21-31 дні (днів) |
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XC6SLX150T-2FGG484I | AMD |
Description: IC FPGA 296 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 147443 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 11519 Total RAM Bits: 4939776 Part Status: Active Number of I/O: 296 DigiKey Programmable: Not Verified |
товар відсутній |
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| HW-MUSB-3090122 | AMD |
Description: CABLE USB A MALE TO USB B U280 Packaging: Bag Accessory Type: Cable Assembly |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| XC95144-10PQG160I4307 | AMD |
Description: XC95144 IN SYSTEM PROGRAMMABLE C Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
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XC2S50-6FGG256C | AMD |
Description: IC FPGA 176 I/O 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Number of Gates: 50000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 1728 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 384 Total RAM Bits: 32768 Number of I/O: 176 DigiKey Programmable: Not Verified |
товар відсутній |
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XC17S150XLSO20C | AMD |
Description: CONFIG MEMORY, 1M BITS, SERIAL Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 550 шт: термін постачання 21-31 дні (днів) |
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| XCVU9P-1FLGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2586150 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 147780 Total RAM Bits: 391168000 Number of I/O: 702 DigiKey Programmable: Not Verified |
товар відсутній |
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| XCVU9P-1FLGB2104I | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2586150 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 147780 Total RAM Bits: 391168000 Number of I/O: 702 DigiKey Programmable: Not Verified |
товар відсутній |
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| XCVU9P-2FLGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2586150 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 147780 Total RAM Bits: 391168000 Number of I/O: 702 DigiKey Programmable: Not Verified |
товар відсутній |
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| XCVU9P-2FLGB2104I | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2586150 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 147780 Total RAM Bits: 391168000 Number of I/O: 702 DigiKey Programmable: Not Verified |
товар відсутній |
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EK-U1-ZCU106-G-ED | AMD |
Description: KIT EVAL ZYNQUS+ MPSOC ZCU106 ED Packaging: Box For Use With/Related Products: XCZU7EV Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply Platform: Zynq UltraScale+ MPSoC ZCU106 Encryption Disabled PCIe Card Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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XAZU5EV-1SFVC784I | AMD |
Description: IC FPGA SOC ZU EV Q100 784SBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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| XCV400-4HQ240C | AMD |
Description: IC FPGA 166 I/O 240QFP Packaging: Bulk Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 468252 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 10800 Supplier Device Package: 240-PQFP (32x32) Number of LABs/CLBs: 2400 Total RAM Bits: 81920 Part Status: Obsolete Number of I/O: 166 DigiKey Programmable: Not Verified |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| XCV400-5HQ240I | AMD |
Description: IC FPGA 166 I/O 240QFP Packaging: Bulk Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 468252 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 10800 Supplier Device Package: 240-PQFP (32x32) Number of LABs/CLBs: 2400 Total RAM Bits: 81920 Part Status: Obsolete Number of I/O: 166 DigiKey Programmable: Not Verified |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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XCR3256XL-12PQ208I | AMD |
Description: IC CPLD 256MC 10.8NS 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 6000 Number of Macrocells: 256 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 10.8 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 2.7V ~ 3.6V Part Status: Obsolete Number of I/O: 164 |
товар відсутній |
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XCR3256XL-10PQ208C | AMD |
Description: IC CPLD 256MC 9NS 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 6000 Number of Macrocells: 256 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Obsolete Number of I/O: 164 |
товар відсутній |
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XCR3256XL-10PQ208I | AMD |
Description: IC CPLD 256MC 9NS 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 6000 Number of Macrocells: 256 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 2.7V ~ 3.6V Part Status: Obsolete Number of I/O: 164 |
товар відсутній |
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| XCR3256XL-10CS280I | AMD |
Description: IC CPLD 256MC 9.1NS 280CSBGA Packaging: Bulk Package / Case: 280-TFBGA, CSPBGA Mounting Type: Surface Mount Programmable Type: In System Programmable (min 1K program/erase cycles) Number of Gates: 6000 Number of Macrocells: 256 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 280-CSBGA (16x16) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 2.7V ~ 3.6V Number of I/O: 164 DigiKey Programmable: Not Verified |
товар відсутній |
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| EK-U1-ZCU208-G | AMD |
Description: ZYNQ US+ RFSOC ZCU208 EVK Packaging: Box For Use With/Related Products: XCZU48DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ RFSoC ZCU208 Part Status: Obsolete |
товар відсутній |
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EK-U1-ZCU208-V1-G | AMD |
Description: ZYNQ US+ RFSOC ZCU208 V1 EVK Packaging: Box For Use With/Related Products: XCZU48DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ RFSoC ZCU208 V1 Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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| EK-U1-ZCU208-V1-G-J | AMD |
Description: ZYNQ US+ RFSOC ZCU208 V1 J EVK Packaging: Box For Use With/Related Products: XCZU48DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ RFSoC ZCU208 V1 Japan |
товар відсутній |
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| XC3195-5PC84C0090 | AMD |
Description: FPGA, 484 CLBS, 6500 GATES Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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XCZU7CG-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7CG-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7CG-L1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7CG-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU7CG-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XC4062XL-3HQ240C0624 | AMD |
Description: FPGA, 2304 CLBS, 40000 GATES Packaging: Bulk Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 40000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 5472 Supplier Device Package: 240-PQFP (32x32) Number of LABs/CLBs: 2304 Total RAM Bits: 73728 Part Status: Active Number of I/O: 193 DigiKey Programmable: Not Verified |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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XC5210-5PQG208C | AMD |
Description: FPGA, 324 CLBS, 10000 GATES Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 16000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1296 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 324 Number of I/O: 164 DigiKey Programmable: Not Verified |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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| EF-VIVADO-ENTER-NL | AMD |
Description: VIVADO ENTERPRISE NODE-LOCKED Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: Integrated Software Environment (ISE) Applications: Programming Operating System: Linux, Windows Edition: Enterprise License - User Details: Fixed Node Media Delivery Type: Electronically Delivered |
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XC1765ELPC20C | AMD |
Description: IC PROM SER C-TEMP 3.3V 20-PLCC Packaging: Tube Package / Case: 20-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-PLCC (9x9) DigiKey Programmable: Not Verified |
на замовлення 4238 шт: термін постачання 21-31 дні (днів) |
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XC1765ELVOG8C | AMD |
Description: IC 3V SER CFG PROM 65K 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
на замовлення 6809 шт: термін постачання 21-31 дні (днів) |
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| XC95144XV-5TQG100C | AMD |
Description: FLASH PLD, 5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товар відсутній |
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XC95144XV-7CSG144C | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 978 шт: термін постачання 21-31 дні (днів) |
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| XC95144XV-7TQ144I | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 187 шт: термін постачання 21-31 дні (днів) |
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XC95144XV-5TQ100C | AMD |
Description: FLASH PLD, 5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1364 шт: термін постачання 21-31 дні (днів) |
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XC95288XV-6PQ208C | AMD |
Description: FLASH PLD, 6NS, 288-CELL PQFP208 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 392 шт: термін постачання 21-31 дні (днів) |
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XCZU7EG-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU7EV-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU7EG-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU7EV-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
товар відсутній |
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XCZU11EG-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU7EG-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU7EV-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU7EV-L1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU7EG-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU11EG-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU11EG-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU7EG-3FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU11EG-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU11EG-L2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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| A-SN1022-P4N-PQ | AMD |
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB Packaging: Box Power (Watts): 75W Interface: PCI Express Operating Temperature: 0°C ~ 30°C Bandwidth: 2GHz Cooling Type: Fan Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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XCZU9EG-2FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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SK-KV260-G | AMD |
Description: KRIA KV260 VISION AI STARTER Packaging: Box For Use With/Related Products: SM-K26, XCK26 Type: FPGA + MCU/MPU SoC Contents: Board(s) Platform: Kria KV260 Vision AI Starter Part Status: Active |
на замовлення 151 шт: термін постачання 21-31 дні (днів) |
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| XC5215-5PQG160C |
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Виробник: AMD
Description: FPGA, 484 CLBS, 15000 GATES
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 484
Number of I/O: 133
DigiKey Programmable: Not Verified
Description: FPGA, 484 CLBS, 15000 GATES
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 484
Number of I/O: 133
DigiKey Programmable: Not Verified
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 8382.27 грн |
| XC5215-6HQ208C |
|
Виробник: AMD
Description: FPGA, 484 CLBS, 15000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 484
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: FPGA, 484 CLBS, 15000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 484
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 773 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 8623.74 грн |
| XC5215-5HQ208CO359 |
|
Виробник: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 484
Number of I/O: 164
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 484
Number of I/O: 164
на замовлення 33 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 2550.28 грн |
| XC5215-5BG225CO359 |
|
Виробник: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 225-BEBGA
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 225-PBGA (27x27)
Number of LABs/CLBs: 484
Number of I/O: 196
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 225-BEBGA
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 225-PBGA (27x27)
Number of LABs/CLBs: 484
Number of I/O: 196
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 3296.26 грн |
| XC5215-6HQ208I |
|
Виробник: AMD
Description: FPGA, 484 CLBS, 15000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 484
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: FPGA, 484 CLBS, 15000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 23000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 1936
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 484
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 9812.61 грн |
| A-U200-P64G-PQ-G |
|
Виробник: AMD
Description: BOARD DCAB SERVER U200 PASSIVE
Packaging: Box
Power (Watts): 225W
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 892k
INT8 TOPs: 18.6
Description: BOARD DCAB SERVER U200 PASSIVE
Packaging: Box
Power (Watts): 225W
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 892k
INT8 TOPs: 18.6
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 393033.38 грн |
| XC7A25T-2CSG325I |
|
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TA)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TA)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
на замовлення 685 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4580.36 грн |
| XC6SLX150T-2FGG484I |
|
Виробник: AMD
Description: IC FPGA 296 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 147443
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 11519
Total RAM Bits: 4939776
Part Status: Active
Number of I/O: 296
DigiKey Programmable: Not Verified
Description: IC FPGA 296 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 147443
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 11519
Total RAM Bits: 4939776
Part Status: Active
Number of I/O: 296
DigiKey Programmable: Not Verified
товар відсутній
| HW-MUSB-3090122 |
Виробник: AMD
Description: CABLE USB A MALE TO USB B U280
Packaging: Bag
Accessory Type: Cable Assembly
Description: CABLE USB A MALE TO USB B U280
Packaging: Bag
Accessory Type: Cable Assembly
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 783.42 грн |
| XC95144-10PQG160I4307 |
|
Виробник: AMD
Description: XC95144 IN SYSTEM PROGRAMMABLE C
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: XC95144 IN SYSTEM PROGRAMMABLE C
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XC2S50-6FGG256C |
|
Виробник: AMD
Description: IC FPGA 176 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 384
Total RAM Bits: 32768
Number of I/O: 176
DigiKey Programmable: Not Verified
Description: IC FPGA 176 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 384
Total RAM Bits: 32768
Number of I/O: 176
DigiKey Programmable: Not Verified
товар відсутній
| XC17S150XLSO20C |
|
Виробник: AMD
Description: CONFIG MEMORY, 1M BITS, SERIAL
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: CONFIG MEMORY, 1M BITS, SERIAL
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 550 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 14+ | 1574.65 грн |
| XCVU9P-1FLGB2104E |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2586150
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 147780
Total RAM Bits: 391168000
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2586150
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 147780
Total RAM Bits: 391168000
Number of I/O: 702
DigiKey Programmable: Not Verified
товар відсутній
| XCVU9P-1FLGB2104I |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2586150
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 147780
Total RAM Bits: 391168000
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2586150
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 147780
Total RAM Bits: 391168000
Number of I/O: 702
DigiKey Programmable: Not Verified
товар відсутній
| XCVU9P-2FLGB2104E |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2586150
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 147780
Total RAM Bits: 391168000
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2586150
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 147780
Total RAM Bits: 391168000
Number of I/O: 702
DigiKey Programmable: Not Verified
товар відсутній
| XCVU9P-2FLGB2104I |
|
Виробник: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2586150
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 147780
Total RAM Bits: 391168000
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2586150
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 147780
Total RAM Bits: 391168000
Number of I/O: 702
DigiKey Programmable: Not Verified
товар відсутній
| EK-U1-ZCU106-G-ED |
|
Виробник: AMD
Description: KIT EVAL ZYNQUS+ MPSOC ZCU106 ED
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply
Platform: Zynq UltraScale+ MPSoC ZCU106 Encryption Disabled PCIe Card
Part Status: Active
Description: KIT EVAL ZYNQUS+ MPSOC ZCU106 ED
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply
Platform: Zynq UltraScale+ MPSoC ZCU106 Encryption Disabled PCIe Card
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 234352.43 грн |
| XAZU5EV-1SFVC784I |
|
Виробник: AMD
Description: IC FPGA SOC ZU EV Q100 784SBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA SOC ZU EV Q100 784SBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 162990.44 грн |
| XCV400-4HQ240C |
|
Виробник: AMD
Description: IC FPGA 166 I/O 240QFP
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
Description: IC FPGA 166 I/O 240QFP
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 26410.8 грн |
| XCV400-5HQ240I |
|
Виробник: AMD
Description: IC FPGA 166 I/O 240QFP
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
Description: IC FPGA 166 I/O 240QFP
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 38082.43 грн |
| XCR3256XL-12PQ208I |
|
Виробник: AMD
Description: IC CPLD 256MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
Description: IC CPLD 256MC 10.8NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
товар відсутній
| XCR3256XL-10PQ208C |
|
Виробник: AMD
Description: IC CPLD 256MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
Description: IC CPLD 256MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
товар відсутній
| XCR3256XL-10PQ208I |
|
Виробник: AMD
Description: IC CPLD 256MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
Description: IC CPLD 256MC 9NS 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
товар відсутній
| XCR3256XL-10CS280I |
|
Виробник: AMD
Description: IC CPLD 256MC 9.1NS 280CSBGA
Packaging: Bulk
Package / Case: 280-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 280-CSBGA (16x16)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC CPLD 256MC 9.1NS 280CSBGA
Packaging: Bulk
Package / Case: 280-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 280-CSBGA (16x16)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 164
DigiKey Programmable: Not Verified
товар відсутній
| EK-U1-ZCU208-G |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU208 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208
Part Status: Obsolete
Description: ZYNQ US+ RFSOC ZCU208 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208
Part Status: Obsolete
товар відсутній
| EK-U1-ZCU208-V1-G |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU208 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208 V1
Part Status: Active
Description: ZYNQ US+ RFSOC ZCU208 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU208 V1
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1032725.61 грн |
| EK-U1-ZCU208-V1-G-J |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU208 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU208 V1 Japan
Description: ZYNQ US+ RFSOC ZCU208 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU48DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU208 V1 Japan
товар відсутній
| XC3195-5PC84C0090 |
|
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 58 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 2033.4 грн |
| XCZU7CG-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7CG-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7CG-L1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7CG-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7CG-2FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XC4062XL-3HQ240C0624 |
|
Виробник: AMD
Description: FPGA, 2304 CLBS, 40000 GATES
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 193
DigiKey Programmable: Not Verified
Description: FPGA, 2304 CLBS, 40000 GATES
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 193
DigiKey Programmable: Not Verified
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 12030.28 грн |
| XC5210-5PQG208C |
|
Виробник: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 5485.34 грн |
| EF-VIVADO-ENTER-NL |
Виробник: AMD
Description: VIVADO ENTERPRISE NODE-LOCKED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
Edition: Enterprise
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Description: VIVADO ENTERPRISE NODE-LOCKED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
Edition: Enterprise
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
товар відсутній
| XC1765ELPC20C |
|
Виробник: AMD
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
на замовлення 4238 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 51+ | 387.3 грн |
| XC1765ELVOG8C |
|
Виробник: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
на замовлення 6809 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 51+ | 387.3 грн |
| XC95144XV-5TQG100C |
|
Виробник: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XC95144XV-7CSG144C |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 978 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 31+ | 636.76 грн |
| XC95144XV-7TQ144I |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 187 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 28+ | 786.26 грн |
| XC95144XV-5TQ100C |
|
Виробник: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1364 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 24+ | 838.27 грн |
| XC95288XV-6PQ208C |
|
Виробник: AMD
Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 392 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 11+ | 1926.68 грн |
| XCZU7EG-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EV-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EV-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EV-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EV-L1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-2FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU7EG-3FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-2FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU11EG-L2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| A-SN1022-P4N-PQ |
|
Виробник: AMD
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB
Packaging: Box
Power (Watts): 75W
Interface: PCI Express
Operating Temperature: 0°C ~ 30°C
Bandwidth: 2GHz
Cooling Type: Fan
Part Status: Active
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB
Packaging: Box
Power (Watts): 75W
Interface: PCI Express
Operating Temperature: 0°C ~ 30°C
Bandwidth: 2GHz
Cooling Type: Fan
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 369654.56 грн |
| XCZU9EG-2FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 35 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 286554.85 грн |
| SK-KV260-G |
|
Виробник: AMD
Description: KRIA KV260 VISION AI STARTER
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Kria KV260 Vision AI Starter
Part Status: Active
Description: KRIA KV260 VISION AI STARTER
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Kria KV260 Vision AI Starter
Part Status: Active
на замовлення 151 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 18634.22 грн |