| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||
|---|---|---|---|---|---|---|---|
| XCKU115-2FLVA1517E4464 | AMD |
Description: XCKU115-2FLVA1517E4464 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU115-3FLVA1517E5107 | AMD |
Description: XCKU115-3FLVA1517E5107 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XQKU115-2FLQA1517I | AMD |
Description: XQKU115-2FLQA1517I Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU060-2FFVA1517E4539 | AMD |
Description: XCKU060-2FFVA1517E4539 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU060-2FFVA1517I4769 | AMD |
Description: XCKU060-2FFVA1517I4769 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU085-2FLVA1517E4636 | AMD |
Description: XCKU085-2FLVA1517E4636 Packaging: Tray Part Status: Active |
товар відсутній |
||||
| XCKU060-1FFVA1517CES9919 | AMD |
Description: ELECTRICAL REJECTS OFFERED AS ME Packaging: Tray Part Status: Active |
товар відсутній |
||||
| XQKU060-L1FFQA1517I | AMD |
Description: XQKU060-L1FFQA1517I Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU085-L1FLVA1517I4582 | AMD |
Description: XCKU085-L1FLVA1517I4582 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU060-L1FFVA1517I4612 | AMD |
Description: XCKU060-L1FFVA1517I4612 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU115-2FLVA1517E3991 | AMD |
Description: XCKU115-2FLVA1517E3991 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XQKU060-L1FFQA1517I4980 | AMD |
Description: XQKU060-L1FFQA1517I4980 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU085-2FLVA1517E3991 | AMD |
Description: XCKU085-2FLVA1517E3991 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU085-1FLVA1517C5394 | AMD |
Description: XCKU085-1FLVA1517C5394 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU060-1FFVA1517CES9873 | AMD |
Description: XCKU060-1FFVA1517CES9873 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU085-1FLVA1517C4555 | AMD |
Description: XCKU085-1FLVA1517C4555 Packaging: Tray Part Status: Active |
товар відсутній |
||||
| XCKU060-2FFVA1517E3991 | AMD |
Description: XCKU060-2FFVA1517E3991 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU115-2FLVA1517I5192 | AMD |
Description: XCKU115-2FLVA1517I5192 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU085-1FLVA1517CES9919 | AMD |
Description: XCKU085-1FLVA1517CES9919 Packaging: Tray Part Status: Active |
товар відсутній |
||||
| XCKU060-2FFVA1517I4187 | AMD |
Description: XCKU060-2FFVA1517I4187 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU115-1FLVA1517I0886 | AMD |
Description: XCKU115-1FLVA1517I0886 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU115-2FLVA1517I4504 | AMD |
Description: XCKU115-2FLVA1517I4504 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU115-2FLVA1517I4187 | AMD |
Description: XCKU115-2FLVA1517I4187 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU115-1FLVA1517CES9919 | AMD |
Description: ELECTRICAL REJECTS OFFERED AS ME Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XCKU060-2FFVA1517I4880 | AMD |
Description: XCKU060-2FFVA1517I4880 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU060-2FFVA1517E4464 | AMD |
Description: XCKU060-2FFVA1517E4464 Packaging: Bulk Part Status: Active |
товар відсутній |
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| XCKU115-3FLVA1517E4915 | AMD |
Description: XCKU115-3FLVA1517E4915 Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| 5962-9851301QZC | AMD |
Description: 13000 GATE 3.3 VOLT LOGIC CELL A Packaging: Tray Part Status: Active |
товар відсутній |
||||
| HW-USB-II-G-PRT | AMD |
Description: PLATFORM CABLE USB-II LEADFREE, Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| XA9572XL-15TQG100I4011 | AMD |
Description: SCD4011. DELPHI BARCODE LABEL A Packaging: Tape & Reel (TR) Part Status: Active |
товар відсутній |
||||
| XA9572XL-15TQG100I4011 | AMD |
Description: SCD4011. DELPHI BARCODE LABEL A Packaging: Cut Tape (CT) Part Status: Active |
товар відсутній |
||||
| XC95288XL-10TQ144I0962 | AMD |
Description: 3.3V 288-MC CPLD Packaging: Tray Part Status: Active |
товар відсутній |
||||
| XC95288XL-10PQ208I4307 | AMD |
Description: XC95288XL-10PQ208I4307 Packaging: Tray Part Status: Active |
товар відсутній |
||||
| BNDL-OD-GE-EMBDRTL | AMD |
Description: GOLD ACADEMY ENTERPRISE RTL & EM Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| BNDL-OD-GE-EMBD | AMD |
Description: GOLD ACADEMY ENTERPRISE EMBEDDED Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| BNDL-OD-SE-EMBDHW | AMD |
Description: SILVER ACADEMY ENTERPRISE EMBEDD Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| BNDL-OD-SE-EMBDSW | AMD |
Description: SILVER ACADEMY ENTERPRISE EMBEDD Packaging: Bulk Part Status: Active |
товар відсутній |
||||
| BO-ISE-EMBD-DL-NL-XDB | AMD |
Description: XDB BILLING, ISE DESIGN SUITE: E Packaging: Bulk Part Status: Active |
товар відсутній |
||||
 |
XCAU20P-1FFVB676I | AMD |
 Description: IC FPGA ARTIXUP 676FBGAPackaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 238437 Supplier Device Package: 676-FCBGA (27x27) Total RAM Bits: 3355443 Part Status: Active Number of I/O: 156 DigiKey Programmable: Not Verified |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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 |
XCAU20P-2SFVB784I | AMD |
Description: IC FPGA ARTIXUP 784FBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 784-FCBGA (23x23) Total RAM Bits: 3355443 Part Status: Active Number of I/O: 156 DigiKey Programmable: Not Verified |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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XCAU20P-2FFVB676I | AMD |
Description: IC FPGA ARTIXUP 676FBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 676-FCBGA (27x27) Total RAM Bits: 3355443 Part Status: Active Number of I/O: 156 DigiKey Programmable: Not Verified |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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 |
XA7A100T-1CSG324Q | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 101440 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 7925 Total RAM Bits: 4976640 Part Status: Active Number of I/O: 210 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
на замовлення 408 шт: термін постачання 21-31 дні (днів) |
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| XCF04SVO20C0100 | AMD |
Description: IC PROM ISP 4MB 3.3V 20TSSOP Packaging: Tray Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Size: 4MB Programmable Type: In System Programmable Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
товар відсутній |
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| EK-U1-ZCU670-V2-G-J | AMD |
Description: ZYNQ US+ RFSOC ZCU670 V2 J EVK Packaging: Box For Use With/Related Products: XCZU67DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Japan Part Status: Active |
товар відсутній |
||||
 |
XCZU19EG-L2FFVB1517E | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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| XCZU19EG-3FFVE1924E | AMD |
Description: IC SOC CORTEX-A53 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1924-FCBGA (45x45) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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XCZU19EG-2FFVB1517E | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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XCZU19EG-1FFVB1517I | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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| XCZU19EG-2FFVE1924I | AMD |
Description: IC SOC CORTEX-A53 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1924-FCBGA (45x45) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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| XCZU19EG-2FFVE1924E | AMD |
Description: IC SOC CORTEX-A53 1924FCBGA Packaging: Tray Package / Case: 1924-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1924-FCBGA (45x45) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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XCZU19EG-1FFVB1517E | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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XCZU19EG-2FFVB1517I | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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XCZU19EG-3FFVB1517E | AMD |
Description: IC SOC CORTEX-A53 1517FCBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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 |
XC4VLX100-11FF1148C | AMD |
Description: IC FPGA 768 I/O 1148FCBGA Packaging: Tray Package / Case: 1148-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 110592 Supplier Device Package: 1148-FCPBGA (35x35) Number of LABs/CLBs: 12288 Total RAM Bits: 4423680 Part Status: Active Number of I/O: 768 DigiKey Programmable: Not Verified |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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 |
XC7S100-1FGGA484C | AMD |
Description: IC FPGA 338 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 102400 Supplier Device Package: 484-FPBGA (23x23) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Part Status: Active Number of I/O: 338 DigiKey Programmable: Not Verified |
на замовлення 87 шт: термін постачання 21-31 дні (днів) |
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| XCF02SVO20C0100 | AMD |
Description: IC PROM ISP 2MB 3.3V 20TSSOP Packaging: Tray Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Size: 2MB Programmable Type: In System Programmable Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
товар відсутній |
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 |
XC3S50AN-5TQG144C | AMD |
Description: IC FPGA 108 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 50000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 1584 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 176 Total RAM Bits: 55296 Part Status: Active Number of I/O: 108 DigiKey Programmable: Not Verified |
на замовлення 105 шт: термін постачання 21-31 дні (днів) |
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 |
EF-DI-LDPC-ENC-DEC-SITE | AMD |
Description: LOGICORE, LDPC-ENC-DEC ENCODER/D Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Media Delivery Type: Electronically Delivered Part Status: Active |
товар відсутній |
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| EF-DI-32G-FC-FEC-PROJ | AMD |
Description: LOGICORE, 32G FIBRE CHANNEL REED Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Project Media Delivery Type: Electronically Delivered Part Status: Active |
товар відсутній |
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| EF-DI-50G-RS-FEC-PROJ | AMD |
Description: LOGICORE 50G IEEE 802.3 REED-SOL Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Project Media Delivery Type: Electronically Delivered Part Status: Active |
товар відсутній |
| XCKU115-2FLVA1517E4464 |
товар відсутній
| XCKU115-3FLVA1517E5107 |
товар відсутній
| XQKU115-2FLQA1517I |
товар відсутній
| XCKU060-2FFVA1517E4539 |
товар відсутній
| XCKU060-2FFVA1517I4769 |
товар відсутній
| XCKU085-2FLVA1517E4636 |
товар відсутній
| XCKU060-1FFVA1517CES9919 |
товар відсутній
| XQKU060-L1FFQA1517I |
товар відсутній
| XCKU085-L1FLVA1517I4582 |
товар відсутній
| XCKU060-L1FFVA1517I4612 |
товар відсутній
| XCKU115-2FLVA1517E3991 |
товар відсутній
| XQKU060-L1FFQA1517I4980 |
товар відсутній
| XCKU085-2FLVA1517E3991 |
товар відсутній
| XCKU085-1FLVA1517C5394 |
товар відсутній
| XCKU060-1FFVA1517CES9873 |
товар відсутній
| XCKU085-1FLVA1517C4555 |
товар відсутній
| XCKU060-2FFVA1517E3991 |
товар відсутній
| XCKU115-2FLVA1517I5192 |
товар відсутній
| XCKU085-1FLVA1517CES9919 |
товар відсутній
| XCKU060-2FFVA1517I4187 |
товар відсутній
| XCKU115-1FLVA1517I0886 |
товар відсутній
| XCKU115-2FLVA1517I4504 |
товар відсутній
| XCKU115-2FLVA1517I4187 |
товар відсутній
| XCKU115-1FLVA1517CES9919 |
товар відсутній
| XCKU060-2FFVA1517I4880 |
товар відсутній
| XCKU060-2FFVA1517E4464 |
товар відсутній
| XCKU115-3FLVA1517E4915 |
товар відсутній
| 5962-9851301QZC |
товар відсутній
| HW-USB-II-G-PRT |
товар відсутній
| XA9572XL-15TQG100I4011 |
Виробник: AMD
Description: SCD4011. DELPHI BARCODE LABEL A
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SCD4011. DELPHI BARCODE LABEL A
Packaging: Tape & Reel (TR)
Part Status: Active
товар відсутній
| XA9572XL-15TQG100I4011 |
Виробник: AMD
Description: SCD4011. DELPHI BARCODE LABEL A
Packaging: Cut Tape (CT)
Part Status: Active
Description: SCD4011. DELPHI BARCODE LABEL A
Packaging: Cut Tape (CT)
Part Status: Active
товар відсутній
| XC95288XL-10TQ144I0962 |
товар відсутній
| XC95288XL-10PQ208I4307 |
товар відсутній
| BNDL-OD-GE-EMBDRTL |
товар відсутній
| BNDL-OD-GE-EMBD |
товар відсутній
| BNDL-OD-SE-EMBDHW |
товар відсутній
| BNDL-OD-SE-EMBDSW |
товар відсутній
| BO-ISE-EMBD-DL-NL-XDB |
товар відсутній
| XCAU20P-1FFVB676I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 31884.06 грн |
| XCAU20P-2SFVB784I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 784FBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 784FBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 41957.57 грн |
| XCAU20P-2FFVB676I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 676FBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Total RAM Bits: 3355443
Part Status: Active
Number of I/O: 156
DigiKey Programmable: Not Verified
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 40848.56 грн |
| XA7A100T-1CSG324Q |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 101440
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 7925
Total RAM Bits: 4976640
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 101440
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 7925
Total RAM Bits: 4976640
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
на замовлення 408 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13056.47 грн |
| XCF04SVO20C0100 |
Виробник: AMD
Description: IC PROM ISP 4MB 3.3V 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC PROM ISP 4MB 3.3V 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 4MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
| EK-U1-ZCU670-V2-G-J |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU670 V2 J EVK
Packaging: Box
For Use With/Related Products: XCZU67DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Japan
Part Status: Active
Description: ZYNQ US+ RFSOC ZCU670 V2 J EVK
Packaging: Box
For Use With/Related Products: XCZU67DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU670 V2 Japan
Part Status: Active
товар відсутній
| XCZU19EG-L2FFVB1517E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-3FFVE1924E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1924-FCBGA (45x45)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1924-FCBGA (45x45)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-2FFVB1517E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-1FFVB1517I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-2FFVE1924I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1924-FCBGA (45x45)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1924-FCBGA (45x45)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-2FFVE1924E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1924-FCBGA (45x45)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1924FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1924-FCBGA (45x45)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-1FFVB1517E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-2FFVB1517I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XCZU19EG-3FFVB1517E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1517FCBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
| XC4VLX100-11FF1148C |
|
Виробник: AMD
Description: IC FPGA 768 I/O 1148FCBGA
Packaging: Tray
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 12288
Total RAM Bits: 4423680
Part Status: Active
Number of I/O: 768
DigiKey Programmable: Not Verified
Description: IC FPGA 768 I/O 1148FCBGA
Packaging: Tray
Package / Case: 1148-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 110592
Supplier Device Package: 1148-FCPBGA (35x35)
Number of LABs/CLBs: 12288
Total RAM Bits: 4423680
Part Status: Active
Number of I/O: 768
DigiKey Programmable: Not Verified
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 351513.73 грн |
| XC7S100-1FGGA484C |
|
Виробник: AMD
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Part Status: Active
Number of I/O: 338
DigiKey Programmable: Not Verified
на замовлення 87 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10052.19 грн |
| XCF02SVO20C0100 |
Виробник: AMD
Description: IC PROM ISP 2MB 3.3V 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC PROM ISP 2MB 3.3V 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
товар відсутній
| XC3S50AN-5TQG144C |
|
Виробник: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1584
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 176
Total RAM Bits: 55296
Part Status: Active
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1584
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 176
Total RAM Bits: 55296
Part Status: Active
Number of I/O: 108
DigiKey Programmable: Not Verified
на замовлення 105 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2830.82 грн |
| EF-DI-LDPC-ENC-DEC-SITE |
Виробник: AMD
Description: LOGICORE, LDPC-ENC-DEC ENCODER/D
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, LDPC-ENC-DEC ENCODER/D
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| EF-DI-32G-FC-FEC-PROJ |
Виробник: AMD
Description: LOGICORE, 32G FIBRE CHANNEL REED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 32G FIBRE CHANNEL REED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| EF-DI-50G-RS-FEC-PROJ |
Виробник: AMD
Description: LOGICORE 50G IEEE 802.3 REED-SOL
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE 50G IEEE 802.3 REED-SOL
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Project
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній