Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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XC3S400A-5FTG256C | AMD |
Description: IC FPGA 195 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Part Status: Active Number of I/O: 195 DigiKey Programmable: Not Verified |
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XC3S400-5FTG256C | AMD |
Description: IC FPGA 173 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 896 Total RAM Bits: 294912 Part Status: Active Number of I/O: 173 DigiKey Programmable: Not Verified |
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XC3S500E-5FTG256C | AMD |
Description: IC FPGA 190 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 500000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 10476 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 1164 Total RAM Bits: 368640 Part Status: Active Number of I/O: 190 DigiKey Programmable: Not Verified |
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XC3S1200E-5FTG256C | AMD |
Description: IC FPGA 190 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 1200000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 19512 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 2168 Total RAM Bits: 516096 Part Status: Active Number of I/O: 190 DigiKey Programmable: Not Verified |
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XC3S50AN-5FTG256C | AMD |
Description: IC FPGA 195 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 50000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 1584 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 176 Total RAM Bits: 55296 Part Status: Obsolete Number of I/O: 195 DigiKey Programmable: Not Verified |
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XC3S1000L-4FTG256C | AMD |
Description: IC FPGA 173 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 1000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 17280 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 480 Total RAM Bits: 442368 Part Status: Obsolete Number of I/O: 173 DigiKey Programmable: Not Verified |
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XC3S1400A-5FTG256C | AMD |
Description: IC FPGA 161 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 1400000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 25344 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 2816 Total RAM Bits: 589824 Part Status: Active Number of I/O: 161 DigiKey Programmable: Not Verified |
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XC3S200A-5FTG256C | AMD |
Description: IC FPGA 195 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 200000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 4032 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 448 Total RAM Bits: 294912 Part Status: Active Number of I/O: 195 DigiKey Programmable: Not Verified |
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XC3S400AN-4FTG256I | AMD |
Description: IC FPGA 195 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 400000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 8064 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 896 Total RAM Bits: 368640 Part Status: Active Number of I/O: 195 DigiKey Programmable: Not Verified |
на замовлення 4556 шт: термін постачання 21-31 дні (днів) |
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EK-U1-ZCU106-G-J | AMD |
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC Packaging: Box For Use With/Related Products: XCZU7EV Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s) - Power Supply Not Included - Platform: Zynq UltraScale+ MPSoC ZCU106 Japan PCIe Card Part Status: Active |
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XC7A25T-2CPG238C | AMD |
Description: IC FPGA 112 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Part Status: Active Number of I/O: 112 DigiKey Programmable: Not Verified |
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XC7A12T-1CPG238C | AMD |
Description: IC FPGA 106 I/O 238BGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 12800 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1000 Total RAM Bits: 737280 Part Status: Active Number of I/O: 106 DigiKey Programmable: Not Verified |
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XC17V08PC44C | AMD |
Description: IC PROM SER C-TEMP 3.3V 44-PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 8MB Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 815 шт: термін постачання 21-31 дні (днів) |
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XC17V02VQ44C | AMD |
Description: IC PROM SER 2MBIT 3.3V 44-VQFP Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Memory Size: 2MB Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 44-VQFP (10x10) Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 536 шт: термін постачання 21-31 дні (днів) |
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XC17V02PC44C | AMD |
Description: IC PROM SER 2MBIT 3.3V 44-PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 2MB Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete DigiKey Programmable: Not Verified |
на замовлення 1912 шт: термін постачання 21-31 дні (днів) |
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XC7A75T-1FGG484C | AMD |
Description: IC FPGA 285 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 75520 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 5900 Total RAM Bits: 3870720 Part Status: Active Number of I/O: 285 DigiKey Programmable: Not Verified |
на замовлення 374 шт: термін постачання 21-31 дні (днів) |
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XC7A75T-2FGG484I | AMD |
Description: IC FPGA 285 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 75520 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 5900 Total RAM Bits: 3870720 Part Status: Active Number of I/O: 285 DigiKey Programmable: Not Verified |
на замовлення 850 шт: термін постачання 21-31 дні (днів) |
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XC7A15T-1FGG484I | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Part Status: Active Number of I/O: 250 DigiKey Programmable: Not Verified |
на замовлення 151 шт: термін постачання 21-31 дні (днів) |
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XC7A15T-1FGG484C | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Part Status: Active Number of I/O: 250 DigiKey Programmable: Not Verified |
на замовлення 1667 шт: термін постачання 21-31 дні (днів) |
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XC7A75T-2FGG676C | AMD |
Description: IC FPGA 300 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 75520 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 5900 Total RAM Bits: 3870720 Part Status: Active Number of I/O: 300 DigiKey Programmable: Not Verified |
на замовлення 425 шт: термін постачання 21-31 дні (днів) |
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XCV200-5BG256C | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 236666 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 5292 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 1176 Total RAM Bits: 57344 Part Status: Obsolete Number of I/O: 180 DigiKey Programmable: Not Verified |
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XCV200-5BG256I | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 236666 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 5292 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 1176 Total RAM Bits: 57344 Part Status: Obsolete Number of I/O: 180 DigiKey Programmable: Not Verified |
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AM28F020-200EC | AMD |
Description: FLASH NOR 2MB 12V TSOP 200ns Packaging: Tube Package / Case: 32-TFSOP (0.724", 18.40mm Width) Mounting Type: Surface Mount Memory Size: 2Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C Voltage - Supply: 12V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 32-TSOP Part Status: Active Write Cycle Time - Word, Page: 200ns Memory Interface: Parallel Access Time: 200 ns Memory Organization: 256K x 8 DigiKey Programmable: Not Verified |
на замовлення 1935 шт: термін постачання 21-31 дні (днів) |
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AM29LV160DT-90EC | AMD |
Description: FLASH NOR 16MB TSOP Top Blk 3v Packaging: Tray Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Part Status: Active Write Cycle Time - Word, Page: 90ns Memory Interface: Parallel Access Time: 90 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
на замовлення 2607 шт: термін постачання 21-31 дні (днів) |
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AM29LV160DB-70EI | AMD |
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B Packaging: Tube Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Part Status: Active Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
на замовлення 949 шт: термін постачання 21-31 дні (днів) |
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XC3S5000-4FGG1156C | AMD |
Description: FPGA, 8320 CLBS, 5000000 GATES Packaging: Bulk Mounting Type: Surface Mount Number of Gates: 5000000 Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Part Status: Active Number of I/O: 633 DigiKey Programmable: Not Verified |
на замовлення 429 шт: термін постачання 21-31 дні (днів) |
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XC3S5000-4FG1156C | AMD |
Description: FPGA, 8320 CLBS, 5000000 GATES Packaging: Bulk Mounting Type: Surface Mount Number of Gates: 5000000 Number of Logic Elements/Cells: 74880 Number of LABs/CLBs: 8320 Part Status: Active Number of I/O: 489 DigiKey Programmable: Not Verified |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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XCV400-4HQ240C0729 | AMD |
Description: FPGA, 2400 CLBS, 468252 GATES, 2 Packaging: Bulk Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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XCV400-5HQ240I | AMD |
Description: IC FPGA 166 I/O 240QFP Packaging: Tray Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 468252 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 10800 Supplier Device Package: 240-PQFP (32x32) Number of LABs/CLBs: 2400 Total RAM Bits: 81920 Part Status: Obsolete Number of I/O: 166 DigiKey Programmable: Not Verified |
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XCV400-5BG560C | AMD |
Description: IC FPGA 404 I/O 560MBGA Packaging: Tray Package / Case: 560-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 468252 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 10800 Supplier Device Package: 560-MBGA (42.5x42.5) Number of LABs/CLBs: 2400 Total RAM Bits: 81920 Part Status: Obsolete Number of I/O: 404 DigiKey Programmable: Not Verified |
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XCV400-4BG560I | AMD |
Description: IC FPGA 404 I/O 560MBGA Packaging: Tray Package / Case: 560-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 468252 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 10800 Supplier Device Package: 560-MBGA (42.5x42.5) Number of LABs/CLBs: 2400 Total RAM Bits: 81920 Part Status: Obsolete Number of I/O: 404 DigiKey Programmable: Not Verified |
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XCV400-4HQ240C | AMD |
Description: IC FPGA 166 I/O 240QFP Packaging: Tray Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 468252 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 10800 Supplier Device Package: 240-PQFP (32x32) Number of LABs/CLBs: 2400 Total RAM Bits: 81920 Part Status: Obsolete Number of I/O: 166 DigiKey Programmable: Not Verified |
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AM29DL323GT-90EF | AMD |
Description: FLASH NOR 32 MB TOP BOOT 90NS TS Packaging: Tray Mounting Type: Surface Mount Memory Size: 32Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Part Status: Active Write Cycle Time - Word, Page: 90ns Memory Interface: Parallel Access Time: 90 ns Memory Organization: 4M x 8, 2M x 16 DigiKey Programmable: Not Verified |
на замовлення 960 шт: термін постачання 21-31 дні (днів) |
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AM29DL324GB-70EI | AMD |
Description: FLASH NOR 32MB 3V (Btm Bt-Blk) 7 Packaging: Tray Mounting Type: Surface Mount Memory Size: 32Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Part Status: Active Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 4M x 8, 2M x 16 DigiKey Programmable: Not Verified |
на замовлення 9600 шт: термін постачання 21-31 дні (днів) |
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XCZU15EG-L2FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-1FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-2FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-2FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-1FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-2FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-1FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-2FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
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XCZU15EG-3FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 600MHz, 667MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA Part Status: Active |
товар відсутній |
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AM29LV160DB-70EC | AMD |
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B Packaging: Tray Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Part Status: Active Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
на замовлення 218894 шт: термін постачання 21-31 дні (днів) |
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AM29LV160DT-70EC | AMD |
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7 Packaging: Tube Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Part Status: Active Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
на замовлення 1032 шт: термін постачання 21-31 дні (днів) |
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AM29LV160DT-70EC/T | AMD |
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7 Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Part Status: Active Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
на замовлення 565 шт: термін постачання 21-31 дні (днів) |
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XCZU3CG-1UBVA530I | AMD |
Description: IC SOC CORTEX-A53 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA Part Status: Active |
товар відсутній |
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XC7A25T-1CPG238I | AMD |
Description: IC FPGA 112 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TA) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 23360 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1825 Total RAM Bits: 1658880 Part Status: Active Number of I/O: 112 DigiKey Programmable: Not Verified |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCS40-4BG256C | AMD |
Description: IC FPGA 205 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 40000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1862 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 784 Total RAM Bits: 25088 Part Status: Obsolete Number of I/O: 205 DigiKey Programmable: Not Verified |
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XCS40-3BG256C | AMD |
Description: IC FPGA 205 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 40000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1862 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 784 Total RAM Bits: 25088 Part Status: Obsolete Number of I/O: 205 DigiKey Programmable: Not Verified |
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XCS40XL-5BG256C | AMD |
Description: IC FPGA 205 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 40000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 1862 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 784 Total RAM Bits: 25088 Part Status: Obsolete Number of I/O: 205 DigiKey Programmable: Not Verified |
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XCS40XL-4BG256C | AMD |
Description: IC FPGA 205 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 40000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 1862 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 784 Total RAM Bits: 25088 Part Status: Obsolete Number of I/O: 205 DigiKey Programmable: Not Verified |
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XCS40XL-4BG256I | AMD |
Description: IC FPGA 205 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 40000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 1862 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 784 Total RAM Bits: 25088 Part Status: Obsolete Number of I/O: 205 DigiKey Programmable: Not Verified |
товар відсутній |
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XC7A200T-2SBG484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 285 DigiKey Programmable: Not Verified |
на замовлення 383 шт: термін постачання 21-31 дні (днів) |
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XC7A200T-2FBG676C | AMD |
Description: IC FPGA 400 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 400 DigiKey Programmable: Not Verified |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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XC7A200T-1FBG484C | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (23x23) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 285 DigiKey Programmable: Not Verified |
на замовлення 212 шт: термін постачання 21-31 дні (днів) |
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XC7A200T-1FBG676C | AMD |
Description: IC FPGA 400 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 400 DigiKey Programmable: Not Verified |
на замовлення 372 шт: термін постачання 21-31 дні (днів) |
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XC7A200T-1FBG484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (23x23) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Part Status: Active Number of I/O: 285 DigiKey Programmable: Not Verified |
на замовлення 334 шт: термін постачання 21-31 дні (днів) |
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AM29LV160DT-90ED | AMD |
Description: FLASH NOR 16 MB TOP BOOT 90NS TS Packaging: Tray Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 48-TSOP Part Status: Active Write Cycle Time - Word, Page: 90ns Memory Interface: Parallel Access Time: 90 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
на замовлення 7488 шт: термін постачання 21-31 дні (днів) |
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XC3S400A-5FTG256C |
Виробник: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
товар відсутній
XC3S400-5FTG256C |
Виробник: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Part Status: Active
Number of I/O: 173
DigiKey Programmable: Not Verified
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 294912
Part Status: Active
Number of I/O: 173
DigiKey Programmable: Not Verified
товар відсутній
XC3S500E-5FTG256C |
Виробник: AMD
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Part Status: Active
Number of I/O: 190
DigiKey Programmable: Not Verified
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 10476
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1164
Total RAM Bits: 368640
Part Status: Active
Number of I/O: 190
DigiKey Programmable: Not Verified
товар відсутній
XC3S1200E-5FTG256C |
Виробник: AMD
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 19512
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 2168
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 190
DigiKey Programmable: Not Verified
Description: IC FPGA 190 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 19512
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 2168
Total RAM Bits: 516096
Part Status: Active
Number of I/O: 190
DigiKey Programmable: Not Verified
товар відсутній
XC3S50AN-5FTG256C |
Виробник: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1584
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 176
Total RAM Bits: 55296
Part Status: Obsolete
Number of I/O: 195
DigiKey Programmable: Not Verified
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1584
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 176
Total RAM Bits: 55296
Part Status: Obsolete
Number of I/O: 195
DigiKey Programmable: Not Verified
товар відсутній
XC3S1000L-4FTG256C |
Виробник: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 480
Total RAM Bits: 442368
Part Status: Obsolete
Number of I/O: 173
DigiKey Programmable: Not Verified
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 480
Total RAM Bits: 442368
Part Status: Obsolete
Number of I/O: 173
DigiKey Programmable: Not Verified
товар відсутній
XC3S1400A-5FTG256C |
Виробник: AMD
Description: IC FPGA 161 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 25344
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 2816
Total RAM Bits: 589824
Part Status: Active
Number of I/O: 161
DigiKey Programmable: Not Verified
Description: IC FPGA 161 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 25344
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 2816
Total RAM Bits: 589824
Part Status: Active
Number of I/O: 161
DigiKey Programmable: Not Verified
товар відсутній
XC3S200A-5FTG256C |
Виробник: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4032
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 448
Total RAM Bits: 294912
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4032
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 448
Total RAM Bits: 294912
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
товар відсутній
XC3S400AN-4FTG256I |
Виробник: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
на замовлення 4556 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5332.13 грн |
EK-U1-ZCU106-G-J |
Виробник: AMD
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU106 Japan PCIe Card
Part Status: Active
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU106 Japan PCIe Card
Part Status: Active
товар відсутній
XC7A25T-2CPG238C |
Виробник: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
товар відсутній
XC7A12T-1CPG238C |
Виробник: AMD
Description: IC FPGA 106 I/O 238BGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238BGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
товар відсутній
XC17V08PC44C |
Виробник: AMD
Description: IC PROM SER C-TEMP 3.3V 44-PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 8MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC PROM SER C-TEMP 3.3V 44-PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 8MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 815 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10+ | 2376.73 грн |
XC17V02VQ44C |
Виробник: AMD
Description: IC PROM SER 2MBIT 3.3V 44-VQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC PROM SER 2MBIT 3.3V 44-VQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 536 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
44+ | 496.61 грн |
XC17V02PC44C |
Виробник: AMD
Description: IC PROM SER 2MBIT 3.3V 44-PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC PROM SER 2MBIT 3.3V 44-PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
DigiKey Programmable: Not Verified
на замовлення 1912 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
44+ | 496.61 грн |
XC7A75T-1FGG484C |
Виробник: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
на замовлення 374 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 9962.15 грн |
XC7A75T-2FGG484I |
Виробник: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
на замовлення 850 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 12008.53 грн |
XC7A15T-1FGG484I |
Виробник: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
на замовлення 151 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4175.51 грн |
XC7A15T-1FGG484C |
Виробник: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
на замовлення 1667 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3633.95 грн |
XC7A75T-2FGG676C |
Виробник: AMD
Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 300
DigiKey Programmable: Not Verified
Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 300
DigiKey Programmable: Not Verified
на замовлення 425 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 12093.43 грн |
XCV200-5BG256C |
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
товар відсутній
XCV200-5BG256I |
Виробник: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
товар відсутній
AM28F020-200EC |
Виробник: AMD
Description: FLASH NOR 2MB 12V TSOP 200ns
Packaging: Tube
Package / Case: 32-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 200ns
Memory Interface: Parallel
Access Time: 200 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Description: FLASH NOR 2MB 12V TSOP 200ns
Packaging: Tube
Package / Case: 32-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 200ns
Memory Interface: Parallel
Access Time: 200 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
на замовлення 1935 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
100+ | 142.7 грн |
200+ | 133.98 грн |
300+ | 130.55 грн |
500+ | 116.07 грн |
AM29LV160DT-90EC |
Виробник: AMD
Description: FLASH NOR 16MB TSOP Top Blk 3v
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 16MB TSOP Top Blk 3v
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
на замовлення 2607 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
96+ | 185.51 грн |
192+ | 177.27 грн |
384+ | 175.21 грн |
960+ | 161.2 грн |
AM29LV160DB-70EI |
Виробник: AMD
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
на замовлення 949 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
96+ | 196.22 грн |
192+ | 186.89 грн |
384+ | 185.51 грн |
768+ | 170.87 грн |
XC3S5000-4FGG1156C |
Виробник: AMD
Description: FPGA, 8320 CLBS, 5000000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 5000000
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Part Status: Active
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: FPGA, 8320 CLBS, 5000000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 5000000
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Part Status: Active
Number of I/O: 633
DigiKey Programmable: Not Verified
на замовлення 429 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 19798.01 грн |
XC3S5000-4FG1156C |
Виробник: AMD
Description: FPGA, 8320 CLBS, 5000000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 5000000
Number of Logic Elements/Cells: 74880
Number of LABs/CLBs: 8320
Part Status: Active
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: FPGA, 8320 CLBS, 5000000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 5000000
Number of Logic Elements/Cells: 74880
Number of LABs/CLBs: 8320
Part Status: Active
Number of I/O: 489
DigiKey Programmable: Not Verified
на замовлення 18 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 7238.89 грн |
XCV400-4HQ240C0729 |
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 26507.23 грн |
XCV400-5HQ240I |
Виробник: AMD
Description: IC FPGA 166 I/O 240QFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
Description: IC FPGA 166 I/O 240QFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
товар відсутній
XCV400-5BG560C |
Виробник: AMD
Description: IC FPGA 404 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
Description: IC FPGA 404 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
товар відсутній
XCV400-4BG560I |
Виробник: AMD
Description: IC FPGA 404 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
Description: IC FPGA 404 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
товар відсутній
XCV400-4HQ240C |
Виробник: AMD
Description: IC FPGA 166 I/O 240QFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
Description: IC FPGA 166 I/O 240QFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
товар відсутній
AM29DL323GT-90EF |
Виробник: AMD
Description: FLASH NOR 32 MB TOP BOOT 90NS TS
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 4M x 8, 2M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 32 MB TOP BOOT 90NS TS
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 4M x 8, 2M x 16
DigiKey Programmable: Not Verified
на замовлення 960 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
96+ | 214.06 грн |
192+ | 199.26 грн |
384+ | 192.39 грн |
768+ | 177.32 грн |
960+ | 174.1 грн |
AM29DL324GB-70EI |
Виробник: AMD
Description: FLASH NOR 32MB 3V (Btm Bt-Blk) 7
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 4M x 8, 2M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 32MB 3V (Btm Bt-Blk) 7
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 4M x 8, 2M x 16
DigiKey Programmable: Not Verified
на замовлення 9600 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
960+ | 214.06 грн |
1920+ | 202.69 грн |
3840+ | 199.26 грн |
9600+ | 177.32 грн |
XCZU15EG-L2FFVB1156E |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-1FFVC900I |
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-2FFVB1156E |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-2FFVB1156I |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-1FFVB1156E |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-2FFVC900E |
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-1FFVB1156I |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-2FFVC900I |
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-1FFVC900E |
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
XCZU15EG-3FFVB1156E |
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
AM29LV160DB-70EC |
Виробник: AMD
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
на замовлення 218894 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
480+ | 160.54 грн |
960+ | 151.16 грн |
3840+ | 144.29 грн |
7680+ | 132.19 грн |
AM29LV160DT-70EC |
Виробник: AMD
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
на замовлення 1032 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
96+ | 185.51 грн |
192+ | 177.27 грн |
384+ | 175.21 грн |
960+ | 161.2 грн |
AM29LV160DT-70EC/T |
Виробник: AMD
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 16MB TSOP TOP BLK 3V 7
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
на замовлення 565 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
100+ | 185.51 грн |
200+ | 177.27 грн |
300+ | 175.9 грн |
500+ | 164.43 грн |
XCZU3CG-1UBVA530I |
Виробник: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
товар відсутній
XC7A25T-1CPG238I |
Виробник: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TA)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TA)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3232.95 грн |
XCS40-4BG256C |
Виробник: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
товар відсутній
XCS40-3BG256C |
Виробник: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
товар відсутній
XCS40XL-5BG256C |
Виробник: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
товар відсутній
XCS40XL-4BG256C |
Виробник: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
товар відсутній
XCS40XL-4BG256I |
Виробник: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
товар відсутній
XC7A200T-2SBG484I |
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
на замовлення 383 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 27827.24 грн |
XC7A200T-2FBG676C |
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
на замовлення 15 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 22072 грн |
XC7A200T-1FBG484C |
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
на замовлення 212 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 16944.65 грн |
XC7A200T-1FBG676C |
Виробник: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
на замовлення 372 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 19262.16 грн |
XC7A200T-1FBG484I |
Виробник: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
на замовлення 334 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 19490.49 грн |
AM29LV160DT-90ED |
Виробник: AMD
Description: FLASH NOR 16 MB TOP BOOT 90NS TS
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: FLASH NOR 16 MB TOP BOOT 90NS TS
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
на замовлення 7488 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
96+ | 185.51 грн |
192+ | 177.27 грн |
384+ | 175.21 грн |
960+ | 161.2 грн |