Результат пошуку "109995" : 31
Вид перегляду :
Мінімальне замовлення: 10000
Мінімальне замовлення: 37
Мінімальне замовлення: 34
Мінімальне замовлення: 10
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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 +1 |
роз'єм SSD для ноутбука замість CD-ROM, 9.5мм Код товару: 109995 |
Інструмент та обладнання > Побутова електроніка Опис: роз'єм SSD для ноутбука замість CD-ROM 9.5 мм універсальний SATA Призначення: Пристрої з USB, перехідники |
у наявності: 6 шт
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DF1E-2022SCF | Hirose Electric Co Ltd |
 Description: CONN SOCKET 20-22AWG CRIMP TINPackaging: Tape & Reel (TR) Contact Finish: Tin Contact Termination: Crimp Wire Gauge: 20-22 AWG Pin or Socket: Socket Part Status: Active |
на замовлення 40000 шт: термін постачання 21-31 дні (днів) |
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DF1E-2022SCF | Hirose Electric Co Ltd |
Description: CONN SOCKET 20-22AWG CRIMP TIN Packaging: Cut Tape (CT) Contact Finish: Tin Contact Termination: Crimp Wire Gauge: 20-22 AWG Pin or Socket: Socket Part Status: Active |
на замовлення 48400 шт: термін постачання 21-31 дні (днів) |
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DF1E-2022SCF | Hirose Connector |
Headers & Wire Housings 20-22 AWG FEMALE CRIMP CONTACT TIN |
на замовлення 49829 шт: термін постачання 21-30 дні (днів) |
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RP73PF1J66R5BTDF | TE Connectivity Passive Product |
Description: RES SMD 66.5 OHM 0.1% 1/6W 0603 Packaging: Cut Tape (CT) Power (Watts): 0.167W, 1/6W Tolerance: ±0.1% Package / Case: 0603 (1608 Metric) Temperature Coefficient: ±25ppm/°C Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm) Composition: Thin Film Operating Temperature: -55°C ~ 155°C Number of Terminations: 2 Supplier Device Package: 0603 Height - Seated (Max): 0.022" (0.55mm) Part Status: Active Resistance: 66.5 Ohms |
на замовлення 138 шт: термін постачання 21-31 дні (днів) |
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| 1099950000 | Weidmuller | SL 5.08/03/90 3.2SN GN BX |
товар відсутній |
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110-99-950-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 50POS TINLEAD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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110-99-950-41-001000 | Mill-Max |
IC & Component Sockets 50 PIN STD SOLDER TAIL SKT 200u Sn |
товар відсутній |
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| 110-99-950-61-001000 | Mill-Max |
IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
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| 110-99-950-61-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 50 (2 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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110-99-952-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 52POS TINLEAD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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110-99-952-41-001000 | Mill-Max |
IC & Component Sockets 52 PIN STD SOLDER TAIL SKT 200u Sn |
товар відсутній |
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| 110-99-952-61-001000 | Mill-Max |
IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
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| 110-99-952-61-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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CYBL10999-56LQXIT | Infineon Technologies |
Description: IC RF TXRX+MCU BLUETOOTH 56UFQFN Packaging: Tape & Reel (TR) Package / Case: 56-UFQFN Exposed Pad Sensitivity: -89dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash, 16kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 3dBm Protocol: Bluetooth v4.1 Current - Receiving: 16.4mA Data Rate (Max): 1Mbps Current - Transmitting: 15.6mA Supplier Device Package: 56-QFN (7x7) GPIO: 36 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified |
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110-44-950-41-001000 | Mill-Max |
IC & Component Sockets 50 PIN SKT 200u Sn |
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110-44-952-41-001000 | Mill-Max |
IC & Component Sockets 52 PIN SKT 200u Sn |
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| 39606SRP | 3M |
Description: 3M PERFORMANCE SANDPAPER 39606SR Packaging: Bulk |
товар відсутній |
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MSC8156TAG1000B | NXP USA Inc. |
Description: IC DSP 6X 1GHZ SC3850 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Six Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
товар відсутній |
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| PICOIMX6Q10R1GBSDBW | TechNexion |
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM Packaging: Bulk Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm) Speed: 1GHz Operating Temperature: 0°C ~ 60°C Core Processor: ARM® Cortex®-A9, i.MX6Quad Form Factor: PICO Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART Video Outputs: H.264, MIPI CSI USB: USB, USB OTG Watchdog Timer: No Storage Interface: eMMC, microSD Number of Cores: 4 RAM Capacity/Installed: 1GB/1GB |
товар відсутній |
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| PICOIMX6Q10R1GBSDBWTE | TechNexion |
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM Packaging: Bulk Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm) Speed: 1GHz Operating Temperature: -20°C ~ 70°C Core Processor: ARM® Cortex®-A9, i.MX6Quad Form Factor: PICO Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART Video Outputs: H.264, MIPI CSI USB: USB, USB OTG Watchdog Timer: No Storage Interface: eMMC, microSD Number of Cores: 4 RAM Capacity/Installed: 1GB/1GB Part Status: Active |
товар відсутній |
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| PICOIMX6QPOPR10SDBW | TechNexion |
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM Packaging: Bulk Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm) Speed: 1GHz Operating Temperature: 0°C ~ 60°C Core Processor: ARM® Cortex®-A9, i.MX6Quad Form Factor: PICO Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART Video Outputs: H.264, MIPI CSI USB: USB, USB OTG Watchdog Timer: No Storage Interface: eMMC, microSD Number of Cores: 4 RAM Capacity/Installed: 1GB/1GB Part Status: Active |
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| PICOIMX6U10R1GBSDBWTE | TechNexion |
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM Packaging: Bulk Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm) Speed: 1GHz Operating Temperature: -20°C ~ 70°C Core Processor: ARM® Cortex®-A9, i.MX6DualLite Form Factor: PICO Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART Video Outputs: H.264, MIPI CSI USB: USB, USB OTG Watchdog Timer: No Storage Interface: eMMC, microSD Number of Cores: 2 RAM Capacity/Installed: 1GB/1GB Part Status: Active |
товар відсутній |
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| PICOIMX7DR10MSDBW | TechNexion |
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM Packaging: Bulk Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm) Speed: 1GHz Operating Temperature: 0°C ~ 60°C Core Processor: ARM® Cortex®-A7 + M4, i.MX7Dual Form Factor: PICO Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART Video Outputs: MIPI-CSI, MIPI-DSI Ethernet: RGMII USB: USB, USB OTG Watchdog Timer: No Storage Interface: eMMC, microSD Number of Cores: 2 RAM Capacity/Installed: 1GB/1GB Part Status: Active |
товар відсутній |
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| PICOIMX7DR10MSDBWTE | TechNexion |
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM Packaging: Bulk Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm) Speed: 1GHz Operating Temperature: -20°C ~ 70°C Core Processor: ARM® Cortex®-A7 + M4, i.MX7Dual Form Factor: PICO Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART Video Outputs: MIPI-CSI, MIPI-DSI Ethernet: RGMII USB: USB, USB OTG Watchdog Timer: No Storage Interface: eMMC, microSD Number of Cores: 2 RAM Capacity/Installed: 1GB/1GB Part Status: Active |
товар відсутній |
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RP73PF1J66R5BTDF | TE Connectivity Passive Product |
Description: RES SMD 66.5 OHM 0.1% 1/6W 0603 Packaging: Tape & Reel (TR) Power (Watts): 0.167W, 1/6W Tolerance: ±0.1% Package / Case: 0603 (1608 Metric) Temperature Coefficient: ±25ppm/°C Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm) Composition: Thin Film Operating Temperature: -55°C ~ 155°C Number of Terminations: 2 Supplier Device Package: 0603 Height - Seated (Max): 0.022" (0.55mm) Part Status: Active Resistance: 66.5 Ohms |
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STW32N65M5 | STMicroelectronics |
Description: MOSFET N-CH 650V 24A TO247-3 Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Operating Temperature: 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 24A (Tc) Rds On (Max) @ Id, Vgs: 119mOhm @ 12A, 10V Power Dissipation (Max): 150W (Tc) Vgs(th) (Max) @ Id: 5V @ 250µA Supplier Device Package: TO-247-3 Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±25V Drain to Source Voltage (Vdss): 650 V Gate Charge (Qg) (Max) @ Vgs: 72 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3320 pF @ 100 V |
товар відсутній |
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TGF2023-2-10 | Qorvo |
RF JFET Transistors DC-18GHZ 50W TQGaN25 PAE 69.5% Gain 19dB |
товар відсутній |
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TGF2023-2-20 | Qorvo |
RF JFET Transistors DC-18GHZ 90W TQGaN25 PAE 70.5% Gain 19dB |
товар відсутній |
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| VL5A000B-CZB00-000 | Carling Technologies |
Description: SWITCH ROCKER DPDT 15A 125V Packaging: Bulk Current Rating (Amps): 15A (AC) Mounting Type: Panel Mount, Snap-In Circuit: DPDT Switch Function: Mom-Off-Mom Operating Temperature: -40°C ~ 85°C Termination Style: Quick Connect - 0.250" (6.3mm) Actuator Type: Convex (Reverse V) Approval Agency: CSA, UL, VDE Ingress Protection: IP66/IP68 - Dust Tight, Water Resistant, Waterproof Panel Cutout Dimensions: Rectangular - 36.83mm x 21.08mm Color - Actuator/Cap: Black Actuator Marking: No Marking Voltage Rating - AC: 125 V |
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| VVGZC84-400 | Carling Technologies |
Description: HARDWARE SWITCH ROCKER Packaging: Bulk |
товар відсутній |
| роз'єм SSD для ноутбука замість CD-ROM, 9.5мм Код товару: 109995 |
Інструмент та обладнання > Побутова електроніка
Опис: роз'єм SSD для ноутбука замість CD-ROM 9.5 мм універсальний SATA
Призначення: Пристрої з USB, перехідники
Опис: роз'єм SSD для ноутбука замість CD-ROM 9.5 мм універсальний SATA
Призначення: Пристрої з USB, перехідники
у наявності: 6 шт
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 256 грн |
| DF1E-2022SCF |
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Виробник: Hirose Electric Co Ltd
Description: CONN SOCKET 20-22AWG CRIMP TIN
Packaging: Tape & Reel (TR)
Contact Finish: Tin
Contact Termination: Crimp
Wire Gauge: 20-22 AWG
Pin or Socket: Socket
Part Status: Active
Description: CONN SOCKET 20-22AWG CRIMP TIN
Packaging: Tape & Reel (TR)
Contact Finish: Tin
Contact Termination: Crimp
Wire Gauge: 20-22 AWG
Pin or Socket: Socket
Part Status: Active
на замовлення 40000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10000+ | 2.67 грн |
| 20000+ | 2.35 грн |
| 30000+ | 2.13 грн |
| DF1E-2022SCF |
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Виробник: Hirose Electric Co Ltd
Description: CONN SOCKET 20-22AWG CRIMP TIN
Packaging: Cut Tape (CT)
Contact Finish: Tin
Contact Termination: Crimp
Wire Gauge: 20-22 AWG
Pin or Socket: Socket
Part Status: Active
Description: CONN SOCKET 20-22AWG CRIMP TIN
Packaging: Cut Tape (CT)
Contact Finish: Tin
Contact Termination: Crimp
Wire Gauge: 20-22 AWG
Pin or Socket: Socket
Part Status: Active
на замовлення 48400 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 37+ | 7.82 грн |
| 48+ | 5.75 грн |
| 58+ | 4.79 грн |
| 63+ | 4.12 грн |
| 100+ | 4 грн |
| 250+ | 3.45 грн |
| 500+ | 3.25 грн |
| 1000+ | 2.85 грн |
| 2500+ | 2.58 грн |
| DF1E-2022SCF |
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Виробник: Hirose Connector
Headers & Wire Housings 20-22 AWG FEMALE CRIMP CONTACT TIN
Headers & Wire Housings 20-22 AWG FEMALE CRIMP CONTACT TIN
на замовлення 49829 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 34+ | 9.28 грн |
| 47+ | 6.5 грн |
| 100+ | 4.14 грн |
| 500+ | 3.42 грн |
| 1000+ | 3.02 грн |
| 2500+ | 2.76 грн |
| 10000+ | 2.43 грн |
| RP73PF1J66R5BTDF |
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Виробник: TE Connectivity Passive Product
Description: RES SMD 66.5 OHM 0.1% 1/6W 0603
Packaging: Cut Tape (CT)
Power (Watts): 0.167W, 1/6W
Tolerance: ±0.1%
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 66.5 Ohms
Description: RES SMD 66.5 OHM 0.1% 1/6W 0603
Packaging: Cut Tape (CT)
Power (Watts): 0.167W, 1/6W
Tolerance: ±0.1%
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 66.5 Ohms
на замовлення 138 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 29.15 грн |
| 14+ | 19.92 грн |
| 50+ | 15.29 грн |
| 100+ | 12.74 грн |
| 110-99-950-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS TINLEAD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 50POS TINLEAD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 110-99-950-41-001000 |
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Виробник: Mill-Max
IC & Component Sockets 50 PIN STD SOLDER TAIL SKT 200u Sn
IC & Component Sockets 50 PIN STD SOLDER TAIL SKT 200u Sn
товар відсутній
| 110-99-950-61-001000 |
|
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
| 110-99-950-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 110-99-952-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS TINLEAD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 52POS TINLEAD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 110-99-952-41-001000 |
|
Виробник: Mill-Max
IC & Component Sockets 52 PIN STD SOLDER TAIL SKT 200u Sn
IC & Component Sockets 52 PIN STD SOLDER TAIL SKT 200u Sn
товар відсутній
| 110-99-952-61-001000 |
|
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
| 110-99-952-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
| CYBL10999-56LQXIT |
|
Виробник: Infineon Technologies
Description: IC RF TXRX+MCU BLUETOOTH 56UFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-UFQFN Exposed Pad
Sensitivity: -89dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 3dBm
Protocol: Bluetooth v4.1
Current - Receiving: 16.4mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.6mA
Supplier Device Package: 56-QFN (7x7)
GPIO: 36
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLUETOOTH 56UFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-UFQFN Exposed Pad
Sensitivity: -89dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 3dBm
Protocol: Bluetooth v4.1
Current - Receiving: 16.4mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.6mA
Supplier Device Package: 56-QFN (7x7)
GPIO: 36
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
товар відсутній
| MSC8156TAG1000B |
Виробник: NXP USA Inc.
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Six Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
товар відсутній
| PICOIMX6Q10R1GBSDBW |
|
Виробник: TechNexion
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: 0°C ~ 60°C
Core Processor: ARM® Cortex®-A9, i.MX6Quad
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: H.264, MIPI CSI
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 4
RAM Capacity/Installed: 1GB/1GB
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: 0°C ~ 60°C
Core Processor: ARM® Cortex®-A9, i.MX6Quad
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: H.264, MIPI CSI
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 4
RAM Capacity/Installed: 1GB/1GB
товар відсутній
| PICOIMX6Q10R1GBSDBWTE |
|
Виробник: TechNexion
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: -20°C ~ 70°C
Core Processor: ARM® Cortex®-A9, i.MX6Quad
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: H.264, MIPI CSI
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 4
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: -20°C ~ 70°C
Core Processor: ARM® Cortex®-A9, i.MX6Quad
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: H.264, MIPI CSI
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 4
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
товар відсутній
| PICOIMX6QPOPR10SDBW |
Виробник: TechNexion
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: 0°C ~ 60°C
Core Processor: ARM® Cortex®-A9, i.MX6Quad
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: H.264, MIPI CSI
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 4
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
Description: SBC 1GHZ 4 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: 0°C ~ 60°C
Core Processor: ARM® Cortex®-A9, i.MX6Quad
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: H.264, MIPI CSI
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 4
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
товар відсутній
| PICOIMX6U10R1GBSDBWTE |
|
Виробник: TechNexion
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: -20°C ~ 70°C
Core Processor: ARM® Cortex®-A9, i.MX6DualLite
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: H.264, MIPI CSI
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 2
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: -20°C ~ 70°C
Core Processor: ARM® Cortex®-A9, i.MX6DualLite
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: H.264, MIPI CSI
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 2
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
товар відсутній
| PICOIMX7DR10MSDBW |
|
Виробник: TechNexion
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: 0°C ~ 60°C
Core Processor: ARM® Cortex®-A7 + M4, i.MX7Dual
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: MIPI-CSI, MIPI-DSI
Ethernet: RGMII
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 2
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: 0°C ~ 60°C
Core Processor: ARM® Cortex®-A7 + M4, i.MX7Dual
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: MIPI-CSI, MIPI-DSI
Ethernet: RGMII
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 2
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
товар відсутній
| PICOIMX7DR10MSDBWTE |
|
Виробник: TechNexion
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: -20°C ~ 70°C
Core Processor: ARM® Cortex®-A7 + M4, i.MX7Dual
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: MIPI-CSI, MIPI-DSI
Ethernet: RGMII
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 2
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
Description: SBC 1GHZ 2 CORE 1GB/1GB RAM
Packaging: Bulk
Size / Dimension: 1.570" x 1.460" (40.00mm x 37.00mm)
Speed: 1GHz
Operating Temperature: -20°C ~ 70°C
Core Processor: ARM® Cortex®-A7 + M4, i.MX7Dual
Form Factor: PICO
Expansion Site/Bus: CANbus, GPIO, I2C, PCIe, SPI, TTL, UART
Video Outputs: MIPI-CSI, MIPI-DSI
Ethernet: RGMII
USB: USB, USB OTG
Watchdog Timer: No
Storage Interface: eMMC, microSD
Number of Cores: 2
RAM Capacity/Installed: 1GB/1GB
Part Status: Active
товар відсутній
| RP73PF1J66R5BTDF |
|
Виробник: TE Connectivity Passive Product
Description: RES SMD 66.5 OHM 0.1% 1/6W 0603
Packaging: Tape & Reel (TR)
Power (Watts): 0.167W, 1/6W
Tolerance: ±0.1%
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 66.5 Ohms
Description: RES SMD 66.5 OHM 0.1% 1/6W 0603
Packaging: Tape & Reel (TR)
Power (Watts): 0.167W, 1/6W
Tolerance: ±0.1%
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: ±25ppm/°C
Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
Composition: Thin Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0603
Height - Seated (Max): 0.022" (0.55mm)
Part Status: Active
Resistance: 66.5 Ohms
товар відсутній
| STW32N65M5 |
|
Виробник: STMicroelectronics
Description: MOSFET N-CH 650V 24A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 24A (Tc)
Rds On (Max) @ Id, Vgs: 119mOhm @ 12A, 10V
Power Dissipation (Max): 150W (Tc)
Vgs(th) (Max) @ Id: 5V @ 250µA
Supplier Device Package: TO-247-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 72 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3320 pF @ 100 V
Description: MOSFET N-CH 650V 24A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 24A (Tc)
Rds On (Max) @ Id, Vgs: 119mOhm @ 12A, 10V
Power Dissipation (Max): 150W (Tc)
Vgs(th) (Max) @ Id: 5V @ 250µA
Supplier Device Package: TO-247-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±25V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 72 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3320 pF @ 100 V
товар відсутній
| TGF2023-2-10 |
|
Виробник: Qorvo
RF JFET Transistors DC-18GHZ 50W TQGaN25 PAE 69.5% Gain 19dB
RF JFET Transistors DC-18GHZ 50W TQGaN25 PAE 69.5% Gain 19dB
товар відсутній
| TGF2023-2-20 |
|
Виробник: Qorvo
RF JFET Transistors DC-18GHZ 90W TQGaN25 PAE 70.5% Gain 19dB
RF JFET Transistors DC-18GHZ 90W TQGaN25 PAE 70.5% Gain 19dB
товар відсутній
| VL5A000B-CZB00-000 |
Виробник: Carling Technologies
Description: SWITCH ROCKER DPDT 15A 125V
Packaging: Bulk
Current Rating (Amps): 15A (AC)
Mounting Type: Panel Mount, Snap-In
Circuit: DPDT
Switch Function: Mom-Off-Mom
Operating Temperature: -40°C ~ 85°C
Termination Style: Quick Connect - 0.250" (6.3mm)
Actuator Type: Convex (Reverse V)
Approval Agency: CSA, UL, VDE
Ingress Protection: IP66/IP68 - Dust Tight, Water Resistant, Waterproof
Panel Cutout Dimensions: Rectangular - 36.83mm x 21.08mm
Color - Actuator/Cap: Black
Actuator Marking: No Marking
Voltage Rating - AC: 125 V
Description: SWITCH ROCKER DPDT 15A 125V
Packaging: Bulk
Current Rating (Amps): 15A (AC)
Mounting Type: Panel Mount, Snap-In
Circuit: DPDT
Switch Function: Mom-Off-Mom
Operating Temperature: -40°C ~ 85°C
Termination Style: Quick Connect - 0.250" (6.3mm)
Actuator Type: Convex (Reverse V)
Approval Agency: CSA, UL, VDE
Ingress Protection: IP66/IP68 - Dust Tight, Water Resistant, Waterproof
Panel Cutout Dimensions: Rectangular - 36.83mm x 21.08mm
Color - Actuator/Cap: Black
Actuator Marking: No Marking
Voltage Rating - AC: 125 V
товар відсутній
| VVGZC84-400 |
товар відсутній