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Мінімальне замовлення: 2
Мінімальне замовлення: 4
Мінімальне замовлення: 5
Мінімальне замовлення: 18
Мінімальне замовлення: 3
Мінімальне замовлення: 2
Мінімальне замовлення: 10000
Мінімальне замовлення: 45
Мінімальне замовлення: 44
Мінімальне замовлення: 3
Мінімальне замовлення: 4000
Мінімальне замовлення: 8
Мінімальне замовлення: 11
Мінімальне замовлення: 10000
Мінімальне замовлення: 5
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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Флюс універсальний безвідмивний, FVS-7 NC (no clean), 30мл Код товару: 130641 |
Паяльне обладнання, витратні матеріали для пайки > Флюси для пайки Категорія: Активний флюс Опис: Флюс використовується для пайки металевих контактів, плат і металоконструкцій: мідних, залужених, залізних, нікелевих, бронзових, латунних, оцинкованих поверхонь, нержавіючих сталей та інших сплавів. Вага/Об’єм/К-сть: 30 ml |
у наявності: 61 шт
очікується:
9 шт
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10106813-064112LF | Amphenol ICC (FCI) |
Description: CONN SELF-MATE 60POS SMD GOLD Packaging: Cut Tape (CT) Features: Board Guide, Solder Retention Connector Type: Self Mating, Non-Gendered, Hermaphroditic Contact Finish: Gold or Gold, GXT™ Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.020" (0.50mm) Height Above Board: 0.199" (5.05mm) Contact Finish Thickness: 15.0µin (0.38µm) Mated Stacking Heights: 5.5mm, 6.5mm, 7mm Part Status: Active Number of Rows: 2 |
на замовлення 886 шт: термін постачання 21-31 дні (днів) |
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110-41-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 67 шт: термін постачання 21-31 дні (днів) |
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110-41-306-41-001000 | Mill-Max | IC & Component Sockets 6P DIP SOCKET |
на замовлення 1157 шт: термін постачання 21-30 дні (днів) |
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110-91-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 6POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 82 шт: термін постачання 21-31 дні (днів) |
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110-91-306-41-001000 | Mill-Max | IC & Component Sockets 6P TIN PIN GOLD CONT |
на замовлення 1978 шт: термін постачання 21-30 дні (днів) |
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160013-0641 | Molex | Automotive Connectors AK50 HYB HDR 56Ckt Key4&1/56 |
на замовлення 258 шт: термін постачання 21-30 дні (днів) |
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1600130641 | Molex |
Description: AK50 HYB HDR ASSY 56 CKT KEY4&1/ Packaging: Tube Features: Board Guide Connector Type: Header Voltage Rating: 500VDC Mounting Type: Through Hole, Right Angle Number of Positions: 56 (28 + 28) Style: Board to Cable/Wire Operating Temperature: -40°C ~ 85°C Contact Type: Male Blade Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Contact Material: Copper Alloy Insulation Color: Gray Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Contact Shape: Rectangular Contact Length - Post: 0.083" (2.11mm) Insulation Height: 0.902" (22.90mm) Shrouding: Shrouded - 4 Wall Insulation Material: Syndiotactic Polystyrene (SPS) |
на замовлення 111295 шт: термін постачання 21-31 дні (днів) |
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10106813-064112LF | AFCI |
на замовлення 31613 шт: термін постачання 14-28 дні (днів) |
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08055C104M4T4A | KYOCERA AVX |
Description: CAP CER 0.1UF 50V X7R 0805 Packaging: Cut Tape (CT) Tolerance: ±20% Voltage - Rated: 50V Package / Case: 0805 (2012 Metric) Temperature Coefficient: X7R Size / Dimension: 0.079" L x 0.049" W (2.01mm x 1.25mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Automotive Ratings: AEC-Q200 Thickness (Max): 0.050" (1.27mm) Part Status: Active Capacitance: 0.1 µF |
на замовлення 9056 шт: термін постачання 21-31 дні (днів) |
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3064108 | Phoenix Contact | DIN Rail Terminal Blocks UT 2.5-MTD BU |
на замовлення 199 шт: термін постачання 21-30 дні (днів) |
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3064124 | Phoenix Contact | DIN Rail Terminal Blocks UT 2.5-MTD-PE 26-12AWG 20A |
на замовлення 329 шт: термін постачання 72-81 дні (днів) |
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3064137 | Phoenix Contact | DIN Rail Terminal Blocks UT 2.5-MTD-DIO/L-R 26-12AWG 20A W/DIODE |
на замовлення 50 шт: термін постачання 50-59 дні (днів) |
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3064140 | Phoenix Contact | DIN Rail Terminal Blocks UT 2.5-MTD-DIO/R-L 26-12AWG 20A W/DIODE |
на замовлення 217 шт: термін постачання 21-30 дні (днів) |
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6EP14372BA20 | Siemens |
Description: AC/DC DIN RAIL SUPPLY 24V 960W Packaging: Bulk Power (Watts): 960W Features: Adjustable Output, IP20 Size / Dimension: 4.92" L x 3.54" W x 4.92" H (125.0mm x 90.0mm x 125.0mm) Operating Temperature: -25°C ~ 70°C (With Derating) Applications: Hazardous Locations, Industrial, ITE (Commercial) Input Type: AC Approval Agency: CB, cCSAus, CE, CSA, cUL, cULus, UL Efficiency: 91.5% Current - Output (Max): 40A Voltage - Output 1: 24V Part Status: Active Number of Outputs: 1 Standard Number: 60950-1; UL 508 AC Voltage - Input: 400 ~ 500 VAC |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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AC0402KRX7R7BB473 | YAGEO |
Description: CAP CER 0.047UF 16V X7R 0402 Packaging: Tape & Reel (TR) Tolerance: ±10% Voltage - Rated: 16V Package / Case: 0402 (1005 Metric) Temperature Coefficient: X7R Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Automotive Ratings: AEC-Q200 Thickness (Max): 0.022" (0.55mm) Part Status: Active Capacitance: 0.047 µF |
на замовлення 40000 шт: термін постачання 21-31 дні (днів) |
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AC0402KRX7R7BB473 | YAGEO |
Description: CAP CER 0.047UF 16V X7R 0402 Packaging: Cut Tape (CT) Tolerance: ±10% Voltage - Rated: 16V Package / Case: 0402 (1005 Metric) Temperature Coefficient: X7R Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Automotive Ratings: AEC-Q200 Thickness (Max): 0.022" (0.55mm) Part Status: Active Capacitance: 0.047 µF |
на замовлення 61502 шт: термін постачання 21-31 дні (днів) |
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ADS8324E/250 | Texas Instruments |
Description: IC ADC 14BIT SAR 8VSSOP Packaging: Bulk Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Number of Bits: 14 Configuration: S/H-ADC Data Interface: SPI Reference Type: External Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 1.8V ~ 3.6V Voltage - Supply, Digital: 1.8V ~ 3.6V Sampling Rate (Per Second): 50k Input Type: Differential, Single Ended Number of Inputs: 1 Supplier Device Package: 8-VSSOP Architecture: SAR Ratio - S/H:ADC: 1:1 Part Status: Active Number of A/D Converters: 1 |
на замовлення 121 шт: термін постачання 21-31 дні (днів) |
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CGA6P3X8R1E475M250AB | TDK Corporation |
Description: CAP CER 4.7UF 25V X8R 1210 Tolerance: ±20% Features: High Temperature Packaging: Cut Tape (CT) Voltage - Rated: 25V Package / Case: 1210 (3225 Metric) Temperature Coefficient: X8R Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 150°C Applications: Automotive Ratings: AEC-Q200 Thickness (Max): 0.110" (2.80mm) Part Status: Active Capacitance: 4.7 µF |
на замовлення 499 шт: термін постачання 21-31 дні (днів) |
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CRGP2010F27R | TE Connectivity Passive Product |
Description: RES 27 OHM 1% 1.25W 2010 Packaging: Tape & Reel (TR) Power (Watts): 1.25W Tolerance: ±1% Features: Pulse Withstanding Package / Case: 2010 (5025 Metric) Temperature Coefficient: ±100ppm/°C Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Composition: Thick Film Operating Temperature: -55°C ~ 155°C Number of Terminations: 2 Supplier Device Package: 2010 Height - Seated (Max): 0.026" (0.65mm) Part Status: Active Resistance: 27 Ohms |
на замовлення 192000 шт: термін постачання 21-31 дні (днів) |
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CRGP2010F27R | TE Connectivity Passive Product |
Description: RES 27 OHM 1% 1.25W 2010 Packaging: Cut Tape (CT) Power (Watts): 1.25W Tolerance: ±1% Features: Pulse Withstanding Package / Case: 2010 (5025 Metric) Temperature Coefficient: ±100ppm/°C Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm) Composition: Thick Film Operating Temperature: -55°C ~ 155°C Number of Terminations: 2 Supplier Device Package: 2010 Height - Seated (Max): 0.026" (0.65mm) Part Status: Active Resistance: 27 Ohms |
на замовлення 199963 шт: термін постачання 21-31 дні (днів) |
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OKDL-T/6-W12-001-C | Murata Power Solutions Inc. |
Description: DC DC CONVERTER 0.6-5V Packaging: Cut Tape (CT) Features: Remote On/Off, OCP, OTP, OVP, UVLO Package / Case: 32-BLGA Module Size / Dimension: 0.48" L x 0.48" W x 0.32" H (12.2mm x 12.2mm x 8.0mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module, Digital Operating Temperature: -40°C ~ 120°C Applications: ITE (Commercial) Voltage - Input (Max): 14V Efficiency: 95.6% Current - Output (Max): 6A Voltage - Input (Min): 4.5V Voltage - Output 1: 0.6 ~ 5V Control Features: Enable, Active High Part Status: Obsolete Number of Outputs: 1 |
на замовлення 134 шт: термін постачання 21-31 дні (днів) |
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PESD24VF1BLYL | Nexperia USA Inc. |
Description: TVS DIODE 24VWM 17VC DFN1006-2 Packaging: Cut Tape (CT) Package / Case: SOD-882 Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TA) Capacitance @ Frequency: 0.3pF @ 1MHz Current - Peak Pulse (10/1000µs): 1A (8/20µs) Voltage - Reverse Standoff (Typ): 24V (Max) Supplier Device Package: DFN1006-2 Bidirectional Channels: 1 Voltage - Breakdown (Min): 24.5V Voltage - Clamping (Max) @ Ipp: 17V Power Line Protection: No Part Status: Active Grade: Automotive Qualification: AEC-Q101 |
на замовлення 207359 шт: термін постачання 21-31 дні (днів) |
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PESD24VF1BLYL | Nexperia USA Inc. |
Description: TVS DIODE 24VWM 17VC DFN1006-2 Packaging: Tape & Reel (TR) Package / Case: SOD-882 Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TA) Capacitance @ Frequency: 0.3pF @ 1MHz Current - Peak Pulse (10/1000µs): 1A (8/20µs) Voltage - Reverse Standoff (Typ): 24V (Max) Supplier Device Package: DFN1006-2 Bidirectional Channels: 1 Voltage - Breakdown (Min): 24.5V Voltage - Clamping (Max) @ Ipp: 17V Power Line Protection: No Grade: Automotive Part Status: Active Qualification: AEC-Q101 |
на замовлення 200000 шт: термін постачання 21-31 дні (днів) |
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SPR-P18/11 | Ferroxcube |
Description: SPRING Packaging: Bulk For Use With/Related Products: P Accessory Type: Spring Supplier Device Package: P 18 x 11 Part Status: Active |
на замовлення 1149 шт: термін постачання 21-31 дні (днів) |
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13064/1 | ITT Cannon | ITT Cannon |
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1306410000 | Weidmuller | PCB plug-in connector, female plug, 5.08 mm, 2 Pole, ST, Screw connection |
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1306413 | BOSSARD |
Category: Safety pins Description: Cylindrical stud; hardened steel; BN 858; Ø: 3mm; L: 50mm; DIN 6325 Type of protective element: cylindrical stud Material: hardened steel BN standard: BN 858 Diameter: 3mm Length: 50mm DIN standard: DIN 6325 Protecting element features: tolerance class h6 |
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1306413 | BOSSARD |
Category: Safety pins Description: Cylindrical stud; hardened steel; BN 858; Ø: 3mm; L: 50mm; DIN 6325 Type of protective element: cylindrical stud Material: hardened steel BN standard: BN 858 Diameter: 3mm Length: 50mm DIN standard: DIN 6325 Protecting element features: tolerance class h6 кількість в упаковці: 100 шт |
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10106813-064112LF | Amphenol FCI | Board to Board & Mezzanine Connectors 60P MEZZANINE 3.5MM HERMAPHRODITIC |
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10106813-064112LF | Amphenol ICC (FCI) |
Description: CONN SELF-MATE 60POS SMD GOLD Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Self Mating, Non-Gendered, Hermaphroditic Contact Finish: Gold or Gold, GXT™ Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.020" (0.50mm) Height Above Board: 0.199" (5.05mm) Contact Finish Thickness: 15.0µin (0.38µm) Mated Stacking Heights: 5.5mm, 6.5mm, 7mm Part Status: Active Number of Rows: 2 |
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104-11-306-41-770000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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104-11-306-41-780000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Press-Fit Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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110-11-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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110-41-306-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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110-41-306-41-105000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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110-41-306-41-605000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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110-41-306-41-605000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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110-91-306-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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110-91-306-41-605000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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110-91-306-41-605000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
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111-41-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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111-41-306-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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111-91-306-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
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111-91-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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114-41-306-41-117000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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114-91-306-41-117000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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115-41-306-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
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115-41-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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115-41-306-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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115-91-306-41-001000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
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115-91-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: SKT IC OPEN LOWPRO Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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115-91-306-41-003000 | Mill-Max Manufacturing Corp. |
Description: SOCKET IC OPEN LOWPRO .300 6POS Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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115-91-306-41-003000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
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116-41-306-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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116-41-306-41-006000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
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116-41-306-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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116-41-306-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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116-41-306-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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116-41-306-41-008000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
Флюс універсальний безвідмивний, FVS-7 NC (no clean), 30мл Код товару: 130641 |
Паяльне обладнання, витратні матеріали для пайки > Флюси для пайки
Категорія: Активний флюс
Опис: Флюс використовується для пайки металевих контактів, плат і металоконструкцій: мідних, залужених, залізних, нікелевих, бронзових, латунних, оцинкованих поверхонь, нержавіючих сталей та інших сплавів.
Вага/Об’єм/К-сть: 30 ml
Категорія: Активний флюс
Опис: Флюс використовується для пайки металевих контактів, плат і металоконструкцій: мідних, залужених, залізних, нікелевих, бронзових, латунних, оцинкованих поверхонь, нержавіючих сталей та інших сплавів.
Вага/Об’єм/К-сть: 30 ml
у наявності: 61 шт
очікується:
9 шт
Кількість | Ціна без ПДВ |
---|---|
1+ | 50 грн |
10106813-064112LF |
Виробник: Amphenol ICC (FCI)
Description: CONN SELF-MATE 60POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Self Mating, Non-Gendered, Hermaphroditic
Contact Finish: Gold or Gold, GXT™
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Height Above Board: 0.199" (5.05mm)
Contact Finish Thickness: 15.0µin (0.38µm)
Mated Stacking Heights: 5.5mm, 6.5mm, 7mm
Part Status: Active
Number of Rows: 2
Description: CONN SELF-MATE 60POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Self Mating, Non-Gendered, Hermaphroditic
Contact Finish: Gold or Gold, GXT™
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Height Above Board: 0.199" (5.05mm)
Contact Finish Thickness: 15.0µin (0.38µm)
Mated Stacking Heights: 5.5mm, 6.5mm, 7mm
Part Status: Active
Number of Rows: 2
на замовлення 886 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 273.75 грн |
10+ | 239.35 грн |
25+ | 226.73 грн |
50+ | 207.83 грн |
100+ | 197.94 грн |
250+ | 173.2 грн |
110-41-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 67 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 720.18 грн |
10+ | 614.69 грн |
25+ | 591.01 грн |
67+ | 532.44 грн |
110-41-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets 6P DIP SOCKET
IC & Component Sockets 6P DIP SOCKET
на замовлення 1157 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 79.49 грн |
10+ | 66.27 грн |
67+ | 51.72 грн |
536+ | 42.31 грн |
1005+ | 37.57 грн |
2546+ | 34.07 грн |
5025+ | 32.9 грн |
110-91-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 82 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 720.18 грн |
10+ | 614.69 грн |
25+ | 591.01 грн |
67+ | 532.44 грн |
110-91-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets 6P TIN PIN GOLD CONT
IC & Component Sockets 6P TIN PIN GOLD CONT
на замовлення 1978 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 63.36 грн |
10+ | 53.8 грн |
67+ | 39.71 грн |
536+ | 33.55 грн |
1005+ | 31.86 грн |
5025+ | 25.96 грн |
10050+ | 24.07 грн |
160013-0641 |
Виробник: Molex
Automotive Connectors AK50 HYB HDR 56Ckt Key4&1/56
Automotive Connectors AK50 HYB HDR 56Ckt Key4&1/56
на замовлення 258 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 516.3 грн |
10+ | 446.24 грн |
26+ | 377.66 грн |
104+ | 313.42 грн |
260+ | 312.77 грн |
507+ | 304.98 грн |
1001+ | 258.26 грн |
1600130641 |
Виробник: Molex
Description: AK50 HYB HDR ASSY 56 CKT KEY4&1/
Packaging: Tube
Features: Board Guide
Connector Type: Header
Voltage Rating: 500VDC
Mounting Type: Through Hole, Right Angle
Number of Positions: 56 (28 + 28)
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 85°C
Contact Type: Male Blade
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Contact Material: Copper Alloy
Insulation Color: Gray
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Rectangular
Contact Length - Post: 0.083" (2.11mm)
Insulation Height: 0.902" (22.90mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Syndiotactic Polystyrene (SPS)
Description: AK50 HYB HDR ASSY 56 CKT KEY4&1/
Packaging: Tube
Features: Board Guide
Connector Type: Header
Voltage Rating: 500VDC
Mounting Type: Through Hole, Right Angle
Number of Positions: 56 (28 + 28)
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 85°C
Contact Type: Male Blade
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Contact Material: Copper Alloy
Insulation Color: Gray
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Rectangular
Contact Length - Post: 0.083" (2.11mm)
Insulation Height: 0.902" (22.90mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Syndiotactic Polystyrene (SPS)
на замовлення 111295 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 305.34 грн |
13+ | 258.99 грн |
104+ | 206 грн |
1001+ | 160.18 грн |
08055C104M4T4A |
Виробник: KYOCERA AVX
Description: CAP CER 0.1UF 50V X7R 0805
Packaging: Cut Tape (CT)
Tolerance: ±20%
Voltage - Rated: 50V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.01mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.050" (1.27mm)
Part Status: Active
Capacitance: 0.1 µF
Description: CAP CER 0.1UF 50V X7R 0805
Packaging: Cut Tape (CT)
Tolerance: ±20%
Voltage - Rated: 50V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.079" L x 0.049" W (2.01mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.050" (1.27mm)
Part Status: Active
Capacitance: 0.1 µF
на замовлення 9056 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
18+ | 16.14 грн |
27+ | 10.07 грн |
50+ | 6.37 грн |
100+ | 4.78 грн |
500+ | 3.45 грн |
1000+ | 3.05 грн |
2500+ | 2.87 грн |
5000+ | 2.61 грн |
3064108 |
Виробник: Phoenix Contact
DIN Rail Terminal Blocks UT 2.5-MTD BU
DIN Rail Terminal Blocks UT 2.5-MTD BU
на замовлення 199 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 112.04 грн |
10+ | 98.5 грн |
25+ | 81.76 грн |
50+ | 77.87 грн |
100+ | 75.92 грн |
250+ | 68.13 грн |
500+ | 64.89 грн |
3064124 |
Виробник: Phoenix Contact
DIN Rail Terminal Blocks UT 2.5-MTD-PE 26-12AWG 20A
DIN Rail Terminal Blocks UT 2.5-MTD-PE 26-12AWG 20A
на замовлення 329 шт:
термін постачання 72-81 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 286.92 грн |
10+ | 274.61 грн |
25+ | 227.76 грн |
50+ | 211.54 грн |
100+ | 205.05 грн |
250+ | 187.53 грн |
500+ | 180.39 грн |
3064137 |
Виробник: Phoenix Contact
DIN Rail Terminal Blocks UT 2.5-MTD-DIO/L-R 26-12AWG 20A W/DIODE
DIN Rail Terminal Blocks UT 2.5-MTD-DIO/L-R 26-12AWG 20A W/DIODE
на замовлення 50 шт:
термін постачання 50-59 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 304.33 грн |
10+ | 283.57 грн |
25+ | 223.22 грн |
50+ | 213.49 грн |
100+ | 203.75 грн |
250+ | 198.56 грн |
500+ | 194.02 грн |
3064140 |
Виробник: Phoenix Contact
DIN Rail Terminal Blocks UT 2.5-MTD-DIO/R-L 26-12AWG 20A W/DIODE
DIN Rail Terminal Blocks UT 2.5-MTD-DIO/R-L 26-12AWG 20A W/DIODE
на замовлення 217 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 342.18 грн |
10+ | 322.37 грн |
25+ | 271.89 грн |
50+ | 244.63 грн |
100+ | 225.17 грн |
250+ | 202.45 грн |
500+ | 194.02 грн |
6EP14372BA20 |
Виробник: Siemens
Description: AC/DC DIN RAIL SUPPLY 24V 960W
Packaging: Bulk
Power (Watts): 960W
Features: Adjustable Output, IP20
Size / Dimension: 4.92" L x 3.54" W x 4.92" H (125.0mm x 90.0mm x 125.0mm)
Operating Temperature: -25°C ~ 70°C (With Derating)
Applications: Hazardous Locations, Industrial, ITE (Commercial)
Input Type: AC
Approval Agency: CB, cCSAus, CE, CSA, cUL, cULus, UL
Efficiency: 91.5%
Current - Output (Max): 40A
Voltage - Output 1: 24V
Part Status: Active
Number of Outputs: 1
Standard Number: 60950-1; UL 508
AC Voltage - Input: 400 ~ 500 VAC
Description: AC/DC DIN RAIL SUPPLY 24V 960W
Packaging: Bulk
Power (Watts): 960W
Features: Adjustable Output, IP20
Size / Dimension: 4.92" L x 3.54" W x 4.92" H (125.0mm x 90.0mm x 125.0mm)
Operating Temperature: -25°C ~ 70°C (With Derating)
Applications: Hazardous Locations, Industrial, ITE (Commercial)
Input Type: AC
Approval Agency: CB, cCSAus, CE, CSA, cUL, cULus, UL
Efficiency: 91.5%
Current - Output (Max): 40A
Voltage - Output 1: 24V
Part Status: Active
Number of Outputs: 1
Standard Number: 60950-1; UL 508
AC Voltage - Input: 400 ~ 500 VAC
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 42750.94 грн |
10+ | 40432.09 грн |
AC0402KRX7R7BB473 |
Виробник: YAGEO
Description: CAP CER 0.047UF 16V X7R 0402
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Voltage - Rated: 16V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.022" (0.55mm)
Part Status: Active
Capacitance: 0.047 µF
Description: CAP CER 0.047UF 16V X7R 0402
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Voltage - Rated: 16V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.022" (0.55mm)
Part Status: Active
Capacitance: 0.047 µF
на замовлення 40000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10000+ | 0.81 грн |
20000+ | 0.74 грн |
30000+ | 0.71 грн |
AC0402KRX7R7BB473 |
Виробник: YAGEO
Description: CAP CER 0.047UF 16V X7R 0402
Packaging: Cut Tape (CT)
Tolerance: ±10%
Voltage - Rated: 16V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.022" (0.55mm)
Part Status: Active
Capacitance: 0.047 µF
Description: CAP CER 0.047UF 16V X7R 0402
Packaging: Cut Tape (CT)
Tolerance: ±10%
Voltage - Rated: 16V
Package / Case: 0402 (1005 Metric)
Temperature Coefficient: X7R
Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.022" (0.55mm)
Part Status: Active
Capacitance: 0.047 µF
на замовлення 61502 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
45+ | 6.32 грн |
71+ | 3.85 грн |
122+ | 2.23 грн |
157+ | 1.62 грн |
500+ | 1.22 грн |
1000+ | 0.96 грн |
2500+ | 0.86 грн |
5000+ | 0.79 грн |
ADS8324E/250 |
Виробник: Texas Instruments
Description: IC ADC 14BIT SAR 8VSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.8V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.6V
Sampling Rate (Per Second): 50k
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 8-VSSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
Description: IC ADC 14BIT SAR 8VSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Bits: 14
Configuration: S/H-ADC
Data Interface: SPI
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.8V ~ 3.6V
Voltage - Supply, Digital: 1.8V ~ 3.6V
Sampling Rate (Per Second): 50k
Input Type: Differential, Single Ended
Number of Inputs: 1
Supplier Device Package: 8-VSSOP
Architecture: SAR
Ratio - S/H:ADC: 1:1
Part Status: Active
Number of A/D Converters: 1
на замовлення 121 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
44+ | 451.12 грн |
CGA6P3X8R1E475M250AB |
Виробник: TDK Corporation
Description: CAP CER 4.7UF 25V X8R 1210
Tolerance: ±20%
Features: High Temperature
Packaging: Cut Tape (CT)
Voltage - Rated: 25V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: X8R
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 150°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.110" (2.80mm)
Part Status: Active
Capacitance: 4.7 µF
Description: CAP CER 4.7UF 25V X8R 1210
Tolerance: ±20%
Features: High Temperature
Packaging: Cut Tape (CT)
Voltage - Rated: 25V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: X8R
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 150°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.110" (2.80mm)
Part Status: Active
Capacitance: 4.7 µF
на замовлення 499 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 96.16 грн |
10+ | 69.28 грн |
50+ | 63.21 грн |
100+ | 48.6 грн |
CRGP2010F27R |
Виробник: TE Connectivity Passive Product
Description: RES 27 OHM 1% 1.25W 2010
Packaging: Tape & Reel (TR)
Power (Watts): 1.25W
Tolerance: ±1%
Features: Pulse Withstanding
Package / Case: 2010 (5025 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 2010
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 27 Ohms
Description: RES 27 OHM 1% 1.25W 2010
Packaging: Tape & Reel (TR)
Power (Watts): 1.25W
Tolerance: ±1%
Features: Pulse Withstanding
Package / Case: 2010 (5025 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 2010
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 27 Ohms
на замовлення 192000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4000+ | 6.37 грн |
8000+ | 5.26 грн |
12000+ | 5.07 грн |
20000+ | 4.37 грн |
28000+ | 4.25 грн |
40000+ | 4.17 грн |
100000+ | 3.63 грн |
CRGP2010F27R |
Виробник: TE Connectivity Passive Product
Description: RES 27 OHM 1% 1.25W 2010
Packaging: Cut Tape (CT)
Power (Watts): 1.25W
Tolerance: ±1%
Features: Pulse Withstanding
Package / Case: 2010 (5025 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 2010
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 27 Ohms
Description: RES 27 OHM 1% 1.25W 2010
Packaging: Cut Tape (CT)
Power (Watts): 1.25W
Tolerance: ±1%
Features: Pulse Withstanding
Package / Case: 2010 (5025 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 2010
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 27 Ohms
на замовлення 199963 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
8+ | 36.5 грн |
15+ | 18.45 грн |
50+ | 12.65 грн |
100+ | 10.22 грн |
500+ | 7.5 грн |
1000+ | 6.65 грн |
OKDL-T/6-W12-001-C |
Виробник: Murata Power Solutions Inc.
Description: DC DC CONVERTER 0.6-5V
Packaging: Cut Tape (CT)
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Package / Case: 32-BLGA Module
Size / Dimension: 0.48" L x 0.48" W x 0.32" H (12.2mm x 12.2mm x 8.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module, Digital
Operating Temperature: -40°C ~ 120°C
Applications: ITE (Commercial)
Voltage - Input (Max): 14V
Efficiency: 95.6%
Current - Output (Max): 6A
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.6 ~ 5V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
Description: DC DC CONVERTER 0.6-5V
Packaging: Cut Tape (CT)
Features: Remote On/Off, OCP, OTP, OVP, UVLO
Package / Case: 32-BLGA Module
Size / Dimension: 0.48" L x 0.48" W x 0.32" H (12.2mm x 12.2mm x 8.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module, Digital
Operating Temperature: -40°C ~ 120°C
Applications: ITE (Commercial)
Voltage - Input (Max): 14V
Efficiency: 95.6%
Current - Output (Max): 6A
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.6 ~ 5V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
на замовлення 134 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1033.24 грн |
PESD24VF1BLYL |
Виробник: Nexperia USA Inc.
Description: TVS DIODE 24VWM 17VC DFN1006-2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 0.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 24.5V
Voltage - Clamping (Max) @ Ipp: 17V
Power Line Protection: No
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE 24VWM 17VC DFN1006-2
Packaging: Cut Tape (CT)
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 0.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 24.5V
Voltage - Clamping (Max) @ Ipp: 17V
Power Line Protection: No
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
на замовлення 207359 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
11+ | 26.67 грн |
16+ | 17.71 грн |
100+ | 8.95 грн |
500+ | 6.85 грн |
1000+ | 5.08 грн |
2000+ | 4.28 грн |
5000+ | 4.02 грн |
PESD24VF1BLYL |
Виробник: Nexperia USA Inc.
Description: TVS DIODE 24VWM 17VC DFN1006-2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 0.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 24.5V
Voltage - Clamping (Max) @ Ipp: 17V
Power Line Protection: No
Grade: Automotive
Part Status: Active
Qualification: AEC-Q101
Description: TVS DIODE 24VWM 17VC DFN1006-2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 0.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1A (8/20µs)
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 24.5V
Voltage - Clamping (Max) @ Ipp: 17V
Power Line Protection: No
Grade: Automotive
Part Status: Active
Qualification: AEC-Q101
на замовлення 200000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10000+ | 3.91 грн |
30000+ | 3.7 грн |
50000+ | 3.06 грн |
SPR-P18/11 |
Виробник: Ferroxcube
Description: SPRING
Packaging: Bulk
For Use With/Related Products: P
Accessory Type: Spring
Supplier Device Package: P 18 x 11
Part Status: Active
Description: SPRING
Packaging: Bulk
For Use With/Related Products: P
Accessory Type: Spring
Supplier Device Package: P 18 x 11
Part Status: Active
на замовлення 1149 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 66.68 грн |
10+ | 57.99 грн |
25+ | 42.96 грн |
50+ | 38.31 грн |
100+ | 34.28 грн |
250+ | 32.26 грн |
500+ | 29.75 грн |
1000+ | 25.78 грн |
1306410000 |
Виробник: Weidmuller
PCB plug-in connector, female plug, 5.08 mm, 2 Pole, ST, Screw connection
PCB plug-in connector, female plug, 5.08 mm, 2 Pole, ST, Screw connection
товар відсутній
1306413 |
Виробник: BOSSARD
Category: Safety pins
Description: Cylindrical stud; hardened steel; BN 858; Ø: 3mm; L: 50mm; DIN 6325
Type of protective element: cylindrical stud
Material: hardened steel
BN standard: BN 858
Diameter: 3mm
Length: 50mm
DIN standard: DIN 6325
Protecting element features: tolerance class h6
Category: Safety pins
Description: Cylindrical stud; hardened steel; BN 858; Ø: 3mm; L: 50mm; DIN 6325
Type of protective element: cylindrical stud
Material: hardened steel
BN standard: BN 858
Diameter: 3mm
Length: 50mm
DIN standard: DIN 6325
Protecting element features: tolerance class h6
товар відсутній
1306413 |
Виробник: BOSSARD
Category: Safety pins
Description: Cylindrical stud; hardened steel; BN 858; Ø: 3mm; L: 50mm; DIN 6325
Type of protective element: cylindrical stud
Material: hardened steel
BN standard: BN 858
Diameter: 3mm
Length: 50mm
DIN standard: DIN 6325
Protecting element features: tolerance class h6
кількість в упаковці: 100 шт
Category: Safety pins
Description: Cylindrical stud; hardened steel; BN 858; Ø: 3mm; L: 50mm; DIN 6325
Type of protective element: cylindrical stud
Material: hardened steel
BN standard: BN 858
Diameter: 3mm
Length: 50mm
DIN standard: DIN 6325
Protecting element features: tolerance class h6
кількість в упаковці: 100 шт
товар відсутній
10106813-064112LF |
Виробник: Amphenol FCI
Board to Board & Mezzanine Connectors 60P MEZZANINE 3.5MM HERMAPHRODITIC
Board to Board & Mezzanine Connectors 60P MEZZANINE 3.5MM HERMAPHRODITIC
товар відсутній
10106813-064112LF |
Виробник: Amphenol ICC (FCI)
Description: CONN SELF-MATE 60POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Connector Type: Self Mating, Non-Gendered, Hermaphroditic
Contact Finish: Gold or Gold, GXT™
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Height Above Board: 0.199" (5.05mm)
Contact Finish Thickness: 15.0µin (0.38µm)
Mated Stacking Heights: 5.5mm, 6.5mm, 7mm
Part Status: Active
Number of Rows: 2
Description: CONN SELF-MATE 60POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Board Guide, Solder Retention
Connector Type: Self Mating, Non-Gendered, Hermaphroditic
Contact Finish: Gold or Gold, GXT™
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Height Above Board: 0.199" (5.05mm)
Contact Finish Thickness: 15.0µin (0.38µm)
Mated Stacking Heights: 5.5mm, 6.5mm, 7mm
Part Status: Active
Number of Rows: 2
товар відсутній
104-11-306-41-770000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
104-11-306-41-780000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
110-11-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
110-41-306-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
110-41-306-41-105000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
110-41-306-41-605000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
110-41-306-41-605000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
110-91-306-41-105000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
110-91-306-41-605000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
110-91-306-41-605000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
111-41-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
111-41-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
111-91-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
111-91-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
114-41-306-41-117000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
114-91-306-41-117000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
115-41-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
115-41-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
115-41-306-41-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
115-91-306-41-001000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
115-91-306-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT IC OPEN LOWPRO
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT IC OPEN LOWPRO
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
115-91-306-41-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET IC OPEN LOWPRO .300 6POS
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SOCKET IC OPEN LOWPRO .300 6POS
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
115-91-306-41-003000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
116-41-306-41-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-41-306-41-006000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
116-41-306-41-006000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-41-306-41-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-41-306-41-008000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
116-41-306-41-008000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
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