Результат пошуку "V1102SMDA" : 6
Вид перегляду :
Мінімальне замовлення: 4
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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V-1102-SMD/A-L | Assmann WSW Components |
 Description: HEATSINK TO-263 19.38X25.40MMPackaging: Bulk Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM Thermal Resistance @ Natural: 11.00°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
на замовлення 6587 шт: термін постачання 21-31 дні (днів) |
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V-1102-SMD/A | Assmann WSW Components |
FINGER-SHAPED SMD-HEATSINK |
товар відсутній |
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V-1102-SMD/A | Assmann WSW Components GMBH |
FINGER-SHAPED SMD-HEATSINK |
товар відсутній |
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| V-1102-SMD/A | Assmann WSW Components |
Description: STAMPED HEATSINK Packaging: Bulk Material: Copper Alloy Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-263 Attachment Method: SMD Pad Thermal Resistance @ Natural: 11.00°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin |
товар відсутній |
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| V-1102-SMD/A-1 | Assmann WSW Components | Stamped heatsink, SMT, C110019.4x25.4x11, SnASS_4930_HSrev00 |
товар відсутній |
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V-1102-SMD/A-L | Assmann WSW Components GMBH |
FINGER-SHAPED SMD-HEATSINK |
товар відсутній |
| V-1102-SMD/A-L |
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Виробник: Assmann WSW Components
Description: HEATSINK TO-263 19.38X25.40MM
Packaging: Bulk
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK TO-263 19.38X25.40MM
Packaging: Bulk
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
на замовлення 6587 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 88.44 грн |
| 10+ | 80.5 грн |
| 25+ | 78.38 грн |
| 50+ | 71.55 грн |
| 100+ | 67.58 грн |
| 250+ | 63.61 грн |
| 500+ | 58.66 грн |
| 1000+ | 54.75 грн |
| 5000+ | 52.79 грн |
| V-1102-SMD/A |
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Виробник: Assmann WSW Components
Description: STAMPED HEATSINK
Packaging: Bulk
Material: Copper Alloy
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-263
Attachment Method: SMD Pad
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Description: STAMPED HEATSINK
Packaging: Bulk
Material: Copper Alloy
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-263
Attachment Method: SMD Pad
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
товар відсутній
| V-1102-SMD/A-1 |
Виробник: Assmann WSW Components
Stamped heatsink, SMT, C110019.4x25.4x11, SnASS_4930_HSrev00
Stamped heatsink, SMT, C110019.4x25.4x11, SnASS_4930_HSrev00
товар відсутній