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15-91-0200 15-91-0200 Molex Headers & Wire Housings HDR DUAL SMT 20P
на замовлення 852 шт:
термін постачання 21-30 дні (днів)
2+196.07 грн
10+ 167.9 грн
100+ 118.1 грн
500+ 97.98 грн
1134+ 97.33 грн
2268+ 87.6 грн
Мінімальне замовлення: 2
15-91-0200 15-91-0200 Molex 0015910200displaypdf.pdf Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Top Entry SMD C-Grid Tube
на замовлення 1568 шт:
термін постачання 21-31 дні (днів)
97+118.79 грн
100+ 114.95 грн
250+ 111.36 грн
500+ 87.33 грн
1000+ 77.48 грн
Мінімальне замовлення: 97
15-91-0240 15-91-0240 Molex 0015910240displaypdf.pdf Conn Unshrouded Header HDR 24 POS 2.54mm Solder ST Top Entry SMD C-Grid Tube
на замовлення 5661 шт:
термін постачання 21-31 дні (днів)
94+122.62 грн
255+ 121.08 грн
459+ 118.79 грн
867+ 112.33 грн
3672+ 101.27 грн
5049+ 85.39 грн
Мінімальне замовлення: 94
15-91-0240 MOLEX / PARTNER STOCK 2694184.pdf Description: MOLEX / PARTNER STOCK - 15-91-0240 - Stiftleiste, Board-to-Board, Signal, Wire-to-Board, 2.54 mm, 2 Reihe(n), 24 Kontakt(e)
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 24Contacts
euEccn: NLR
Steckverbindersysteme: Board-to-Board, Signal, Wire-to-Board
Produktpalette: C-Grid 71308
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Rows
Rastermaß: 2.54mm
SVHC: No SVHC (14-Jun-2023)
на замовлення 2856 шт:
термін постачання 21-31 дні (днів)
51+131.03 грн
Мінімальне замовлення: 51
15-91-0260 15-91-0260 Molex Headers & Wire Housings 26P SMT VERT HDR
на замовлення 2460 шт:
термін постачання 21-30 дні (днів)
2+302.06 грн
10+ 271.63 грн
112+ 207.65 грн
256+ 175.2 грн
512+ 146 грн
1008+ 145.35 грн
Мінімальне замовлення: 2
0015910200 0015910200 Molex pgurl_5345805653286994.pdf Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Top Entry SMD C-Grid® Tube
на замовлення 1009 шт:
термін постачання 21-31 дні (днів)
0015910200 0015910200 Molex 015910200_sd.pdf Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
на замовлення 6589 шт:
термін постачання 21-31 дні (днів)
2+181.1 грн
21+ 153.34 грн
105+ 121.97 грн
1008+ 94.84 грн
5019+ 85.03 грн
Мінімальне замовлення: 2
382LX333M080B092VS 382LX333M080B092VS Cornell Dubilier Electronics (CDE) 380-382.pdf Description: CAP ALUM 33000UF 20% 80V SNAP
Tolerance: ±20%
Packaging: Bulk
Package / Case: Radial, Can - Snap-In - 5 Lead
Size / Dimension: 1.969" Dia (50.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Applications: General Purpose
Lifetime @ Temp.: 3000 Hrs @ 85°C
Height - Seated (Max): 3.701" (94.00mm)
Part Status: Active
Capacitance: 33000 µF
Voltage - Rated: 80 V
Ripple Current @ Low Frequency: 13.37 A @ 120 Hz
Ripple Current @ High Frequency: 15.38 A @ 20 kHz
на замовлення 458 шт:
термін постачання 21-31 дні (днів)
1+1530.91 грн
10+ 1358.01 грн
C1210C472JBGACAUTO C1210C472JBGACAUTO KEMET C1210C472JBGACAUTO Description: CAP CER 4700PF 630V C0G/NP0 1210
Tolerance: ±5%
Features: Low ESL, High Voltage
Packaging: Tape & Reel (TR)
Voltage - Rated: 630V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.087" (2.20mm)
Capacitance: 4700 pF
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
2000+26.86 грн
Мінімальне замовлення: 2000
C1210C472JBGACAUTO C1210C472JBGACAUTO KEMET C1210C472JBGACAUTO Description: CAP CER 4700PF 630V C0G/NP0 1210
Packaging: Cut Tape (CT)
Tolerance: ±5%
Features: Low ESL, High Voltage
Voltage - Rated: 630V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.087" (2.20mm)
Capacitance: 4700 pF
на замовлення 6230 шт:
термін постачання 21-31 дні (днів)
4+82.13 грн
10+ 59.55 грн
50+ 54.34 грн
100+ 41.78 грн
500+ 33.34 грн
1000+ 29.42 грн
Мінімальне замовлення: 4
REG1117FA-5.0/500 REG1117FA-5.0/500 Texas Instruments sbvs001d.pdf?t.download=true&u=5oefqw Description: IC REG LIN 5V 1A DDPAK/TO263-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 10 mA
Voltage - Input (Max): 15V
Number of Regulators: 1
Supplier Device Package: TO-263 (DDPAK-3)
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.55V @ 1A
Protection Features: Over Current, Over Temperature
на замовлення 756 шт:
термін постачання 21-31 дні (днів)
2+256.91 грн
10+ 222.18 грн
25+ 210.05 грн
100+ 170.85 грн
250+ 162.09 грн
Мінімальне замовлення: 2
REG1117FA-5.0/500 REG1117FA-5.0/500 Texas Instruments sbvs001d.pdf?t.download=true&u=5oefqw Description: IC REG LIN 5V 1A DDPAK/TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 10 mA
Voltage - Input (Max): 15V
Number of Regulators: 1
Supplier Device Package: TO-263 (DDPAK-3)
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.55V @ 1A
Protection Features: Over Current, Over Temperature
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
500+160.94 грн
Мінімальне замовлення: 500
STL130N6F7 STL130N6F7 STMicroelectronics STL130N6F7.pdf Description: MOSFET N-CH 60V 130A POWERFLAT
Packaging: Cut Tape (CT)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.5mOhm @ 13A, 10V
Power Dissipation (Max): 4.8W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: PowerFlat™ (5x6)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V
на замовлення 11427 шт:
термін постачання 21-31 дні (днів)
2+142.49 грн
10+ 113.89 грн
100+ 90.66 грн
500+ 71.99 грн
1000+ 61.08 грн
Мінімальне замовлення: 2
STL130N6F7 STL130N6F7 STMicroelectronics STL130N6F7.pdf Description: MOSFET N-CH 60V 130A POWERFLAT
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.5mOhm @ 13A, 10V
Power Dissipation (Max): 4.8W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: PowerFlat™ (5x6)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
3000+59.75 грн
Мінімальне замовлення: 3000
15-91-0207 15-91-0207 Molex Headers & Wire Housings CGrid SMT Hdr w/L.Pe g 15 SAu 20Ckt (320)
товар відсутній
15-91-0208 15-91-0208 Molex Headers & Wire Housings CGrid SMT Bkwy Hdr 1 5 SAu 20Ckt Tube(320
товар відсутній
15-91-0220 15-91-0220 Molex Headers & Wire Housings CGrid SMT Bkwy Hdr 1 dr 15 SAu 22Ckt Tube
товар відсутній
15-91-0228 15-91-0228 Molex Headers & Wire Housings CGrid SMT Bkwy Hdr 15 SAu 22Ckt Tube(3
товар відсутній
15-91-0240 15-91-0240 Molex 015911503_sd.pdf Headers & Wire Housings CGrid SMT Bkwy Hdr 1 dr 15 SAu 24Ckt Tube
товар відсутній
15-91-0247 15-91-0247 Molex Headers & Wire Housings CGrid SMT Hdr w/L.Pe g 15 SAu 24Ckt (320)
товар відсутній
15-91-0248 15-91-0248 Molex Headers & Wire Housings CGrid SMT Bkwy Hdr 15 SAu 24Ckt Tube(3
товар відсутній
15-91-0268 15-91-0268 Molex Headers & Wire Housings CGrid SMT Bkwy Hdr 15 SAu 26Ckt Tube(3
товар відсутній
15-91-0280 15-91-0280 Molex Headers & Wire Housings CGrid SMT Bkwy Hdr 1 dr 15 SAu 28Ckt Tube
товар відсутній
15-91-0288 15-91-0288 Molex Headers & Wire Housings CGrid SMT Bkwy Hdr 15 SAu 28Ckt Tube(3
товар відсутній
0015910200 0015910200 Molex 015910200_sd.pdf Headers & Wire Housings C-GRID 2.54MM HDR VT SMT 2X10
товар відсутній
0015910207 0015910207 Molex 015910207_sd.pdf Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Features: Board Guide
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910207 0015910207 Molex 0015910207_pcb_headers.pdf Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Top Entry SMD C-Grid® Tube
товар відсутній
0015910208 0015910208 Molex 015910208_sd.pdf Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910220 0015910220 Molex 0015910220_pcb_headers.pdf Conn Unshrouded Header HDR 22 POS 2.54mm Solder ST SMD C-Grid® Tube
товар відсутній
0015910220 0015910220 Molex 015910220_sd.pdf Description: CONN HEADER SMD 22POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 22
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
товар відсутній
0015910228 0015910228 Molex 015910228_sd.pdf Description: CONN HEADER SMD 22POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 22
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910240 0015910240 Molex 015911503_sd.pdf Description: CONN HEADER SMD 24POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 24
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
товар відсутній
0015910240 0015910240 Molex 0015910240_pcb_headers.pdf Conn Unshrouded Header HDR 24 POS 2.54mm Solder ST Top Entry SMD C-Grid® Tube
товар відсутній
0015910247 0015910247 Molex 015910247_sd.pdf Description: CONN HEADER SMD 24POS 2.54MM
Packaging: Tube
Features: Board Guide
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 24
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910248 0015910248 Molex 015910248_sd.pdf Description: CONN HEADER SMD 24POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 24
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910260 0015910260 Molex 015910260_sd.pdf Description: CONN HEADER SMD 26POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
товар відсутній
0015910260 0015910260 Molex 0015910260_pcb_headers.pdf Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD C-Grid® Tube
товар відсутній
0015910268 0015910268 Molex 015910268_sd.pdf Description: CONN HEADER SMD 26POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910280 0015910280 Molex 015910280_sd.pdf Description: CONN HEADER SMD 28POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 28
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
товар відсутній
0015910288 0015910288 Molex 015910288_sd.pdf Description: CONN HEADER SMD 28POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 28
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0877159102 0877159102 Molex 877159100_sd.pdf Description: CONN PCI EXP FMALE 64POS 0.039
Packaging: Tray
Features: Board Guide, Locking Ramp
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 64
Pitch: 0.039" (1.00mm)
Operating Temperature: -55°C ~ 85°C
Read Out: Dual
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder, Staggered
Contact Finish Thickness: 15.0µin (0.38µm)
Contact Material: Phosphor Bronze
Number of Rows: 2
товар відсутній
515-91-022-05-001001 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-022-05-001001 Mill-Max mill-max_mmmcd00046-98-1738312.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-022-05-001002 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-022-05-001002 Mill-Max 2017-11%3A138.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-022-05-001003 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-022-05-001003 Mill-Max 2017-11%3A138.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-025-05-000001 Mill-Max mill-max_mmmcd00046-98-1738312.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-025-05-000001 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 25 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-025-05-000002 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 25 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-025-05-000002 Mill-Max 2017-11%3A138.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-025-05-000003 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 25 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-025-05-000003 Mill-Max 2017-11%3A138.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-028-06-005001 Mill-Max mill-max_mmmcd00046-98-1738312.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-028-06-005001 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (6 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-028-06-005002 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (6 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-028-06-005002 Mill-Max 2017-11%3A138.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-028-06-005003 Mill-Max 2017-11%3A138.pdf IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-028-06-005003 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (6 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
76015-9102 76015-9102 Molex High Speed/Modular Connectors I-TRAC 7 ROW BP ASSY SY - 10C GD RT W/END
товар відсутній
15-91-0200
15-91-0200
Виробник: Molex
Headers & Wire Housings HDR DUAL SMT 20P
на замовлення 852 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна без ПДВ
2+196.07 грн
10+ 167.9 грн
100+ 118.1 грн
500+ 97.98 грн
1134+ 97.33 грн
2268+ 87.6 грн
Мінімальне замовлення: 2
15-91-0200 0015910200displaypdf.pdf
15-91-0200
Виробник: Molex
Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Top Entry SMD C-Grid Tube
на замовлення 1568 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
97+118.79 грн
100+ 114.95 грн
250+ 111.36 грн
500+ 87.33 грн
1000+ 77.48 грн
Мінімальне замовлення: 97
15-91-0240 0015910240displaypdf.pdf
15-91-0240
Виробник: Molex
Conn Unshrouded Header HDR 24 POS 2.54mm Solder ST Top Entry SMD C-Grid Tube
на замовлення 5661 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
94+122.62 грн
255+ 121.08 грн
459+ 118.79 грн
867+ 112.33 грн
3672+ 101.27 грн
5049+ 85.39 грн
Мінімальне замовлення: 94
15-91-0240 2694184.pdf
Виробник: MOLEX / PARTNER STOCK
Description: MOLEX / PARTNER STOCK - 15-91-0240 - Stiftleiste, Board-to-Board, Signal, Wire-to-Board, 2.54 mm, 2 Reihe(n), 24 Kontakt(e)
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 24Contacts
euEccn: NLR
Steckverbindersysteme: Board-to-Board, Signal, Wire-to-Board
Produktpalette: C-Grid 71308
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Rows
Rastermaß: 2.54mm
SVHC: No SVHC (14-Jun-2023)
на замовлення 2856 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
51+131.03 грн
Мінімальне замовлення: 51
15-91-0260
15-91-0260
Виробник: Molex
Headers & Wire Housings 26P SMT VERT HDR
на замовлення 2460 шт:
термін постачання 21-30 дні (днів)
Кількість Ціна без ПДВ
2+302.06 грн
10+ 271.63 грн
112+ 207.65 грн
256+ 175.2 грн
512+ 146 грн
1008+ 145.35 грн
Мінімальне замовлення: 2
0015910200 pgurl_5345805653286994.pdf
0015910200
Виробник: Molex
Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Top Entry SMD C-Grid® Tube
на замовлення 1009 шт:
термін постачання 21-31 дні (днів)
0015910200 015910200_sd.pdf
0015910200
Виробник: Molex
Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
на замовлення 6589 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+181.1 грн
21+ 153.34 грн
105+ 121.97 грн
1008+ 94.84 грн
5019+ 85.03 грн
Мінімальне замовлення: 2
382LX333M080B092VS 380-382.pdf
382LX333M080B092VS
Виробник: Cornell Dubilier Electronics (CDE)
Description: CAP ALUM 33000UF 20% 80V SNAP
Tolerance: ±20%
Packaging: Bulk
Package / Case: Radial, Can - Snap-In - 5 Lead
Size / Dimension: 1.969" Dia (50.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Applications: General Purpose
Lifetime @ Temp.: 3000 Hrs @ 85°C
Height - Seated (Max): 3.701" (94.00mm)
Part Status: Active
Capacitance: 33000 µF
Voltage - Rated: 80 V
Ripple Current @ Low Frequency: 13.37 A @ 120 Hz
Ripple Current @ High Frequency: 15.38 A @ 20 kHz
на замовлення 458 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1530.91 грн
10+ 1358.01 грн
C1210C472JBGACAUTO C1210C472JBGACAUTO
C1210C472JBGACAUTO
Виробник: KEMET
Description: CAP CER 4700PF 630V C0G/NP0 1210
Tolerance: ±5%
Features: Low ESL, High Voltage
Packaging: Tape & Reel (TR)
Voltage - Rated: 630V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.087" (2.20mm)
Capacitance: 4700 pF
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2000+26.86 грн
Мінімальне замовлення: 2000
C1210C472JBGACAUTO C1210C472JBGACAUTO
C1210C472JBGACAUTO
Виробник: KEMET
Description: CAP CER 4700PF 630V C0G/NP0 1210
Packaging: Cut Tape (CT)
Tolerance: ±5%
Features: Low ESL, High Voltage
Voltage - Rated: 630V
Package / Case: 1210 (3225 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.087" (2.20mm)
Capacitance: 4700 pF
на замовлення 6230 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4+82.13 грн
10+ 59.55 грн
50+ 54.34 грн
100+ 41.78 грн
500+ 33.34 грн
1000+ 29.42 грн
Мінімальне замовлення: 4
REG1117FA-5.0/500 sbvs001d.pdf?t.download=true&u=5oefqw
REG1117FA-5.0/500
Виробник: Texas Instruments
Description: IC REG LIN 5V 1A DDPAK/TO263-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 10 mA
Voltage - Input (Max): 15V
Number of Regulators: 1
Supplier Device Package: TO-263 (DDPAK-3)
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.55V @ 1A
Protection Features: Over Current, Over Temperature
на замовлення 756 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+256.91 грн
10+ 222.18 грн
25+ 210.05 грн
100+ 170.85 грн
250+ 162.09 грн
Мінімальне замовлення: 2
REG1117FA-5.0/500 sbvs001d.pdf?t.download=true&u=5oefqw
REG1117FA-5.0/500
Виробник: Texas Instruments
Description: IC REG LIN 5V 1A DDPAK/TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 10 mA
Voltage - Input (Max): 15V
Number of Regulators: 1
Supplier Device Package: TO-263 (DDPAK-3)
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.55V @ 1A
Protection Features: Over Current, Over Temperature
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
500+160.94 грн
Мінімальне замовлення: 500
STL130N6F7 STL130N6F7.pdf
STL130N6F7
Виробник: STMicroelectronics
Description: MOSFET N-CH 60V 130A POWERFLAT
Packaging: Cut Tape (CT)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.5mOhm @ 13A, 10V
Power Dissipation (Max): 4.8W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: PowerFlat™ (5x6)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V
на замовлення 11427 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+142.49 грн
10+ 113.89 грн
100+ 90.66 грн
500+ 71.99 грн
1000+ 61.08 грн
Мінімальне замовлення: 2
STL130N6F7 STL130N6F7.pdf
STL130N6F7
Виробник: STMicroelectronics
Description: MOSFET N-CH 60V 130A POWERFLAT
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.5mOhm @ 13A, 10V
Power Dissipation (Max): 4.8W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: PowerFlat™ (5x6)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2600 pF @ 25 V
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3000+59.75 грн
Мінімальне замовлення: 3000
15-91-0207
15-91-0207
Виробник: Molex
Headers & Wire Housings CGrid SMT Hdr w/L.Pe g 15 SAu 20Ckt (320)
товар відсутній
15-91-0208
15-91-0208
Виробник: Molex
Headers & Wire Housings CGrid SMT Bkwy Hdr 1 5 SAu 20Ckt Tube(320
товар відсутній
15-91-0220
15-91-0220
Виробник: Molex
Headers & Wire Housings CGrid SMT Bkwy Hdr 1 dr 15 SAu 22Ckt Tube
товар відсутній
15-91-0228
15-91-0228
Виробник: Molex
Headers & Wire Housings CGrid SMT Bkwy Hdr 15 SAu 22Ckt Tube(3
товар відсутній
15-91-0240 015911503_sd.pdf
15-91-0240
Виробник: Molex
Headers & Wire Housings CGrid SMT Bkwy Hdr 1 dr 15 SAu 24Ckt Tube
товар відсутній
15-91-0247
15-91-0247
Виробник: Molex
Headers & Wire Housings CGrid SMT Hdr w/L.Pe g 15 SAu 24Ckt (320)
товар відсутній
15-91-0248
15-91-0248
Виробник: Molex
Headers & Wire Housings CGrid SMT Bkwy Hdr 15 SAu 24Ckt Tube(3
товар відсутній
15-91-0268
15-91-0268
Виробник: Molex
Headers & Wire Housings CGrid SMT Bkwy Hdr 15 SAu 26Ckt Tube(3
товар відсутній
15-91-0280
15-91-0280
Виробник: Molex
Headers & Wire Housings CGrid SMT Bkwy Hdr 1 dr 15 SAu 28Ckt Tube
товар відсутній
15-91-0288
15-91-0288
Виробник: Molex
Headers & Wire Housings CGrid SMT Bkwy Hdr 15 SAu 28Ckt Tube(3
товар відсутній
0015910200 015910200_sd.pdf
0015910200
Виробник: Molex
Headers & Wire Housings C-GRID 2.54MM HDR VT SMT 2X10
товар відсутній
0015910207 015910207_sd.pdf
0015910207
Виробник: Molex
Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Features: Board Guide
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910207 0015910207_pcb_headers.pdf
0015910207
Виробник: Molex
Conn Unshrouded Header HDR 20 POS 2.54mm Solder ST Top Entry SMD C-Grid® Tube
товар відсутній
0015910208 015910208_sd.pdf
0015910208
Виробник: Molex
Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910220 0015910220_pcb_headers.pdf
0015910220
Виробник: Molex
Conn Unshrouded Header HDR 22 POS 2.54mm Solder ST SMD C-Grid® Tube
товар відсутній
0015910220 015910220_sd.pdf
0015910220
Виробник: Molex
Description: CONN HEADER SMD 22POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 22
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
товар відсутній
0015910228 015910228_sd.pdf
0015910228
Виробник: Molex
Description: CONN HEADER SMD 22POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 22
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910240 015911503_sd.pdf
0015910240
Виробник: Molex
Description: CONN HEADER SMD 24POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 24
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
товар відсутній
0015910240 0015910240_pcb_headers.pdf
0015910240
Виробник: Molex
Conn Unshrouded Header HDR 24 POS 2.54mm Solder ST Top Entry SMD C-Grid® Tube
товар відсутній
0015910247 015910247_sd.pdf
0015910247
Виробник: Molex
Description: CONN HEADER SMD 24POS 2.54MM
Packaging: Tube
Features: Board Guide
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 24
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910248 015910248_sd.pdf
0015910248
Виробник: Molex
Description: CONN HEADER SMD 24POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 24
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910260 015910260_sd.pdf
0015910260
Виробник: Molex
Description: CONN HEADER SMD 26POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
товар відсутній
0015910260 0015910260_pcb_headers.pdf
0015910260
Виробник: Molex
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD C-Grid® Tube
товар відсутній
0015910268 015910268_sd.pdf
0015910268
Виробник: Molex
Description: CONN HEADER SMD 26POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0015910280 015910280_sd.pdf
0015910280
Виробник: Molex
Description: CONN HEADER SMD 28POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 28
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)
товар відсутній
0015910288 015910288_sd.pdf
0015910288
Виробник: Molex
Description: CONN HEADER SMD 28POS 2.54MM
Packaging: Tube
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 28
Number of Rows: 2
Style: Board to Board or Cable
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.090" (2.29mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.320" (8.13mm)
товар відсутній
0877159102 877159100_sd.pdf
0877159102
Виробник: Molex
Description: CONN PCI EXP FMALE 64POS 0.039
Packaging: Tray
Features: Board Guide, Locking Ramp
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 64
Pitch: 0.039" (1.00mm)
Operating Temperature: -55°C ~ 85°C
Read Out: Dual
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder, Staggered
Contact Finish Thickness: 15.0µin (0.38µm)
Contact Material: Phosphor Bronze
Number of Rows: 2
товар відсутній
515-91-022-05-001001 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-022-05-001001 mill-max_mmmcd00046-98-1738312.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-022-05-001002 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-022-05-001002 2017-11%3A138.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-022-05-001003 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-022-05-001003 2017-11%3A138.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-025-05-000001 mill-max_mmmcd00046-98-1738312.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-025-05-000001 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 25 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-025-05-000002 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 25 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-025-05-000002 2017-11%3A138.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-025-05-000003 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 25 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-025-05-000003 2017-11%3A138.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-028-06-005001 mill-max_mmmcd00046-98-1738312.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-028-06-005001 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (6 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-028-06-005002 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (6 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-028-06-005002 2017-11%3A138.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-028-06-005003 2017-11%3A138.pdf
Виробник: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL PGA SOCKET
товар відсутній
515-91-028-06-005003 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (6 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
76015-9102
76015-9102
Виробник: Molex
High Speed/Modular Connectors I-TRAC 7 ROW BP ASSY SY - 10C GD RT W/END
товар відсутній
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