Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 625FCPBGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A9
Supplier Device Package: 625-FCPBGA (21x21)
Ethernet: GbE (3)
USB: USB 2.0 + PHY (1), USB 3.0 + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Security Features: Secure Boot, TrustZone®
SATA: SATA 3Gbps (2)
Part Status: Obsolete

Виробник: EATON ELECTRIC
Category: Panel Mount Accessories
Description: Illuminating unit; 22mm; RMQ-Titan; -25÷70°C; Illumin: LED; front
Type of switch accessories: illuminating unit
Switch standard: 22mm
Manufacturer series: RMQ-Titan
Operating temperature: -25...70°C
Illumination: LED
Mounting: front
Leads: screw terminals
LED colour: white
Supply voltage: 12...30V AC; 12...30V DC
Operating current: 8...15mA

Виробник: NXP Semiconductors
8-bit Microcontrollers - MCU 8 Bit 96K FLASH 8K RAM

Виробник: TE Connectivity / AMP
Screws & Fasteners SCREW, CAP, BUTTON SOCKET HD, METRIC

Виробник: Vicor
Switching Power Supplies PFC Mini RoHS

Виробник: 3M
Description: CBL RIBN 34COND 0.05 GRAY 100'
Packaging: Bulk
Length: 100.0' (30.48m)
Wire Gauge: 28 AWG
Shielding: Unshielded
Jacket (Insulation) Material: Poly-Vinyl Chloride (PVC)
Conductor Strand: 7 Strands / 36 AWG
Pitch: 0.050" (1.27mm)
Operating Temperature: -20°C ~ 105°C
Number of Conductors: 34
Cable Type: Flat Cable, Ground Plane
Ratings: UL Style 2682
Jacket Color: Gray
Ribbon Thickness: 0.047" (1.19mm)
Ribbon Width: 1.950" (49.53mm)
Part Status: Obsolete
Voltage: 300 V

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 156

Виробник: NXP Semiconductors
ARM Microcontrollers - MCU Cortex M4F, 2MB, 100 MAPBGA

Виробник: NXP Semiconductors
Power Management Specialised - PMIC Safety power management IC, QFN56

Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified

Виробник: 3M
Description: CONN PLUG 30POS SMD GOLD
Features: Board Guide
Packaging: Tube
Connector Type: Plug, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.031" (0.80mm)
Height Above Board: 0.147" (3.72mm)
Contact Finish Thickness: 8.00µin (0.203µm)
Mated Stacking Heights: 4mm, 7mm
Part Status: Active
Number of Rows: 2

Виробник: NXP USA Inc.
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100

Виробник: NXP Semiconductors
16-bit Microcontrollers - MCU VMA16, 16K FLASH, 1K RAM, 48LQFP

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified

Виробник: NXP Semiconductors
32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 100