Результат пошуку "286551" : 20
Вид перегляду :
Мінімальне замовлення: 628
Мінімальне замовлення: 4
Мінімальне замовлення: 250
| Фото | Назва | Виробник | Інформація |
Доступність |
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2865515 | Phoenix Contact |
 Terminal Block Interface Modules MACX MCR-EX-SL-SD- 21-60-LP |
на замовлення 3 шт: термін постачання 21-30 дні (днів) |
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2865515 | Phoenix Contact |
Description: SOLENOID DRIVER 0.05A 12.9V LOAD Packaging: Bulk For Use With/Related Products: EX-I Series Mounting Type: DIN Rail Current - Output: 0.05A Type: Module Operating Temperature: -20°C ~ 55°C Voltage - Supply: Loop Power Voltage - Load: 12.9V Number of Motors: 1 Motor Type: Solenoid Control / Drive Type: Solenoid Wattage - Load: 1.4 W |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SN74HC139PWT | Texas Instruments |
Description: IC DECODER/DEMUX 1X2:4 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP Part Status: Discontinued at Digi-Key |
на замовлення 10500 шт: термін постачання 21-31 дні (днів) |
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SN74HC139PWT | Texas Instruments |
Description: IC DECODER/DEMUX 1X2:4 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP Part Status: Discontinued at Digi-Key |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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SN74HC139PWT | Texas Instruments |
Description: IC DECODER/DEMUX 1X2:4 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP Part Status: Discontinued at Digi-Key |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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TDA8026ET/C2,551 | NXP Semiconductors |
Interface - Specialised IC SMART CARD SLOT |
на замовлення 620 шт: термін постачання 21-30 дні (днів) |
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| TDA8026ET/C2,551 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 64TFBGA Packaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 2.7V ~ 5.5V Supplier Device Package: 64-TFBGA (7x7) Part Status: Active |
на замовлення 681 шт: термін постачання 21-31 дні (днів) |
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| 28-6551-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TIN Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товар відсутній |
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| 28-6551-10* | Aries Electronics |
IC & Component Sockets |
товар відсутній |
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28-6551-11 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS |
товар відсутній |
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| 28-6551-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
товар відсутній |
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28-6551-16 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS |
товар відсутній |
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| 28-6551-16 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товар відсутній |
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| 28-6551-18 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 250°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyetheretherketone (PEEK), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Nickel Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Nickel Part Status: Active |
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28-6551-18 | Aries Electronics |
IC & Component Sockets 28P UNIV ZIF SKT |
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| 1528655-1 | TE Application Tooling |
Description: FA HD-I 5SMPO130F LEADMAKER Packaging: Bulk For Use With/Related Products: Rectangular Connectors Tool Type: Applicator - HDI for Bench Press Wire Gauge or Range - mm²: 1.50 ~ 2.50mm² Tool Method: Automated Tool Type Feature: Terminator Ratcheting: No Ratchet Wire Entry Location: Side Entry |
товар відсутній |
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860010672003 | Würth Elektronik |
Description: CAP ALUM 0.33UF 20% 50V RADIAL Packaging: Tape & Box (TB) Tolerance: ±20% Package / Case: Radial, Can Size / Dimension: 0.197" Dia (5.00mm) Polarization: Polar Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C Applications: General Purpose Lead Spacing: 0.079" (2.00mm) Lifetime @ Temp.: 2000 Hrs @ 85°C Height - Seated (Max): 0.492" (12.50mm) Part Status: Obsolete Capacitance: 0.33 µF Voltage - Rated: 50 V Ripple Current @ Low Frequency: 5.5 mA @ 120 Hz Ripple Current @ High Frequency: 9.35 mA @ 100 kHz |
товар відсутній |
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SAF7730HV/N336,518 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Type: Car Signal Processor Operating Temperature: -40°C ~ 85°C (TA) Clock Rate: 400MHz Supplier Device Package: 144-HLQFP (20x20) |
товар відсутній |
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| SAF7730HV/N336,518 | NXP Semiconductors |
High Performance Digital Signal Processor |
товар відсутній |
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TDA8026ET/C2,551 | NXP Semiconductors |
Smart Card Interface 20MHz 3.3V/5V 665mW Tray 64-Pin TFBGA |
товар відсутній |
| 2865515 |
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Виробник: Phoenix Contact
Terminal Block Interface Modules MACX MCR-EX-SL-SD- 21-60-LP
Terminal Block Interface Modules MACX MCR-EX-SL-SD- 21-60-LP
на замовлення 3 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15349.04 грн |
| 2865515 |
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Виробник: Phoenix Contact
Description: SOLENOID DRIVER 0.05A 12.9V LOAD
Packaging: Bulk
For Use With/Related Products: EX-I Series
Mounting Type: DIN Rail
Current - Output: 0.05A
Type: Module
Operating Temperature: -20°C ~ 55°C
Voltage - Supply: Loop Power
Voltage - Load: 12.9V
Number of Motors: 1
Motor Type: Solenoid
Control / Drive Type: Solenoid
Wattage - Load: 1.4 W
Description: SOLENOID DRIVER 0.05A 12.9V LOAD
Packaging: Bulk
For Use With/Related Products: EX-I Series
Mounting Type: DIN Rail
Current - Output: 0.05A
Type: Module
Operating Temperature: -20°C ~ 55°C
Voltage - Supply: Loop Power
Voltage - Load: 12.9V
Number of Motors: 1
Motor Type: Solenoid
Control / Drive Type: Solenoid
Wattage - Load: 1.4 W
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13975.67 грн |
| SN74HC139PWT |
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Виробник: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 10500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 628+ | 31.51 грн |
| SN74HC139PWT |
|
Виробник: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 72.51 грн |
| 10+ | 62.3 грн |
| 25+ | 59.17 грн |
| 100+ | 45.61 грн |
| SN74HC139PWT |
|
Виробник: Texas Instruments
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Discontinued at Digi-Key
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 250+ | 47.18 грн |
| 500+ | 40.15 грн |
| TDA8026ET/C2,551 |
|
Виробник: NXP Semiconductors
Interface - Specialised IC SMART CARD SLOT
Interface - Specialised IC SMART CARD SLOT
на замовлення 620 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 402.53 грн |
| 10+ | 363.53 грн |
| 25+ | 270.11 грн |
| 416+ | 268.13 грн |
| 832+ | 201.1 грн |
| TDA8026ET/C2,551 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Part Status: Active
Description: IC INTERFACE SPECIALIZED 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 64-TFBGA (7x7)
Part Status: Active
на замовлення 681 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 395.26 грн |
| 10+ | 343.93 грн |
| 25+ | 327.97 грн |
| 80+ | 267.24 грн |
| 416+ | 255.24 грн |
| 28-6551-10 |
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Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
| 28-6551-11 |
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Виробник: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
товар відсутній
| 28-6551-11 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
| 28-6551-16 |
|
Виробник: Aries Electronics
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS
товар відсутній
| 28-6551-16 |
|
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
товар відсутній
| 28-6551-18 |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Part Status: Active
товар відсутній
| 1528655-1 |
|
Виробник: TE Application Tooling
Description: FA HD-I 5SMPO130F LEADMAKER
Packaging: Bulk
For Use With/Related Products: Rectangular Connectors
Tool Type: Applicator - HDI for Bench Press
Wire Gauge or Range - mm²: 1.50 ~ 2.50mm²
Tool Method: Automated
Tool Type Feature: Terminator
Ratcheting: No Ratchet
Wire Entry Location: Side Entry
Description: FA HD-I 5SMPO130F LEADMAKER
Packaging: Bulk
For Use With/Related Products: Rectangular Connectors
Tool Type: Applicator - HDI for Bench Press
Wire Gauge or Range - mm²: 1.50 ~ 2.50mm²
Tool Method: Automated
Tool Type Feature: Terminator
Ratcheting: No Ratchet
Wire Entry Location: Side Entry
товар відсутній
| 860010672003 |
|
Виробник: Würth Elektronik
Description: CAP ALUM 0.33UF 20% 50V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±20%
Package / Case: Radial, Can
Size / Dimension: 0.197" Dia (5.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Applications: General Purpose
Lead Spacing: 0.079" (2.00mm)
Lifetime @ Temp.: 2000 Hrs @ 85°C
Height - Seated (Max): 0.492" (12.50mm)
Part Status: Obsolete
Capacitance: 0.33 µF
Voltage - Rated: 50 V
Ripple Current @ Low Frequency: 5.5 mA @ 120 Hz
Ripple Current @ High Frequency: 9.35 mA @ 100 kHz
Description: CAP ALUM 0.33UF 20% 50V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±20%
Package / Case: Radial, Can
Size / Dimension: 0.197" Dia (5.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C
Applications: General Purpose
Lead Spacing: 0.079" (2.00mm)
Lifetime @ Temp.: 2000 Hrs @ 85°C
Height - Seated (Max): 0.492" (12.50mm)
Part Status: Obsolete
Capacitance: 0.33 µF
Voltage - Rated: 50 V
Ripple Current @ Low Frequency: 5.5 mA @ 120 Hz
Ripple Current @ High Frequency: 9.35 mA @ 100 kHz
товар відсутній
| SAF7730HV/N336,518 |
Виробник: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
товар відсутній
| SAF7730HV/N336,518 |
|
Виробник: NXP Semiconductors
High Performance Digital Signal Processor
High Performance Digital Signal Processor
товар відсутній
| TDA8026ET/C2,551 |
|
Виробник: NXP Semiconductors
Smart Card Interface 20MHz 3.3V/5V 665mW Tray 64-Pin TFBGA
Smart Card Interface 20MHz 3.3V/5V 665mW Tray 64-Pin TFBGA
товар відсутній