Результат пошуку "293299" : 9
Вид перегляду :
Мінімальне замовлення: 16261
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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MF3ICD4101DUD/05,0 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Interface: UART Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die |
на замовлення 16261 шт: термін постачання 21-31 дні (днів) |
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522-93-299-20-096001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 299 (20 x 20) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товар відсутній |
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522-93-299-20-096001 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
товар відсутній |
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522-93-299-20-096002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 299 (20 x 20) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товар відсутній |
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522-93-299-20-096002 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
товар відсутній |
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522-93-299-20-096003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 299 (20 x 20) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товар відсутній |
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522-93-299-20-096003 | Mill-Max | IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET |
товар відсутній |
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MF3ICD4101DUD/05,0 | NXP Semiconductors | High Performance NFC/RFID Transponder IC |
товар відсутній |
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MF3ICD4101DUD/05,0 | NXP Semiconductors | NFC/RFID Tags & Transponders MIFARE DESFIRE EV1 CONTACTLESS MULTIAPP |
товар відсутній |
MF3ICD4101DUD/05,0 |
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
на замовлення 16261 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
16261+ | 106.61 грн |
522-93-299-20-096001 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096001 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-93-299-20-096002 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096002 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-93-299-20-096003 |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096003 |
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
MF3ICD4101DUD/05,0 |
Виробник: NXP Semiconductors
High Performance NFC/RFID Transponder IC
High Performance NFC/RFID Transponder IC
товар відсутній
MF3ICD4101DUD/05,0 |
Виробник: NXP Semiconductors
NFC/RFID Tags & Transponders MIFARE DESFIRE EV1 CONTACTLESS MULTIAPP
NFC/RFID Tags & Transponders MIFARE DESFIRE EV1 CONTACTLESS MULTIAPP
товар відсутній