Результат пошуку "293299" : 9

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MF3ICD4101DUD/05,0 NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
на замовлення 16261 шт:
термін постачання 21-31 дні (днів)
16261+106.61 грн
Мінімальне замовлення: 16261
522-93-299-20-096001 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096001 Mill-Max 2017-11%3A138.pdf IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-93-299-20-096002 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096002 Mill-Max 2017-11%3A138.pdf IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-93-299-20-096003 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096003 Mill-Max mill-max_mmmcd00051-104-1738406.pdf IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
MF3ICD4101DUD/05,0 NXP Semiconductors mf3icd21_41_81_sds_2.pdf High Performance NFC/RFID Transponder IC
товар відсутній
MF3ICD4101DUD/05,0 NXP Semiconductors MF3ICDX21_41_81_SDS-1517338.pdf NFC/RFID Tags & Transponders MIFARE DESFIRE EV1 CONTACTLESS MULTIAPP
товар відсутній
MF3ICD4101DUD/05,0 MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
на замовлення 16261 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
16261+106.61 грн
Мінімальне замовлення: 16261
522-93-299-20-096001 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096001 2017-11%3A138.pdf
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-93-299-20-096002 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096002 2017-11%3A138.pdf
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
522-93-299-20-096003 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 299 (20 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товар відсутній
522-93-299-20-096003 mill-max_mmmcd00051-104-1738406.pdf
Виробник: Mill-Max
IC & Component Sockets STANDARD WIRE WRAP PGA SOCKET
товар відсутній
MF3ICD4101DUD/05,0 mf3icd21_41_81_sds_2.pdf
Виробник: NXP Semiconductors
High Performance NFC/RFID Transponder IC
товар відсутній
MF3ICD4101DUD/05,0 MF3ICDX21_41_81_SDS-1517338.pdf
Виробник: NXP Semiconductors
NFC/RFID Tags & Transponders MIFARE DESFIRE EV1 CONTACTLESS MULTIAPP
товар відсутній