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| Фото | Назва | Виробник | Інформація |
Доступність |
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| M550322A | MEIG SMART TECHNOLOGY |
 Category: IoT (WiFi/Bluetooth) modulesDescription: Module: WiFi Type of communications module: WiFi |
товар відсутній |
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| M550322A | MEIG SMART TECHNOLOGY |
Category: IoT (WiFi/Bluetooth) modules Description: Module: WiFi Type of communications module: WiFi кількість в упаковці: 1000 шт |
товар відсутній |
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| M550E00A | MEIG SMART TECHNOLOGY | SLM550E-EVB-KIT Development kits for data transmission |
товар відсутній |
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| M550E32A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 320kBSRAM,2GBRAM,8GBFLASH Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Memory: 320kB SRAM; 2GB RAM; 8GB FLASH Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA Dimensions: 40.5x40.5x2.8mm Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n Interface: ADC; GPIO; I2C; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART; USB Kind of network: Bluetooth 5; Bluetooth Low Energy; WiFi Operating temperature: -35...75°C Components: QCM2290 Operating system: Android 11.0 |
товар відсутній |
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| M550E32A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 320kBSRAM,2GBRAM,8GBFLASH Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Memory: 320kB SRAM; 2GB RAM; 8GB FLASH Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA Dimensions: 40.5x40.5x2.8mm Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n Interface: ADC; GPIO; I2C; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART; USB Kind of network: Bluetooth 5; Bluetooth Low Energy; WiFi Operating temperature: -35...75°C Components: QCM2290 Operating system: Android 11.0 кількість в упаковці: 1000 шт |
товар відсутній |
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M750ZE1A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Case: LCC Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Dimensions: 32x29x2.8mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB Kind of network: WiFi Operating temperature: -40...85°C |
на замовлення 40 шт: термін постачання 21-30 дні (днів) |
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M750ZE1A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Case: LCC Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Dimensions: 32x29x2.8mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB Kind of network: WiFi Operating temperature: -40...85°C кількість в упаковці: 1 шт |
на замовлення 40 шт: термін постачання 7-14 дні (днів) |
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| M758EVB1 | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SLM758NE Type of development kit: LTE Components: SLM758NE Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro |
товар відсутній |
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| M758EVB1 | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SLM758NE Type of development kit: LTE Components: SLM758NE Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro кількість в упаковці: 1 шт |
товар відсутній |
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| M758LEM1 | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SLM758LE Type of development kit: LTE Components: SLM758LE Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro |
товар відсутній |
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| M758LEM1 | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SLM758LE Type of development kit: LTE Components: SLM758LE Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro кількість в упаковці: 1 шт |
товар відсутній |
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| M813QEAA | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35 Type of communications module: 5G Transmission: 5G; LTE Dimensions: 32x29x2.4mm Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0 Operating temperature: -30...75°C Components: Qualcomm Snapdragon X35 Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78 |
товар відсутній |
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| M813QEAA | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35 Type of communications module: 5G Transmission: 5G; LTE Dimensions: 32x29x2.4mm Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0 Operating temperature: -30...75°C Components: Qualcomm Snapdragon X35 Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78 кількість в упаковці: 1 шт |
товар відсутній |
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M815N44A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm Type of communications module: IoT Case: M.2 Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G Dimensions: 30x52x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Operating temperature: -40...85°C Components: Qualcomm X62 |
на замовлення 5 шт: термін постачання 21-30 дні (днів) |
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M815N44A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm Type of communications module: IoT Case: M.2 Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G Dimensions: 30x52x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Operating temperature: -40...85°C Components: Qualcomm X62 кількість в упаковці: 1 шт |
на замовлення 5 шт: термін постачання 7-14 дні (днів) |
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M815NEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM815 Type of development kit: LTE Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB Components: SRM815 |
на замовлення 1 шт: термін постачання 21-30 дні (днів) |
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M815NEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM815 Type of development kit: LTE Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB Components: SRM815 кількість в упаковці: 1 шт |
на замовлення 1 шт: термін постачання 7-14 дні (днів) |
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| M820223B | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; M.2; LTE CAT12,LTE-FDD,LTE-TDD,WCDMA; 42x30x2.3mm Type of communications module: LTE Case: M.2 Transmission: LTE CAT12; LTE-FDD; LTE-TDD; WCDMA Dimensions: 42x30x2.3mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C |
товар відсутній |
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| M820223B | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; M.2; LTE CAT12,LTE-FDD,LTE-TDD,WCDMA; 42x30x2.3mm Type of communications module: LTE Case: M.2 Transmission: LTE CAT12; LTE-FDD; LTE-TDD; WCDMA Dimensions: 42x30x2.3mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C кількість в упаковці: 1 шт |
товар відсутній |
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M825N45A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: IoT; M.2; 5G,GNSS,LTE,LTE-FDD,LTE-TDD,Sub-6G Type of communications module: IoT Case: M.2 Transmission: 5G; GNSS; LTE; LTE-FDD; LTE-TDD; Sub-6G Dimensions: 30x52x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Operating temperature: -40...85°C Components: Qualcomm X62 |
на замовлення 4 шт: термін постачання 21-30 дні (днів) |
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M825N45A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: IoT; M.2; 5G,GNSS,LTE,LTE-FDD,LTE-TDD,Sub-6G Type of communications module: IoT Case: M.2 Transmission: 5G; GNSS; LTE; LTE-FDD; LTE-TDD; Sub-6G Dimensions: 30x52x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Operating temperature: -40...85°C Components: Qualcomm X62 кількість в упаковці: 1 шт |
на замовлення 4 шт: термін постачання 7-14 дні (днів) |
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M825W5GH | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation |
товар відсутній |
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M825W5GH | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation кількість в упаковці: 1 шт |
товар відсутній |
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| M825WN4A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: IoT; M.2; 5G,GNSS,LTE-FDD,LTE-TDD,WCDMA; 52x30x2.3mm Type of communications module: IoT Case: M.2 Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; WCDMA Dimensions: 52x30x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Operating temperature: -30...75°C Components: Qualcomm X62 |
товар відсутній |
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| M825WN4A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: IoT; M.2; 5G,GNSS,LTE-FDD,LTE-TDD,WCDMA; 52x30x2.3mm Type of communications module: IoT Case: M.2 Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; WCDMA Dimensions: 52x30x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Operating temperature: -30...75°C Components: Qualcomm X62 кількість в упаковці: 1 шт |
товар відсутній |
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M82824AA | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x4.5mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Kind of network: WiFi Operating temperature: -40...85°C |
на замовлення 8 шт: термін постачання 21-30 дні (днів) |
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M82824AA | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x4.5mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Kind of network: WiFi Operating temperature: -40...85°C кількість в упаковці: 1 шт |
на замовлення 8 шт: термін постачання 7-14 дні (днів) |
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M828G23B | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 600Mbps Uplink ransfer rate: 150Mbps Case: LGA Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C |
на замовлення 20 шт: термін постачання 21-30 дні (днів) |
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M828G23B | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 600Mbps Uplink ransfer rate: 150Mbps Case: LGA Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C кількість в упаковці: 1 шт |
на замовлення 20 шт: термін постачання 7-14 дні (днів) |
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M828G23D | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: LGA Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C |
на замовлення 20 шт: термін постачання 21-30 дні (днів) |
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M828G23D | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: LGA Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -30...75°C кількість в упаковці: 1 шт |
на замовлення 20 шт: термін постачання 7-14 дні (днів) |
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M828GEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB |
на замовлення 2 шт: термін постачання 21-30 дні (днів) |
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M828GEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB кількість в упаковці: 1 шт |
на замовлення 2 шт: термін постачання 7-14 дні (днів) |
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| M900332G | MEIG SMART TECHNOLOGY |
Category: IoT (WiFi/Bluetooth) modules Description: Module: WiFi Type of communications module: WiFi |
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| M900332G | MEIG SMART TECHNOLOGY |
Category: IoT (WiFi/Bluetooth) modules Description: Module: WiFi Type of communications module: WiFi кількість в упаковці: 1000 шт |
товар відсутній |
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| M900E33A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 3GBRAM,32GBFLASH; LCC+LGA Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART Operating temperature: -30...75°C Dimensions: 41x45.5x3mm Type of communications module: LTE Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Operating system: Android 9.0 Uplink ransfer rate: 50Mbps Downlink transfer rate: 300Mbps Components: SDM660 Memory: 3GB RAM; 32GB FLASH Case: LCC+LGA Kind of network: Bluetooth Low Energy; WiFi |
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| M900E33A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 3GBRAM,32GBFLASH; LCC+LGA Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART Operating temperature: -30...75°C Dimensions: 41x45.5x3mm Type of communications module: LTE Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Operating system: Android 9.0 Uplink ransfer rate: 50Mbps Downlink transfer rate: 300Mbps Components: SDM660 Memory: 3GB RAM; 32GB FLASH Case: LCC+LGA Kind of network: Bluetooth Low Energy; WiFi кількість в упаковці: 1000 шт |
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| M900E64A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; 6GBRAM,64GBFLASH; Comp: SM6350; OS: Android 11.0 Interface: ADC; GPIO; I2C; ISP; PWM; SD; SIM; SPI; UART; USB Type of communications module: LTE Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; TD-SCDMA; WCDMA Operating system: Android 11.0 Components: SM6350 Memory: 6GB RAM; 64GB FLASH |
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| M900E64A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; 6GBRAM,64GBFLASH; Comp: SM6350; OS: Android 11.0 Interface: ADC; GPIO; I2C; ISP; PWM; SD; SIM; SPI; UART; USB Type of communications module: LTE Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; TD-SCDMA; WCDMA Operating system: Android 11.0 Components: SM6350 Memory: 6GB RAM; 64GB FLASH кількість в упаковці: 1000 шт |
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| M900EVB1 | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SLM900E Type of development kit: LTE Components: SLM900E |
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| M900EVB1 | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SLM900E Type of development kit: LTE Components: SLM900E кількість в упаковці: 1 шт |
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| M900ZB09 | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM900 Kind of connector: HDMI; power supply; RJ45; RS232; RS485; SIM x2; USB A x2; USB C; USB micro Type of development kit: LTE Components: SRM900 |
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| M900ZB09 | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM900 Kind of connector: HDMI; power supply; RJ45; RS232; RS485; SIM x2; USB A x2; USB C; USB micro Type of development kit: LTE Components: SRM900 кількість в упаковці: 1 шт |
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| M920E32A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 192kBSRAM,3GBRAM,32GBFLASH Dimensions: 41x45.5x3mm Operating system: Android 10.0 Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART Memory: 192kB SRAM; 3GB RAM; 32GB FLASH Operating temperature: -30...75°C Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n Components: QCM6125 Type of communications module: LTE Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Kind of network: Bluetooth Low Energy; WiFi Uplink ransfer rate: 50Mbps Downlink transfer rate: 300Mbps Case: LCC+LGA |
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| M920E32A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 192kBSRAM,3GBRAM,32GBFLASH Dimensions: 41x45.5x3mm Operating system: Android 10.0 Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART Memory: 192kB SRAM; 3GB RAM; 32GB FLASH Operating temperature: -30...75°C Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n Components: QCM6125 Type of communications module: LTE Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Kind of network: Bluetooth Low Energy; WiFi Uplink ransfer rate: 50Mbps Downlink transfer rate: 300Mbps Case: LCC+LGA кількість в упаковці: 1000 шт |
товар відсутній |
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| M920EVB2 | MEIG SMART TECHNOLOGY | SLM920E-EVB-KIT Development kits for data transmission |
товар відсутній |
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MPEVB00B | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB |
на замовлення 4 шт: термін постачання 21-30 дні (днів) |
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MPEVB00B | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB кількість в упаковці: 1 шт |
на замовлення 4 шт: термін постачання 7-14 дні (днів) |
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NBEVB00A | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: IoT; Comp: SLM156 Type of development kit: IoT Components: SLM156 Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2 |
на замовлення 1 шт: термін постачання 21-30 дні (днів) |
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NBEVB00A | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: IoT; Comp: SLM156 Type of development kit: IoT Components: SLM156 Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2 кількість в упаковці: 1 шт |
на замовлення 1 шт: термін постачання 7-14 дні (днів) |
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| SNM7578A | MEIG SMART TECHNOLOGY |
Category: IoT (WiFi/Bluetooth) modules Description: Module: WiFi Type of communications module: WiFi |
товар відсутній |
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| SNM7578A | MEIG SMART TECHNOLOGY |
Category: IoT (WiFi/Bluetooth) modules Description: Module: WiFi Type of communications module: WiFi кількість в упаковці: 1000 шт |
товар відсутній |
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| VE14LMPG | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Dimensions: 51x30x5.5mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C |
товар відсутній |
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| VE14LMPG | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Dimensions: 51x30x5.5mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C кількість в упаковці: 1 шт |
товар відсутній |
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VE71SMPR | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Dimensions: 51x30x5.5mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C |
на замовлення 6 шт: термін постачання 21-30 дні (днів) |
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VE71SMPR | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm Type of communications module: LTE Downlink transfer rate: 150Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Dimensions: 51x30x5.5mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C кількість в упаковці: 1 шт |
на замовлення 6 шт: термін постачання 7-14 дні (днів) |
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ZE1AMP1B | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Case: Mini PCIe Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x5.5mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C |
на замовлення 4 шт: термін постачання 21-30 дні (днів) |
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ZE1AMP1B | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modules Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm Type of communications module: LTE Downlink transfer rate: 10Mbps Uplink ransfer rate: 5Mbps Case: Mini PCIe Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x5.5mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: I2C; PCM; SIM; UART; USB Operating temperature: -40...85°C кількість в упаковці: 1 шт |
на замовлення 4 шт: термін постачання 7-14 дні (днів) |
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| M550322A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
товар відсутній
| M550322A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
кількість в упаковці: 1000 шт
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
кількість в упаковці: 1000 шт
товар відсутній
| M550E00A |
Виробник: MEIG SMART TECHNOLOGY
SLM550E-EVB-KIT Development kits for data transmission
SLM550E-EVB-KIT Development kits for data transmission
товар відсутній
| M550E32A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 320kBSRAM,2GBRAM,8GBFLASH
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Memory: 320kB SRAM; 2GB RAM; 8GB FLASH
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 40.5x40.5x2.8mm
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Interface: ADC; GPIO; I2C; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART; USB
Kind of network: Bluetooth 5; Bluetooth Low Energy; WiFi
Operating temperature: -35...75°C
Components: QCM2290
Operating system: Android 11.0
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 320kBSRAM,2GBRAM,8GBFLASH
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Memory: 320kB SRAM; 2GB RAM; 8GB FLASH
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 40.5x40.5x2.8mm
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Interface: ADC; GPIO; I2C; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART; USB
Kind of network: Bluetooth 5; Bluetooth Low Energy; WiFi
Operating temperature: -35...75°C
Components: QCM2290
Operating system: Android 11.0
товар відсутній
| M550E32A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 320kBSRAM,2GBRAM,8GBFLASH
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Memory: 320kB SRAM; 2GB RAM; 8GB FLASH
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 40.5x40.5x2.8mm
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Interface: ADC; GPIO; I2C; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART; USB
Kind of network: Bluetooth 5; Bluetooth Low Energy; WiFi
Operating temperature: -35...75°C
Components: QCM2290
Operating system: Android 11.0
кількість в упаковці: 1000 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 320kBSRAM,2GBRAM,8GBFLASH
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Memory: 320kB SRAM; 2GB RAM; 8GB FLASH
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 40.5x40.5x2.8mm
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Interface: ADC; GPIO; I2C; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART; USB
Kind of network: Bluetooth 5; Bluetooth Low Energy; WiFi
Operating temperature: -35...75°C
Components: QCM2290
Operating system: Android 11.0
кількість в упаковці: 1000 шт
товар відсутній
| M750ZE1A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: LCC
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: LCC
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
на замовлення 40 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2307.07 грн |
| 2+ | 2025.82 грн |
| 10+ | 2011.44 грн |
| 25+ | 1948.18 грн |
| M750ZE1A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: LCC
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: LCC
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Kind of network: WiFi
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
на замовлення 40 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2768.48 грн |
| 2+ | 2524.48 грн |
| 10+ | 2413.73 грн |
| 25+ | 2337.82 грн |
| M758EVB1 |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM758NE
Type of development kit: LTE
Components: SLM758NE
Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM758NE
Type of development kit: LTE
Components: SLM758NE
Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro
товар відсутній
| M758EVB1 |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM758NE
Type of development kit: LTE
Components: SLM758NE
Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM758NE
Type of development kit: LTE
Components: SLM758NE
Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro
кількість в упаковці: 1 шт
товар відсутній
| M758LEM1 |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM758LE
Type of development kit: LTE
Components: SLM758LE
Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM758LE
Type of development kit: LTE
Components: SLM758LE
Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro
товар відсутній
| M758LEM1 |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM758LE
Type of development kit: LTE
Components: SLM758LE
Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM758LE
Type of development kit: LTE
Components: SLM758LE
Kind of connector: HDMI; Jack 3,5mm; LCD; LVDS; power supply; RJ45; RS232; RS485; SIM; USB A; USB C; USB micro
кількість в упаковці: 1 шт
товар відсутній
| M813QEAA |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35
Type of communications module: 5G
Transmission: 5G; LTE
Dimensions: 32x29x2.4mm
Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0
Operating temperature: -30...75°C
Components: Qualcomm Snapdragon X35
Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78
Category: M2M (GPRS/LTE/5G) modules
Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35
Type of communications module: 5G
Transmission: 5G; LTE
Dimensions: 32x29x2.4mm
Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0
Operating temperature: -30...75°C
Components: Qualcomm Snapdragon X35
Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78
товар відсутній
| M813QEAA |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35
Type of communications module: 5G
Transmission: 5G; LTE
Dimensions: 32x29x2.4mm
Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0
Operating temperature: -30...75°C
Components: Qualcomm Snapdragon X35
Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: 5G; 5G,LTE; 32x29x2.4mm; Comp: Qualcomm Snapdragon X35
Type of communications module: 5G
Transmission: 5G; LTE
Dimensions: 32x29x2.4mm
Interface: ADC; GPIO; PCIe Gen2; SDIO; SGMII; SIM; SPI; UART; USB 2.0
Operating temperature: -30...75°C
Components: Qualcomm Snapdragon X35
Band: B1; B3; B5; B7; B8; B20; B28; B38; B40; B41; B42; B43; N1; N3; N5; N7; N8; N20; N28; N38; N40; N41; N77; N78
кількість в упаковці: 1 шт
товар відсутній
| M815N44A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
на замовлення 5 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15866.14 грн |
| M815N44A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
кількість в упаковці: 1 шт
на замовлення 5 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19039.37 грн |
| 10+ | 18037.79 грн |
| 25+ | 16998.78 грн |
| M815NEVB |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Components: SRM815
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Components: SRM815
на замовлення 1 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 31579.77 грн |
| M815NEVB |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Components: SRM815
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Kind of connector: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Components: SRM815
кількість в упаковці: 1 шт
на замовлення 1 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 37895.73 грн |
| M820223B |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; M.2; LTE CAT12,LTE-FDD,LTE-TDD,WCDMA; 42x30x2.3mm
Type of communications module: LTE
Case: M.2
Transmission: LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 42x30x2.3mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; M.2; LTE CAT12,LTE-FDD,LTE-TDD,WCDMA; 42x30x2.3mm
Type of communications module: LTE
Case: M.2
Transmission: LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 42x30x2.3mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
товар відсутній
| M820223B |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; M.2; LTE CAT12,LTE-FDD,LTE-TDD,WCDMA; 42x30x2.3mm
Type of communications module: LTE
Case: M.2
Transmission: LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 42x30x2.3mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; M.2; LTE CAT12,LTE-FDD,LTE-TDD,WCDMA; 42x30x2.3mm
Type of communications module: LTE
Case: M.2
Transmission: LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 42x30x2.3mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
товар відсутній
| M825N45A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,GNSS,LTE,LTE-FDD,LTE-TDD,Sub-6G
Type of communications module: IoT
Case: M.2
Transmission: 5G; GNSS; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,GNSS,LTE,LTE-FDD,LTE-TDD,Sub-6G
Type of communications module: IoT
Case: M.2
Transmission: 5G; GNSS; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
на замовлення 4 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 16476.97 грн |
| M825N45A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,GNSS,LTE,LTE-FDD,LTE-TDD,Sub-6G
Type of communications module: IoT
Case: M.2
Transmission: 5G; GNSS; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,GNSS,LTE,LTE-FDD,LTE-TDD,Sub-6G
Type of communications module: IoT
Case: M.2
Transmission: 5G; GNSS; LTE; LTE-FDD; LTE-TDD; Sub-6G
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Components: Qualcomm X62
кількість в упаковці: 1 шт
на замовлення 4 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19772.37 грн |
| 10+ | 18429.27 грн |
| 25+ | 17654.4 грн |
| M825W5GH |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
товар відсутній
| M825W5GH |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
кількість в упаковці: 1 шт
товар відсутній
| M825WN4A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,GNSS,LTE-FDD,LTE-TDD,WCDMA; 52x30x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 52x30x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -30...75°C
Components: Qualcomm X62
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,GNSS,LTE-FDD,LTE-TDD,WCDMA; 52x30x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 52x30x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -30...75°C
Components: Qualcomm X62
товар відсутній
| M825WN4A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,GNSS,LTE-FDD,LTE-TDD,WCDMA; 52x30x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 52x30x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -30...75°C
Components: Qualcomm X62
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,GNSS,LTE-FDD,LTE-TDD,WCDMA; 52x30x2.3mm
Type of communications module: IoT
Case: M.2
Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 52x30x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Operating temperature: -30...75°C
Components: Qualcomm X62
кількість в упаковці: 1 шт
товар відсутній
| M82824AA |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
на замовлення 8 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4126.4 грн |
| M82824AA |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Kind of network: WiFi
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
на замовлення 8 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4951.69 грн |
| 20+ | 4605.53 грн |
| M828G23B |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
на замовлення 20 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4965.62 грн |
| 20+ | 4495.19 грн |
| M828G23B |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 600Mbps
Uplink ransfer rate: 150Mbps
Case: LGA
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
кількість в упаковці: 1 шт
на замовлення 20 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5958.75 грн |
| 20+ | 5601.7 грн |
| M828G23D |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
на замовлення 20 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3901.89 грн |
| M828G23D |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: LGA
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -30...75°C
кількість в упаковці: 1 шт
на замовлення 20 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4682.27 грн |
| M828GEVB |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
на замовлення 2 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4521.24 грн |
| M828GEVB |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; RJ11; SD; SIM x2; solder pads; USB
кількість в упаковці: 1 шт
на замовлення 2 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5425.49 грн |
| M900332G |
|
Виробник: MEIG SMART TECHNOLOGY
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
товар відсутній
| M900332G |
|
Виробник: MEIG SMART TECHNOLOGY
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
кількість в упаковці: 1000 шт
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
кількість в упаковці: 1000 шт
товар відсутній
| M900E33A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 3GBRAM,32GBFLASH; LCC+LGA
Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART
Operating temperature: -30...75°C
Dimensions: 41x45.5x3mm
Type of communications module: LTE
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Operating system: Android 9.0
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 300Mbps
Components: SDM660
Memory: 3GB RAM; 32GB FLASH
Case: LCC+LGA
Kind of network: Bluetooth Low Energy; WiFi
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 3GBRAM,32GBFLASH; LCC+LGA
Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART
Operating temperature: -30...75°C
Dimensions: 41x45.5x3mm
Type of communications module: LTE
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Operating system: Android 9.0
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 300Mbps
Components: SDM660
Memory: 3GB RAM; 32GB FLASH
Case: LCC+LGA
Kind of network: Bluetooth Low Energy; WiFi
товар відсутній
| M900E33A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 3GBRAM,32GBFLASH; LCC+LGA
Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART
Operating temperature: -30...75°C
Dimensions: 41x45.5x3mm
Type of communications module: LTE
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Operating system: Android 9.0
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 300Mbps
Components: SDM660
Memory: 3GB RAM; 32GB FLASH
Case: LCC+LGA
Kind of network: Bluetooth Low Energy; WiFi
кількість в упаковці: 1000 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 3GBRAM,32GBFLASH; LCC+LGA
Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART
Operating temperature: -30...75°C
Dimensions: 41x45.5x3mm
Type of communications module: LTE
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Operating system: Android 9.0
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 300Mbps
Components: SDM660
Memory: 3GB RAM; 32GB FLASH
Case: LCC+LGA
Kind of network: Bluetooth Low Energy; WiFi
кількість в упаковці: 1000 шт
товар відсутній
| M900E64A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; 6GBRAM,64GBFLASH; Comp: SM6350; OS: Android 11.0
Interface: ADC; GPIO; I2C; ISP; PWM; SD; SIM; SPI; UART; USB
Type of communications module: LTE
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; TD-SCDMA; WCDMA
Operating system: Android 11.0
Components: SM6350
Memory: 6GB RAM; 64GB FLASH
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; 6GBRAM,64GBFLASH; Comp: SM6350; OS: Android 11.0
Interface: ADC; GPIO; I2C; ISP; PWM; SD; SIM; SPI; UART; USB
Type of communications module: LTE
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; TD-SCDMA; WCDMA
Operating system: Android 11.0
Components: SM6350
Memory: 6GB RAM; 64GB FLASH
товар відсутній
| M900E64A |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; 6GBRAM,64GBFLASH; Comp: SM6350; OS: Android 11.0
Interface: ADC; GPIO; I2C; ISP; PWM; SD; SIM; SPI; UART; USB
Type of communications module: LTE
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; TD-SCDMA; WCDMA
Operating system: Android 11.0
Components: SM6350
Memory: 6GB RAM; 64GB FLASH
кількість в упаковці: 1000 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; 6GBRAM,64GBFLASH; Comp: SM6350; OS: Android 11.0
Interface: ADC; GPIO; I2C; ISP; PWM; SD; SIM; SPI; UART; USB
Type of communications module: LTE
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Transmission: 5G; GNSS; LTE-FDD; LTE-TDD; TD-SCDMA; WCDMA
Operating system: Android 11.0
Components: SM6350
Memory: 6GB RAM; 64GB FLASH
кількість в упаковці: 1000 шт
товар відсутній
| M900EVB1 |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM900E
Type of development kit: LTE
Components: SLM900E
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM900E
Type of development kit: LTE
Components: SLM900E
товар відсутній
| M900EVB1 |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM900E
Type of development kit: LTE
Components: SLM900E
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SLM900E
Type of development kit: LTE
Components: SLM900E
кількість в упаковці: 1 шт
товар відсутній
| M900ZB09 |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM900
Kind of connector: HDMI; power supply; RJ45; RS232; RS485; SIM x2; USB A x2; USB C; USB micro
Type of development kit: LTE
Components: SRM900
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM900
Kind of connector: HDMI; power supply; RJ45; RS232; RS485; SIM x2; USB A x2; USB C; USB micro
Type of development kit: LTE
Components: SRM900
товар відсутній
| M900ZB09 |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM900
Kind of connector: HDMI; power supply; RJ45; RS232; RS485; SIM x2; USB A x2; USB C; USB micro
Type of development kit: LTE
Components: SRM900
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM900
Kind of connector: HDMI; power supply; RJ45; RS232; RS485; SIM x2; USB A x2; USB C; USB micro
Type of development kit: LTE
Components: SRM900
кількість в упаковці: 1 шт
товар відсутній
| M920E32A |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 192kBSRAM,3GBRAM,32GBFLASH
Dimensions: 41x45.5x3mm
Operating system: Android 10.0
Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART
Memory: 192kB SRAM; 3GB RAM; 32GB FLASH
Operating temperature: -30...75°C
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Components: QCM6125
Type of communications module: LTE
Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Kind of network: Bluetooth Low Energy; WiFi
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 300Mbps
Case: LCC+LGA
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 192kBSRAM,3GBRAM,32GBFLASH
Dimensions: 41x45.5x3mm
Operating system: Android 10.0
Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART
Memory: 192kB SRAM; 3GB RAM; 32GB FLASH
Operating temperature: -30...75°C
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Components: QCM6125
Type of communications module: LTE
Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Kind of network: Bluetooth Low Energy; WiFi
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 300Mbps
Case: LCC+LGA
товар відсутній
| M920E32A |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 192kBSRAM,3GBRAM,32GBFLASH
Dimensions: 41x45.5x3mm
Operating system: Android 10.0
Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART
Memory: 192kB SRAM; 3GB RAM; 32GB FLASH
Operating temperature: -30...75°C
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Components: QCM6125
Type of communications module: LTE
Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Kind of network: Bluetooth Low Energy; WiFi
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 300Mbps
Case: LCC+LGA
кількість в упаковці: 1000 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; 192kBSRAM,3GBRAM,32GBFLASH
Dimensions: 41x45.5x3mm
Operating system: Android 10.0
Interface: ADC; GPIO; I2C; ISP; MIPI-CSI; MIPI-DSI; PWM; SD; SIM; SPI; UART
Memory: 192kB SRAM; 3GB RAM; 32GB FLASH
Operating temperature: -30...75°C
Communictions protocol: Bluetooth Low Energy; IEEE 802.11a/ac/b/g/n
Components: QCM6125
Type of communications module: LTE
Transmission: GNSS; GSM; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Kind of network: Bluetooth Low Energy; WiFi
Uplink ransfer rate: 50Mbps
Downlink transfer rate: 300Mbps
Case: LCC+LGA
кількість в упаковці: 1000 шт
товар відсутній
| M920EVB2 |
Виробник: MEIG SMART TECHNOLOGY
SLM920E-EVB-KIT Development kits for data transmission
SLM920E-EVB-KIT Development kits for data transmission
товар відсутній
| MPEVB00B |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
на замовлення 4 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4552.21 грн |
| MPEVB00B |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Kind of connector: DB-9 Console Port; pin header; power supply; SIM; solder pads; USB
кількість в упаковці: 1 шт
на замовлення 4 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5462.65 грн |
| NBEVB00A |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
на замовлення 1 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5650 грн |
| NBEVB00A |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Kind of connector: DB-9 Console Port; nanoSIM; pin header; USB x2
кількість в упаковці: 1 шт
на замовлення 1 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6780 грн |
| SNM7578A |
Виробник: MEIG SMART TECHNOLOGY
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
товар відсутній
| SNM7578A |
Виробник: MEIG SMART TECHNOLOGY
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
кількість в упаковці: 1000 шт
Category: IoT (WiFi/Bluetooth) modules
Description: Module: WiFi
Type of communications module: WiFi
кількість в упаковці: 1000 шт
товар відсутній
| VE14LMPG |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
товар відсутній
| VE14LMPG |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
товар відсутній
| VE71SMPR |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
на замовлення 6 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2600.49 грн |
| VE71SMPR |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 150Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
на замовлення 6 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3120.58 грн |
| 30+ | 2906.11 грн |
| ZE1AMP1B |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: Mini PCIe
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: Mini PCIe
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
на замовлення 4 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2559.45 грн |
| ZE1AMP1B |
|
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: Mini PCIe
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; Mini PCIe; 51x30x5.5mm
Type of communications module: LTE
Downlink transfer rate: 10Mbps
Uplink ransfer rate: 5Mbps
Case: Mini PCIe
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x5.5mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: I2C; PCM; SIM; UART; USB
Operating temperature: -40...85°C
кількість в упаковці: 1 шт
на замовлення 4 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3071.35 грн |
| 10+ | 2960.76 грн |
| 20+ | 2776.05 грн |
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