110-93-316-41-801000 Mill-Max Manufacturing Corp.
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 388.73 грн |
10+ | 339.95 грн |
25+ | 321.97 грн |
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Технічний опис 110-93-316-41-801000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Decoupling Capacitor, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Інші пропозиції 110-93-316-41-801000 за ціною від 188.65 грн до 470.94 грн
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||||||
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110-93-316-41-801000 | Виробник : Mill-Max | IC & Component Sockets 16P TIN PIN GLD CONT |
на замовлення 28 шт: термін постачання 21-30 дні (днів) |
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110-93-316-41-801000 | Виробник : MILL MAX |
Description: MILL MAX - 110-93-316-41-801000 - DIP SOCKET, 16 POSITION, THROUGH HOLE tariffCode: 85366910 productTraceability: Yes-Date/Lot Code Kontaktüberzug: Gold Plated Contacts Steckverbindertyp: DIP Socket rohsCompliant: NO Rastermaß: 2.54mm Anzahl der Kontakte: 16Contacts euEccn: NLR Kontaktmaterial: Beryllium Copper hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: TBA directShipCharge: 25 usEccn: EAR99 Produktpalette: 110 Series SVHC: No SVHC (17-Dec-2014) |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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