Технічний опис 251-5949-52-0602 3M
Description: CONN ZIG-ZAG ZIF 51POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: Zig-Zag, ZIF (ZIP), Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26), Termination: Solder, Housing Material: Polysulfone (PSU), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції 251-5949-52-0602
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 251-5949-52-0602 | Виробник : 3M Interconnect Solutions | JE150378600 251-5949-52-0602=ZIPSTRIP""WITHGANGBAR"" |
товар відсутній |
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| 251-5949-52-0602 | Виробник : 3M |
Description: CONN ZIG-ZAG ZIF 51POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: Zig-Zag, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 51 (1 x 25, 1 x 26) Termination: Solder Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
товар відсутній |
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| 251-5949-52-0602 | Виробник : 3M Electronic Solutions Division | IC & Component Sockets ZPSTRP"W/ GANG BAR" |
товар відсутній |