374724B00035G Boyd Laconia, LLC
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 915 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
2+ | 276.96 грн |
10+ | 259.3 грн |
25+ | 252.24 грн |
50+ | 231.54 грн |
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Технічний опис 374724B00035G Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH, Packaging: Bulk, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.30°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Інші пропозиції 374724B00035G за ціною від 193.24 грн до 343.8 грн
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||||||||||||
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374724B00035G | Виробник : Aavid | Heat Sinks Heat Sink for Plastic BGA Packages, Black, 35x35x18mm, IC Pkg=35 x 35, Tape #35 |
на замовлення 792 шт: термін постачання 21-30 дні (днів) |
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374724B00035G | Виробник : Aavid Thermalloy | Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3C/W Black Anodized |
товар відсутній |
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374724B00035G | Виробник : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm Colour: black Material: aluminium Height: 18mm Length: 35mm Application: BGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Width: 35mm кількість в упаковці: 1 шт |
товар відсутній |
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374724B00035G | Виробник : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm Colour: black Material: aluminium Height: 18mm Length: 35mm Application: BGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Width: 35mm |
товар відсутній |