BM23FR0.6-24DS-0.35V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 24POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Description: CONN RCPT 24POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.014" (0.35mm)
Height Above Board: 0.024" (0.61mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
на замовлення 9933 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
5+ | 68.59 грн |
10+ | 55.87 грн |
25+ | 53.58 грн |
50+ | 49.23 грн |
100+ | 47.09 грн |
250+ | 42.81 грн |
500+ | 37.9 грн |
1000+ | 33.69 грн |
2500+ | 30.53 грн |
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Технічний опис BM23FR0.6-24DS-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT 24POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 24, Pitch: 0.014" (0.35mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Інші пропозиції BM23FR0.6-24DS-0.35V(51)
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
BM23FR0.6-24DS-0.35V(51) | Виробник : HIROSE | BM23FR0624DS035V51 Other Hirose Connectors |
товар відсутній |
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BM23FR0.6-24DS-0.35V(51) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 24POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
товар відсутній |
||
BM23FR0.6-24DS-0.35V(51) | Виробник : Hirose Connector | Board to Board & Mezzanine Connectors |
товар відсутній |