BM23PF0.8-30DS-0.35V(51) Hirose Electric Co Ltd
Виробник: Hirose Electric Co LtdDescription: CONN RCPT 30POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.014" (0.35mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
на замовлення 7535 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 72.57 грн |
| 10+ | 59.37 грн |
| 25+ | 56.88 грн |
| 50+ | 52.26 грн |
| 100+ | 49.98 грн |
| 250+ | 45.44 грн |
| 500+ | 40.23 грн |
| 1000+ | 35.76 грн |
| 2500+ | 32.4 грн |
Відгуки про товар
Написати відгук
Технічний опис BM23PF0.8-30DS-0.35V(51) Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.014" (0.35mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Інші пропозиції BM23PF0.8-30DS-0.35V(51)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
|
|
BM23PF0.8-30DS-0.35V(51) | Виробник : Hirose Electric Co Ltd |
Description: CONN RCPT 30POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
товар відсутній |
|
 |
BM23PF0.8-30DS-0.35V(51) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 30P RCPT STRGHT SMT HYBRID W/POWER |
товар відсутній |