Технічний опис CYPD3197-24LDXS Infineon Technologies
Description: CCG3PA, Packaging: Tray, Package / Case: 24-UFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Interface: I2C, SPI, UART, USB, RAM Size: 8K x 8, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3V ~ 24.5V, Program Memory Type: FLASH (64kB), Applications: USB Type C, Core Processor: ARM® Cortex®-M0, Supplier Device Package: 24-QFN (4x4), Part Status: Active, Number of I/O: 12, DigiKey Programmable: Not Verified.
Інші пропозиції CYPD3197-24LDXS
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CYPD3197-24LDXS | Виробник : Infineon Technologies |
 Description: CCG3PAPackaging: Tray Package / Case: 24-UFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Interface: I2C, SPI, UART, USB RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 24.5V Program Memory Type: FLASH (64kB) Applications: USB Type C Core Processor: ARM® Cortex®-M0 Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
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| CYPD3197-24LDXS | Виробник : Cypress Semiconductor |
USB Interface IC CCG3PA |
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