EHF-110-01-F-D-SM-P-TR Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD 20POS 1.27MM
Packaging: Tape & Reel (TR)
Features: Keying Slot, Pick and Place
Connector Type: Header
Current Rating (Amps): 1.75A
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Latch Lock/Eject Hooks
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.325" (8.25mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
на замовлення 300 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 150+ | 378.79 грн |
| 300+ | 326.37 грн |
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Технічний опис EHF-110-01-F-D-SM-P-TR Samtec Inc.
Description: CONN HEADER SMD 20POS 1.27MM, Packaging: Tape & Reel (TR), Features: Keying Slot, Pick and Place, Connector Type: Header, Current Rating (Amps): 1.75A, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Latch Lock/Eject Hooks, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.325" (8.25mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled, Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).
Інші пропозиції EHF-110-01-F-D-SM-P-TR за ціною від 416.56 грн до 535.48 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ | ||||||
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EHF-110-01-F-D-SM-P-TR | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1.27MM Features: Keying Slot, Pick and Place Packaging: Cut Tape (CT) Connector Type: Header Current Rating (Amps): 1.75A Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Latch Lock/Eject Hooks Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.325" (8.25mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
на замовлення 433 шт: термін постачання 21-31 дні (днів) |
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| EHF-110-01-F-D-SM-P-TR | Виробник : SAMTEC |
Description: SAMTEC - EHF-110-01-F-D-SM-P-TR - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, EHF tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Hauchvergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Produktpalette: EHF productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (17-Jan-2023) |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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EHF-110-01-F-D-SM-P-TR | Виробник : Samtec |
Headers & Wire Housings .050" Shrouded IDC Ejector Header |
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