ESQ-103-33-S-D Samtec Inc.
Виробник: Samtec Inc.Description: CONN SOCKET 6POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 6
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.090" (2.29mm)
Insulation Height: 0.635" (16.13mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 326 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 247.9 грн |
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Технічний опис ESQ-103-33-S-D Samtec Inc.
Description: CONN SOCKET 6POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 6, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Length - Post: 0.090" (2.29mm), Insulation Height: 0.635" (16.13mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
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