FI-X30SSLA-HF JAE Electronics
на замовлення 745 шт:
термін постачання 156-165 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1557.76 грн |
| 5+ | 1451.82 грн |
| 10+ | 1205.04 грн |
| 25+ | 1154.3 грн |
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Технічний опис FI-X30SSLA-HF JAE Electronics
Description: CONN RCPT 30P 0.039 GOLD SMD R/A, Features: Grounding Pins, Shielded, Solder Retention, Packaging: Strip, Connector Type: Receptacle, Voltage Rating: 200V, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 30, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 80°C, Contact Type: Non-Gendered, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish - Post: Tin, Part Status: Obsolete, Insulation Height: 0.091" (2.30mm), Number of Rows: 1.
Інші пропозиції FI-X30SSLA-HF
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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FI-X30SSLA-HF | Виробник : JAE Electronics |
 Description: CONN RCPT 30P 0.039 GOLD SMD R/AFeatures: Grounding Pins, Shielded, Solder Retention Packaging: Strip Connector Type: Receptacle Voltage Rating: 200V Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 30 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 80°C Contact Type: Non-Gendered Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Beige Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish - Post: Tin Part Status: Obsolete Insulation Height: 0.091" (2.30mm) Number of Rows: 1 |
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