Технічний опис HDAF-23-08.0-S-13-2-TR Samtec
Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED, Features: Board Guide, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 299, Pitch: 0.047" (1.20mm), Height Above Board: 0.414" (10.51mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 20mm, 25mm, Number of Rows: 13.
Інші пропозиції HDAF-23-08.0-S-13-2-TR
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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| HDAF-23-08.0-S-13-2-TR | Виробник : Samtec Inc. |
 Description: 2.00 MM X 1.20 MM HD MEZZ RUGGEDFeatures: Board Guide Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 299 Pitch: 0.047" (1.20mm) Height Above Board: 0.414" (10.51mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 20mm, 25mm Number of Rows: 13 |
товар відсутній |
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HDAF-23-08.0-S-13-2-TR | Виробник : Samtec |
Board to Board & Mezzanine Connectors 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket |
товар відсутній |