HSE-B18635-035H-04 CUI DEVICES
Виробник: CUI DEVICES
Heat Sink Passive TO-218 Vertical Thru-Hole Aluminum 6063-T5 4.97C/W Black Anodized
Heat Sink Passive TO-218 Vertical Thru-Hole Aluminum 6063-T5 4.97C/W Black Anodized
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Технічний опис HSE-B18635-035H-04 CUI DEVICES
Description: HEAT SINK, EXTRUSION, TO-218, 63, Packaging: Box, Material: Aluminum Alloy, Length: 2.500" (63.50mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.638" (41.60mm), Package Cooled: TO-218, Attachment Method: Clip and PC Pin, Power Dissipation @ Temperature Rise: 15.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.38°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.97°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Інші пропозиції HSE-B18635-035H-04
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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HSE-B18635-035H-04 | Виробник : CUI DEVICES | Extruded Heat Sink, TO-218 |
товар відсутній |
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HSE-B18635-035H-04 | Виробник : CUI DEVICES | Extruded Heat Sink, TO-218 |
товар відсутній |
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HSE-B18635-035H-04 | Виробник : CUI Devices |
Description: HEAT SINK, EXTRUSION, TO-218, 63 Packaging: Box Material: Aluminum Alloy Length: 2.500" (63.50mm) Shape: Rectangular, Angled Fins Type: Board Level, Vertical Width: 1.638" (41.60mm) Package Cooled: TO-218 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 15.1W @ 75°C Thermal Resistance @ Forced Air Flow: 2.38°C/W @ 200 LFM Thermal Resistance @ Natural: 4.97°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
товар відсутній |
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HSE-B18635-035H-04 | Виробник : CUI Devices | Heat Sinks 63.5x41.6x25mm w/pin extrusion TO-218 |
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