HSE11-B20-NP CUI Devices
Виробник: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-218/TO-
Packaging: Bag
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Rectangular
Type: Top Mount
Width: 0.472" (12.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 1.93W @ 75°C
Thermal Resistance @ Forced Air Flow: 21.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 38.90°C/W
Fin Height: 0.177" (4.50mm)
Material Finish: Black Anodized
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Технічний опис HSE11-B20-NP CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Bag, Material: Aluminum Alloy, Length: 0.984" (25.00mm), Shape: Rectangular, Type: Top Mount, Width: 0.472" (12.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On, Power Dissipation @ Temperature Rise: 1.93W @ 75°C, Thermal Resistance @ Forced Air Flow: 21.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 38.90°C/W, Fin Height: 0.177" (4.50mm), Material Finish: Black Anodized.
Інші пропозиції HSE11-B20-NP
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
HSE11-B20-NP | Виробник : CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 25 x 12 x 4.5 mm, M3 |
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