.JPG "IT3D-300S-BGA(57)")
IT3D-300S-BGA(57) Hirose Electric Co Ltd
Виробник: Hirose Electric Co LtdDescription: CONN RCPT 300POS SMD GOLD
Features: Mating Side
Packaging: Tray
Connector Type: Receptacle, Non-Gendered
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 300
Pitch: 0.069" (1.75mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 15mm ~ 40mm
Number of Rows: 60
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Технічний опис IT3D-300S-BGA(57) Hirose Electric Co Ltd
Description: CONN RCPT 300POS SMD GOLD, Features: Mating Side, Packaging: Tray, Connector Type: Receptacle, Non-Gendered, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 300, Pitch: 0.069" (1.75mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 15mm ~ 40mm, Number of Rows: 60.
Інші пропозиції IT3D-300S-BGA(57)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
IT3D-300S-BGA(57) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 300P RECPT SMT DETACHABLE SIDE SnPb |
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