Технічний опис LH7A400N0G000B5;55 NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 256BGA, Packaging: Tray, Package / Case: 256-BGA, Mounting Type: Surface Mount, Speed: 200MHz, RAM Size: 80K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Program Memory Type: ROMless, Core Processor: ARM9®, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V, Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB, Peripherals: AC'97, DMA, LCD, POR, PWM, WDT, Supplier Device Package: 256-BGA (17x17), Number of I/O: 60, DigiKey Programmable: Not Verified.
Інші пропозиції LH7A400N0G000B5;55
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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LH7A400N0G000B555 | Виробник : NXP Semiconductors |
 SOC LH7A4xx ARM9TDMI 256-Pin BGA Tray |
товар відсутній |
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LH7A400N0G000B5;55 | Виробник : NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256BGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 256-BGA (17x17) Number of I/O: 60 DigiKey Programmable: Not Verified |
товар відсутній |