Технічний опис MC33PF8100EPESR2 NXP Semiconductors
Description: POWER MANAGEMENT IC I.MX8 PRE-PR, Packaging: Tape & Reel (TR), Package / Case: 56-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 105°C (TA), Voltage - Supply: 2.5V ~ 5.5V, Applications: High Performance i.MX 8, S32x Processor Based, Supplier Device Package: 56-HVQFN (8x8).
Інші пропозиції MC33PF8100EPESR2
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MC33PF8100EPESR2 | Виробник : NXP USA Inc. |
 Description: POWER MANAGEMENT IC I.MX8 PRE-PRPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
товар відсутній |
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MC33PF8100EPESR2 | Виробник : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, Auto, QFN 56 |
товар відсутній |