Технічний опис YTE-106-03-G-5-375 Samtec
Description: 2.00 MM FLEXYZ HIGH-DENSITY ELEV, Packaging: Bulk, Connector Type: Elevated Socket, Mounting Type: Through Hole, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 105°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Insulation Height: 0.375" (9.53mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 5.
Інші пропозиції YTE-106-03-G-5-375
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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YTE-106-03-G-5-375 | Виробник : Samtec |
 Conn Elevated Socket SKT 30 POS 2mm Solder ST Top Entry Thru-Hole Layer |
товар відсутній |
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| YTE-106-03-G-5-375 | Виробник : Samtec Inc. |
Description: 2.00 MM FLEXYZ HIGH-DENSITY ELEV Packaging: Bulk Connector Type: Elevated Socket Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 105°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Insulation Height: 0.375" (9.53mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 5 |
товар відсутній |
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YTE-106-03-G-5-375 | Виробник : Samtec |
Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Elevated Socket Strip" |
товар відсутній |