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EM6353BX2SP3B-4.4+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.4V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY1SP3B-2.2+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.2V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY1SP3B-2.9+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)
3000+20.15 грн
Мінімальне замовлення: 3000
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EM6353BY1SP3B-4.4+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.4V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY2SP3B-2.9+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY2SP3B-4.6+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.63V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
3000+16.34 грн
6000+14.95 грн
Мінімальне замовлення: 3000
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EM6353BZ2SP3B-2.9+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BZ2SP3B-3.1+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
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EM6353BZ2SP3B-4.6+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.63V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6354XSP5B-1.8+ EM Microelectronic Description: RESET CIRCUIT WITH ADJUSTABLE DE
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EM6354XSP5B-2.9+ EM Microelectronic Description: RESET CIRCUIT WITH ADJUSTABLE DE
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EM6354YSP5B-4.6+ EM Microelectronic Description: RESET CIRCUIT WITH ADJUSTABLE DE
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EM6420V1LF40D+ EM Microelectronic em6420_ds.pdf Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 2V, 2.2V ~ 3.6V
Current - Supply: 7.5µA, 12µA
Number of Inputs: Up to 16
Supplier Device Package: 40-QFN (6x6)
Proximity Detection: No
LED Driver Channels: Up to 16
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EM6420V4LF40D+ EM Microelectronic em6420_ds.pdf Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 2V, 2.2V ~ 3.6V
Current - Supply: 7.5µA, 12µA
Number of Inputs: Up to 16
Supplier Device Package: 40-QFN (6x6)
Proximity Detection: No
LED Driver Channels: Up to 16
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EM6627WP11-013 EM Microelectronic 6627-ds.pdf Description: IC MCU 4BIT 8KB ROM DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: 512kHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 128 x 8
Operating Temperature: -20°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: ROM
EEPROM Size: 8 x 8
Core Processor: EM6627
Core Size: 4-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: SPI
Peripherals: LCD, POR, PWM, Voltage Detect, WDT
Supplier Device Package: Die
Number of I/O: 8
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EM6819F2-B006-SO08A+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 5.6KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 5.6KB (2K x 22.5)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
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EM6819F2-B006-SO08B+ EM6819F2-B006-SO08B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 8-SOIC
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EM6819F2-B006-TP016B+ EM6819F2-B006-TP016B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 5.6KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 5.6KB (2K x 22.5)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
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EM6819F4-A005-LF20D+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-QFN (4x4)
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EM6819F4-A005-TP16B+ EM6819F4-A005-TP16B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
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EM6819F4-A005-TP20B+ EM6819F4-A005-TP20B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-TSSOP
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EM6819F4-B000-TP028B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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EM6819F4-B000-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
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EM6819F4-B005-SO08B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
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EM6819F4-B005-TP016B+ EM6819F4-B005-TP016B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 16-TSSOP
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EM6819F4-B100-TP028B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
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EM6819F4-B100-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
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EM6819F4-B300-TP028B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
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EM6819F6-A000-LF20D+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-QFN (4x4)
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EM6819F6-A000-LF32D+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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EM6819F6-A000-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
Connectivity: I2C, SPI, UART/USART
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EM6819F6-A000-TP28B+ EM6819F6-A000-TP28B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 28-TSSOP
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EM6819F6-A100-LF20D+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 16
Connectivity: I2C, SPI, UART/USART
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EM6819F6-A100-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 16
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EM6819F6-A100-TP28B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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EM6819F6-B100-LF20D+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Connectivity: I2C, SPI, UART/USART
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EM6819F6-B100-TP16B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 12
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В кошику  од. на суму  грн.
EM6819F6-B100-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
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В кошику  од. на суму  грн.
EM6819F6-B100-TP28B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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В кошику  од. на суму  грн.
EM6819F6-B300-TP020B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
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EM6819F6-B300-TP028B+ EM6819F6-B300-TP028B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 28-TSSOP
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EM7180V1CS16B+ EM Microelectronic Description: LINEAR IC
Packaging: Tape & Reel (TR)
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EM7604V00SP6B+ EM7604V00SP6B+ EM Microelectronic em7604_ds.pdf Description: CRYSTAL 32.7680KHZ SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Size / Dimension: 0.114" L x 0.063" W (2.90mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.057" (1.45mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
Supplier Device Package: 4-VDFN (3.2x2.5)
на замовлення 5807 шт:
термін постачання 21-31 дні (днів)
4+92.52 грн
10+64.83 грн
25+58.77 грн
100+48.82 грн
250+45.81 грн
500+44.00 грн
1000+41.81 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
EM7604V00SP6B+ EM7604V00SP6B+ EM Microelectronic em7604_ds.pdf Description: CRYSTAL 32.7680KHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Size / Dimension: 0.114" L x 0.063" W (2.90mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.057" (1.45mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
Supplier Device Package: 4-VDFN (3.2x2.5)
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EM7604V20SCP4B+ EM7604V20SCP4B+ EM Microelectronic em7604-c7_ds_0.pdf Description: CRYSTAL 32.6780KHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.059" W (3.20mm x 1.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
1000+151.58 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
EM7604V20SCP4B+ EM7604V20SCP4B+ EM Microelectronic em7604-c7_ds_0.pdf Description: CRYSTAL 32.6780KHZ SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.059" W (3.20mm x 1.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
на замовлення 2193 шт:
термін постачання 21-31 дні (днів)
1+416.35 грн
10+262.43 грн
25+226.14 грн
100+173.73 грн
250+154.82 грн
500+143.19 грн
В кошику  од. на суму  грн.
EM8500-A001-LF24B+ EM8500-A001-LF24B+ EM Microelectronic 8500-ds.pdf Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 0.1V ~ 1.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
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EM8500-A001-LF24B+ EM8500-A001-LF24B+ EM Microelectronic 8500-ds.pdf Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 0.1V ~ 1.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
на замовлення 164 шт:
термін постачання 21-31 дні (днів)
2+281.70 грн
10+243.42 грн
25+230.12 грн
100+187.18 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
EM8502-A005-LF24B+ EM8502-A005-LF24B+ EM Microelectronic Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
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В кошику  од. на суму  грн.
EM8502-A005-LF24B+ EM8502-A005-LF24B+ EM Microelectronic Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
на замовлення 2497 шт:
термін постачання 21-31 дні (днів)
1+1271.35 грн
10+857.14 грн
25+761.42 грн
100+616.40 грн
В кошику  од. на суму  грн.
EM8900-V001-DF10B+ EM8900-V001-DF10B+ EM Microelectronic 8900-ds.pdf Description: ULTRA-LOW VOLTAGE DCDC BOOST CON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 10-DFN (3x3)
Part Status: Active
на замовлення 5232 шт:
термін постачання 21-31 дні (днів)
3+128.04 грн
10+90.53 грн
25+82.38 грн
100+68.89 грн
250+64.87 грн
500+62.44 грн
1000+59.45 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
EM8900-V001-DF10B+ EM8900-V001-DF10B+ EM Microelectronic 8900-ds.pdf Description: ULTRA-LOW VOLTAGE DCDC BOOST CON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 10-DFN (3x3)
Part Status: Active
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EM9301V02LF24B+ EM Microelectronic Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V, 2.3V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
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EM9301V02LF24D+ EM Microelectronic Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 3dBm
Protocol: Bluetooth v4.0
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
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EM9301V02WW7 EM Microelectronic Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V, 2.3V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
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EM9301V22LF24B+ EM Microelectronic Description: IC RF TXRX+MCU BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
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В кошику  од. на суму  грн.
EM9304V01CS25B EM Microelectronic 9304-DS.pdf Description: OPTIMIZED BLUETOOTH 5.0 LOW ENER
Packaging: Tape & Reel (TR)
Package / Case: 25-UFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 25-WLCSP (2.34x2.21)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)
4000+123.16 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
EM9304V01CS25B EM Microelectronic 9304-DS.pdf Description: OPTIMIZED BLUETOOTH 5.0 LOW ENER
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 25-WLCSP (2.34x2.21)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 19925 шт:
термін постачання 21-31 дні (днів)
2+247.83 грн
10+214.31 грн
25+202.60 грн
100+164.77 грн
250+156.32 грн
500+140.26 грн
1000+116.35 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
EM9304V01LF28B EM9304V01LF28B EM Microelectronic 9304-DS.pdf Description: IC RF TXRX+MCU BLE 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3535 шт:
термін постачання 21-31 дні (днів)
2+309.78 грн
10+192.83 грн
25+165.21 грн
100+125.75 грн
250+111.38 грн
500+102.53 грн
1000+93.56 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
EM9304V01LF28B EM9304V01LF28B EM Microelectronic 9304-DS.pdf Description: IC RF TXRX+MCU BLE 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+113.86 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
EM6353BX2SP3B-4.4+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.4V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY1SP3B-2.2+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.2V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY1SP3B-2.9+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+20.15 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
EM6353BY1SP3B-4.4+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.4V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY2SP3B-2.9+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY2SP3B-4.6+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.63V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+16.34 грн
6000+14.95 грн
Мінімальне замовлення: 3000
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EM6353BZ2SP3B-2.9+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BZ2SP3B-3.1+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
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EM6353BZ2SP3B-4.6+
Виробник: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.63V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6354XSP5B-1.8+
Виробник: EM Microelectronic
Description: RESET CIRCUIT WITH ADJUSTABLE DE
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EM6354XSP5B-2.9+
Виробник: EM Microelectronic
Description: RESET CIRCUIT WITH ADJUSTABLE DE
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EM6354YSP5B-4.6+
Виробник: EM Microelectronic
Description: RESET CIRCUIT WITH ADJUSTABLE DE
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EM6420V1LF40D+ em6420_ds.pdf
Виробник: EM Microelectronic
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 2V, 2.2V ~ 3.6V
Current - Supply: 7.5µA, 12µA
Number of Inputs: Up to 16
Supplier Device Package: 40-QFN (6x6)
Proximity Detection: No
LED Driver Channels: Up to 16
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EM6420V4LF40D+ em6420_ds.pdf
Виробник: EM Microelectronic
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 2V, 2.2V ~ 3.6V
Current - Supply: 7.5µA, 12µA
Number of Inputs: Up to 16
Supplier Device Package: 40-QFN (6x6)
Proximity Detection: No
LED Driver Channels: Up to 16
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EM6627WP11-013 6627-ds.pdf
Виробник: EM Microelectronic
Description: IC MCU 4BIT 8KB ROM DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: 512kHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 128 x 8
Operating Temperature: -20°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: ROM
EEPROM Size: 8 x 8
Core Processor: EM6627
Core Size: 4-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: SPI
Peripherals: LCD, POR, PWM, Voltage Detect, WDT
Supplier Device Package: Die
Number of I/O: 8
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EM6819F2-B006-SO08A+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 5.6KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 5.6KB (2K x 22.5)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
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EM6819F2-B006-SO08B+
EM6819F2-B006-SO08B+
Виробник: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 8-SOIC
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EM6819F2-B006-TP016B+ 6819-DS.pdf
EM6819F2-B006-TP016B+
Виробник: EM Microelectronic
Description: IC MCU 8BIT 5.6KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 5.6KB (2K x 22.5)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
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EM6819F4-A005-LF20D+
Виробник: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-QFN (4x4)
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EM6819F4-A005-TP16B+ 6819-DS.pdf
EM6819F4-A005-TP16B+
Виробник: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
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EM6819F4-A005-TP20B+
EM6819F4-A005-TP20B+
Виробник: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-TSSOP
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EM6819F4-B000-TP028B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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EM6819F4-B000-TP20B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
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EM6819F4-B005-SO08B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
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EM6819F4-B005-TP016B+
EM6819F4-B005-TP016B+
Виробник: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 16-TSSOP
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EM6819F4-B100-TP028B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
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EM6819F4-B100-TP20B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
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EM6819F4-B300-TP028B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
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EM6819F6-A000-LF20D+
Виробник: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-QFN (4x4)
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EM6819F6-A000-LF32D+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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EM6819F6-A000-TP20B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
Connectivity: I2C, SPI, UART/USART
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EM6819F6-A000-TP28B+
EM6819F6-A000-TP28B+
Виробник: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 28-TSSOP
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EM6819F6-A100-LF20D+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 16
Connectivity: I2C, SPI, UART/USART
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EM6819F6-A100-TP20B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 16
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EM6819F6-A100-TP28B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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EM6819F6-B100-LF20D+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Connectivity: I2C, SPI, UART/USART
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EM6819F6-B100-TP16B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 12
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EM6819F6-B100-TP20B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
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EM6819F6-B100-TP28B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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EM6819F6-B300-TP020B+ 6819-DS.pdf
Виробник: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
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EM6819F6-B300-TP028B+
EM6819F6-B300-TP028B+
Виробник: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 28-TSSOP
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EM7180V1CS16B+
Виробник: EM Microelectronic
Description: LINEAR IC
Packaging: Tape & Reel (TR)
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EM7604V00SP6B+ em7604_ds.pdf
EM7604V00SP6B+
Виробник: EM Microelectronic
Description: CRYSTAL 32.7680KHZ SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Size / Dimension: 0.114" L x 0.063" W (2.90mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.057" (1.45mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
Supplier Device Package: 4-VDFN (3.2x2.5)
на замовлення 5807 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+92.52 грн
10+64.83 грн
25+58.77 грн
100+48.82 грн
250+45.81 грн
500+44.00 грн
1000+41.81 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
EM7604V00SP6B+ em7604_ds.pdf
EM7604V00SP6B+
Виробник: EM Microelectronic
Description: CRYSTAL 32.7680KHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Size / Dimension: 0.114" L x 0.063" W (2.90mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.057" (1.45mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
Supplier Device Package: 4-VDFN (3.2x2.5)
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EM7604V20SCP4B+ em7604-c7_ds_0.pdf
EM7604V20SCP4B+
Виробник: EM Microelectronic
Description: CRYSTAL 32.6780KHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.059" W (3.20mm x 1.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+151.58 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
EM7604V20SCP4B+ em7604-c7_ds_0.pdf
EM7604V20SCP4B+
Виробник: EM Microelectronic
Description: CRYSTAL 32.6780KHZ SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.059" W (3.20mm x 1.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
на замовлення 2193 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+416.35 грн
10+262.43 грн
25+226.14 грн
100+173.73 грн
250+154.82 грн
500+143.19 грн
В кошику  од. на суму  грн.
EM8500-A001-LF24B+ 8500-ds.pdf
EM8500-A001-LF24B+
Виробник: EM Microelectronic
Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 0.1V ~ 1.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
EM8500-A001-LF24B+ 8500-ds.pdf
EM8500-A001-LF24B+
Виробник: EM Microelectronic
Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 0.1V ~ 1.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
на замовлення 164 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+281.70 грн
10+243.42 грн
25+230.12 грн
100+187.18 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
EM8502-A005-LF24B+
EM8502-A005-LF24B+
Виробник: EM Microelectronic
Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
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EM8502-A005-LF24B+
EM8502-A005-LF24B+
Виробник: EM Microelectronic
Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
на замовлення 2497 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1271.35 грн
10+857.14 грн
25+761.42 грн
100+616.40 грн
В кошику  од. на суму  грн.
EM8900-V001-DF10B+ 8900-ds.pdf
EM8900-V001-DF10B+
Виробник: EM Microelectronic
Description: ULTRA-LOW VOLTAGE DCDC BOOST CON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 10-DFN (3x3)
Part Status: Active
на замовлення 5232 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+128.04 грн
10+90.53 грн
25+82.38 грн
100+68.89 грн
250+64.87 грн
500+62.44 грн
1000+59.45 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
EM8900-V001-DF10B+ 8900-ds.pdf
EM8900-V001-DF10B+
Виробник: EM Microelectronic
Description: ULTRA-LOW VOLTAGE DCDC BOOST CON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 10-DFN (3x3)
Part Status: Active
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EM9301V02LF24B+
Виробник: EM Microelectronic
Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V, 2.3V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
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В кошику  од. на суму  грн.
EM9301V02LF24D+
Виробник: EM Microelectronic
Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 3dBm
Protocol: Bluetooth v4.0
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
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EM9301V02WW7
Виробник: EM Microelectronic
Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V, 2.3V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
товару немає в наявності
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EM9301V22LF24B+
Виробник: EM Microelectronic
Description: IC RF TXRX+MCU BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
товару немає в наявності
В кошику  од. на суму  грн.
EM9304V01CS25B 9304-DS.pdf
Виробник: EM Microelectronic
Description: OPTIMIZED BLUETOOTH 5.0 LOW ENER
Packaging: Tape & Reel (TR)
Package / Case: 25-UFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 25-WLCSP (2.34x2.21)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+123.16 грн
Мінімальне замовлення: 4000
В кошику  од. на суму  грн.
EM9304V01CS25B 9304-DS.pdf
Виробник: EM Microelectronic
Description: OPTIMIZED BLUETOOTH 5.0 LOW ENER
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 25-WLCSP (2.34x2.21)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 19925 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+247.83 грн
10+214.31 грн
25+202.60 грн
100+164.77 грн
250+156.32 грн
500+140.26 грн
1000+116.35 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
EM9304V01LF28B 9304-DS.pdf
EM9304V01LF28B
Виробник: EM Microelectronic
Description: IC RF TXRX+MCU BLE 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 3535 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+309.78 грн
10+192.83 грн
25+165.21 грн
100+125.75 грн
250+111.38 грн
500+102.53 грн
1000+93.56 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
EM9304V01LF28B 9304-DS.pdf
EM9304V01LF28B
Виробник: EM Microelectronic
Description: IC RF TXRX+MCU BLE 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+113.86 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
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