Продукція > HARIMATEC INC. > Всі товари виробника HARIMATEC INC. (128) > Сторінка 2 з 3
Фото | Назва | Виробник | Інформація |
Доступність |
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386826 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386827 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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386832 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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386838 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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386839 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386840 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Rosin Activated (RA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386844 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
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386848 | Harimatec Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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386851 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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386857 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386862 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 102 шт: термін постачання 21-31 дні (днів) |
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386876 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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386927 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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389261 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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389283 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Water Soluble |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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392249 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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395437 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.028" (0.71mm) Wire Gauge: 21 AWG, 22 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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395439 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.050" (1.27mm) Wire Gauge: 16 AWG, 18 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 124 шт: термін постачання 21-31 дні (днів) |
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395442 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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395451 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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395465 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 43 шт: термін постачання 21-31 дні (днів) |
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395467 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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397102 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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397127 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn62Pb38 (62/38) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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397952 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 107 шт: термін постачання 21-31 дні (днів) |
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397982 | Harimatec Inc. |
![]() Packaging: Spool Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
412183 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
412185 | Harimatec Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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450314 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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519430 | Harimatec Inc. |
![]() Packaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Tacky Solder Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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536290 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.128" (3.25mm) Wire Gauge: 8 AWG, 10 SWG Composition: Sn97Cu3 (97/3) Type: Wire Solder Form: Spool, 22.05 lbs (10kg) Process: Lead Free Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
544784 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
550014 | Harimatec Inc. |
![]() Packaging: Dispenser Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 2.65 oz (75g) Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
556385 | Harimatec Inc. |
![]() Packaging: Bulk Length: 100' (30.5m) Type: No Clean Width: 0.060" (1.52mm) ESD Protection: Static Dissipative (SD) Product Type: Braid/Wick Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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583489 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 0.88 oz (25g) Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: Room Temperature Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
605500 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 5.51 lbs (2.5kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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673828 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 73 шт: термін постачання 21-31 дні (днів) |
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673829 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 166 шт: термін постачання 21-31 дні (днів) |
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673831 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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673832 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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680290 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Bar Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Bar, 2.5 lbs (1.13kg) Process: Lead Free Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
692857 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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706397 | Harimatec Inc. |
![]() Packaging: Bulk Type: Tip Tinner (Activator) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
716856 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 2.20 lbs (1kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
721440 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
721471 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
721472 | Harimatec Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 2.65 oz (75g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
721473 | Harimatec Inc. |
![]() Packaging: Bulk Type: Solder Paste Form: Syringe, 1.06 oz (30g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
727190 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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732977 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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732998 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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732999 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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733001 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 461 шт: термін постачання 21-31 дні (днів) |
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733002 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 112 шт: термін постачання 21-31 дні (днів) |
|
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733010 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
733024 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
760088 | Harimatec Inc. |
![]() Packaging: Bulk Type: Flux - No Clean Form: Pen, 0.34 oz (9.64g) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
![]() |
796037 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: Rosin Mildly Activated (RMA) Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
|
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796065 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
|
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818006 | Harimatec Inc. |
![]() Packaging: Bulk Diameter: 0.028" (0.71mm) Wire Gauge: 21 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
386826 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 1% .020DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 1% .020DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
386827 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 370 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3369.46 грн |
5+ | 2796.51 грн |
10+ | 2622.78 грн |
40+ | 2164.41 грн |
386832 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 370 3% .064DIA. 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .064DIA. 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3351.15 грн |
5+ | 2781.18 грн |
10+ | 2608.45 грн |
386838 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 C511 5C 1.22MM 0.5KG.048"
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Description: 60/40 C511 5C 1.22MM 0.5KG.048"
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
386839 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 370 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: 63/37 370 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товару немає в наявності
В кошику
од. на суму грн.
386840 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 370, 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: 63/37 370, 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товару немає в наявності
В кошику
од. на суму грн.
386844 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 70 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2193.25 грн |
5+ | 1820.66 грн |
10+ | 1707.62 грн |
40+ | 1409.51 грн |
386848 |
![]() |
Виробник: Harimatec Inc.
Description: 96SC C502 5C 0.81MM 0.5KG AM
Description: 96SC C502 5C 0.81MM 0.5KG AM
товару немає в наявності
В кошику
од. на суму грн.
386851 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 52 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4365.81 грн |
5+ | 3623.39 грн |
10+ | 3398.08 грн |
40+ | 2803.78 грн |
386857 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
386862 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 102 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3652.77 грн |
5+ | 3031.47 грн |
10+ | 2843.18 грн |
40+ | 2346.20 грн |
80+ | 2199.51 грн |
386876 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 39 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3681.42 грн |
5+ | 3055.23 грн |
10+ | 2865.40 грн |
386927 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3564.43 грн |
5+ | 2958.05 грн |
10+ | 2774.29 грн |
389261 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 370 3% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2498.05 грн |
5+ | 2073.24 грн |
10+ | 1944.58 грн |
25+ | 1676.51 грн |
389283 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 HX 3C 0.38MM 0.25KG .015"
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
Description: 63/37 HX 3C 0.38MM 0.25KG .015"
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
товару немає в наявності
В кошику
од. на суму грн.
392249 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 15 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3883.55 грн |
5+ | 3223.36 грн |
10+ | 3023.12 грн |
395437 |
![]() |
Виробник: Harimatec Inc.
Description: HMP 366 3% .028DIA 21AWG
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .028DIA 21AWG
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 72 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3147.43 грн |
5+ | 2611.98 грн |
10+ | 2449.67 грн |
40+ | 2021.60 грн |
395439 |
![]() |
Виробник: Harimatec Inc.
Description: HMP 366 3% .050DIA 16AWG
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .050DIA 16AWG
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 124 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3094.11 грн |
5+ | 2567.84 грн |
10+ | 2408.36 грн |
40+ | 1987.52 грн |
80+ | 1863.39 грн |
120+ | 1794.24 грн |
395442 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 1% .064DIA 14AWG
Packaging: Spool
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 1% .064DIA 14AWG
Packaging: Spool
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
395451 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3899.47 грн |
5+ | 3236.08 грн |
10+ | 3034.99 грн |
395465 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 3% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 43 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3885.14 грн |
5+ | 3224.59 грн |
10+ | 3024.19 грн |
40+ | 2495.45 грн |
395467 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 370 5C 1.22MM 0.5KG AM
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 5C 1.22MM 0.5KG AM
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3359.91 грн |
5+ | 2788.23 грн |
10+ | 2615.04 грн |
397102 |
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Виробник: Harimatec Inc.
Description: 63/37 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3474.50 грн |
5+ | 2883.57 грн |
397127 |
![]() |
Виробник: Harimatec Inc.
Description: SN62 370 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb38 (62/38)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: SN62 370 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb38 (62/38)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товару немає в наявності
В кошику
од. на суму грн.
397952 |
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Виробник: Harimatec Inc.
Description: HMP 366 3% .022DIA. 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .022DIA. 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 107 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2085.02 грн |
5+ | 1730.38 грн |
10+ | 1622.94 грн |
40+ | 1339.65 грн |
80+ | 1256.14 грн |
397982 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .015DIA 27AWG
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Description: 63/37 CRYSL 502 3% .015DIA 27AWG
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
412183 |
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Виробник: Harimatec Inc.
Description: 96SC C511 3C 1.02MM 0.5KG .040"
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 3C 1.02MM 0.5KG .040"
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
412185 |
![]() |
Виробник: Harimatec Inc.
Description: 96SC C502 5C 0.56MM 0.25KG.022"
Description: 96SC C502 5C 0.56MM 0.25KG.022"
товару немає в наявності
В кошику
од. на суму грн.
450314 |
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Виробник: Harimatec Inc.
Description: 63/37 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4326.82 грн |
5+ | 3591.05 грн |
10+ | 3367.74 грн |
40+ | 2778.73 грн |
519430 |
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Виробник: Harimatec Inc.
Description: MP200 RWF SOLDER FLUX NO CLEAN
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: MP200 RWF SOLDER FLUX NO CLEAN
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3480.08 грн |
5+ | 3071.78 грн |
10+ | 2652.98 грн |
536290 |
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Виробник: Harimatec Inc.
Description: 97CU3 ARAX 4C 3.25MM 10KG AM
Packaging: Bulk
Diameter: 0.128" (3.25mm)
Wire Gauge: 8 AWG, 10 SWG
Composition: Sn97Cu3 (97/3)
Type: Wire Solder
Form: Spool, 22.05 lbs (10kg)
Process: Lead Free
Part Status: Obsolete
Description: 97CU3 ARAX 4C 3.25MM 10KG AM
Packaging: Bulk
Diameter: 0.128" (3.25mm)
Wire Gauge: 8 AWG, 10 SWG
Composition: Sn97Cu3 (97/3)
Type: Wire Solder
Form: Spool, 22.05 lbs (10kg)
Process: Lead Free
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
544784 |
![]() |
Виробник: Harimatec Inc.
Description: WS200 RWF 30G SYRINGE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: WS200 RWF 30G SYRINGE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
550014 |
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Виробник: Harimatec Inc.
Description: 63/37 WS200 SOLDER PASTE 75GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 2.65 oz (75g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: 63/37 WS200 SOLDER PASTE 75GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 2.65 oz (75g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
556385 |
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Виробник: Harimatec Inc.
Description: DESOLDER BRAID NO-CLN 0.06" 100'
Packaging: Bulk
Length: 100' (30.5m)
Type: No Clean
Width: 0.060" (1.52mm)
ESD Protection: Static Dissipative (SD)
Product Type: Braid/Wick
Part Status: Obsolete
Description: DESOLDER BRAID NO-CLN 0.06" 100'
Packaging: Bulk
Length: 100' (30.5m)
Type: No Clean
Width: 0.060" (1.52mm)
ESD Protection: Static Dissipative (SD)
Product Type: Braid/Wick
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
583489 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 MP200 SOLDER FLUX 25GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 0.88 oz (25g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: Room Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: 63/37 MP200 SOLDER FLUX 25GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 0.88 oz (25g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: Room Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
605500 |
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Виробник: Harimatec Inc.
Description: 96SC C511 5C 0.56MM 0.25KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 5C 0.56MM 0.25KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
673828 |
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Виробник: Harimatec Inc.
Description: 97SC 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 73 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4441.41 грн |
5+ | 3685.77 грн |
10+ | 3456.63 грн |
40+ | 2852.07 грн |
673829 |
![]() |
Виробник: Harimatec Inc.
Description: 97SC 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 166 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7636.59 грн |
5+ | 6335.75 грн |
20+ | 5570.11 грн |
40+ | 4899.94 грн |
60+ | 4717.56 грн |
100+ | 4496.81 грн |
673831 |
![]() |
Виробник: Harimatec Inc.
Description: 97SC 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7578.50 грн |
5+ | 6288.39 грн |
20+ | 5528.42 грн |
673832 |
![]() |
Виробник: Harimatec Inc.
Description: 97SC 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7463.10 грн |
5+ | 6192.45 грн |
680290 |
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Виробник: Harimatec Inc.
Description: 99C BAR SOLDER 2LB +/- 0.2LB
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 99C BAR SOLDER 2LB +/- 0.2LB
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
692857 |
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Виробник: Harimatec Inc.
Description: 96SC C511 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
706397 |
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Виробник: Harimatec Inc.
Description: SOLDER TIP TINNER (ACTIVATOR)1PC
Packaging: Bulk
Type: Tip Tinner (Activator)
Part Status: Obsolete
Description: SOLDER TIP TINNER (ACTIVATOR)1PC
Packaging: Bulk
Type: Tip Tinner (Activator)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
716856 |
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Виробник: Harimatec Inc.
Description: 99C C511 3C 1.63MM 1KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 2.20 lbs (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 99C C511 3C 1.63MM 1KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 2.20 lbs (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
721440 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
721471 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
721472 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 75G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 75G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
721473 |
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Виробник: Harimatec Inc.
Description: LF318 TACKY FLUX
Packaging: Bulk
Type: Solder Paste
Form: Syringe, 1.06 oz (30g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LF318 TACKY FLUX
Packaging: Bulk
Type: Solder Paste
Form: Syringe, 1.06 oz (30g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
727190 |
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Виробник: Harimatec Inc.
Description: 99C C511 3C 0.56MM 0.5KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 99C C511 3C 0.56MM 0.5KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
732977 |
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Виробник: Harimatec Inc.
Description: 97SC HYDRO-X 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC HYDRO-X 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8163.42 грн |
732998 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7437.64 грн |
5+ | 6171.30 грн |
20+ | 5425.58 грн |
732999 |
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Виробник: Harimatec Inc.
Description: 97SC C511 3C 1.22MM 0.5KG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Description: 97SC C511 3C 1.22MM 0.5KG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
733001 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .022DIA 22AWG 24SWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .022DIA 22AWG 24SWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 461 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4454.94 грн |
5+ | 3697.26 грн |
10+ | 3467.28 грн |
40+ | 2860.85 грн |
80+ | 2681.77 грн |
120+ | 2582.00 грн |
733002 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 112 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7661.26 грн |
5+ | 6356.75 грн |
20+ | 5588.54 грн |
40+ | 4916.20 грн |
60+ | 4733.21 грн |
100+ | 4511.73 грн |
733010 |
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Виробник: Harimatec Inc.
Description: 96SC C511 3C 0.81MM 0.5KG .032"
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 96SC C511 3C 0.81MM 0.5KG .032"
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
733024 |
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Виробник: Harimatec Inc.
Description: 96SC C400 3C 0.56MM 0.25KG.022"
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C400 3C 0.56MM 0.25KG.022"
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
760088 |
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Виробник: Harimatec Inc.
Description: FLUX - NO CLEAN PEN
Packaging: Bulk
Type: Flux - No Clean
Form: Pen, 0.34 oz (9.64g)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: FLUX - NO CLEAN PEN
Packaging: Bulk
Type: Flux - No Clean
Form: Pen, 0.34 oz (9.64g)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
796037 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
Description: 97SC C511 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4573.52 грн |
5+ | 3795.51 грн |
10+ | 3559.63 грн |
40+ | 2936.95 грн |
796065 |
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Виробник: Harimatec Inc.
Description: 97SC 400 2% 0.38 DIA
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC 400 2% 0.38 DIA
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4473.25 грн |
5+ | 3711.82 грн |
10+ | 3481.15 грн |
40+ | 2872.23 грн |
818006 |
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Виробник: Harimatec Inc.
Description: 63/37 C400 5C 0.71MM 0.5KG AM
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 C400 5C 0.71MM 0.5KG AM
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.