Продукція > HARIMATEC INC. > Всі товари виробника HARIMATEC INC. (129) > Сторінка 2 з 3
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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386825 | Harimatec Inc. |
Description: 63/37 400 1% .032DIA 20AWGPackaging: Spool Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386826 | Harimatec Inc. |
Description: 63/37 400 1% .020DIA 22AWGPackaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386827 | Harimatec Inc. |
Description: 60/40 370 3% .032DIA 20AWGPackaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 98 шт: термін постачання 21-31 дні (днів) |
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386832 | Harimatec Inc. |
Description: 60/40 370 3% .064DIA. 14AWGPackaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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| 386838 | Harimatec Inc. |
Description: 60/40 C511 5C 1.22MM 0.5KG.048"Packaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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386839 | Harimatec Inc. |
Description: 63/37 370 3% .032DIA 20AWGPackaging: Spool Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386840 | Harimatec Inc. |
Description: 63/37 370, 3% .024DIA 22AWGPackaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Rosin Activated (RA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386844 | Harimatec Inc. |
Description: 63/37 400 2% .015DIA 27AWGPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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| 386848 | Harimatec Inc. |
Description: 96SC C502 5C 0.81MM 0.5KG AM |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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386851 | Harimatec Inc. |
Description: 63/37 CRYSL 502 2% .022DIA 23AWGPackaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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386857 | Harimatec Inc. |
Description: 63/37 400 3% .032DIA 20AWGPackaging: Spool Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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386862 | Harimatec Inc. |
Description: 63/37 CRYSL 502 2% .032DIA 20AWGPackaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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386876 | Harimatec Inc. |
Description: 63/37 400 2% .024DIA 22AWGPackaging: Bulk Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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386927 | Harimatec Inc. |
Description: 63/37 400 2% .032DIA 20AWGPackaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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389261 | Harimatec Inc. |
Description: 60/40 370 3% .015DIA 27AWGPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 76 шт: термін постачання 21-31 дні (днів) |
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| 389283 | Harimatec Inc. |
Description: 63/37 HX 3C 0.38MM 0.25KG .015"Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Water Soluble |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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392249 | Harimatec Inc. |
Description: 63/37 400 2% .064DIA 14AWGPackaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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395437 | Harimatec Inc. |
Description: HMP 366 3% .028DIA 21AWGPackaging: Bulk Diameter: 0.028" (0.71mm) Wire Gauge: 21 AWG, 22 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 316 шт: термін постачання 21-31 дні (днів) |
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395439 | Harimatec Inc. |
Description: HMP 366 3% .050DIA 16AWGPackaging: Bulk Diameter: 0.050" (1.27mm) Wire Gauge: 16 AWG, 18 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 152 шт: термін постачання 21-31 дні (днів) |
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395442 | Harimatec Inc. |
Description: 63/37 400 1% .064DIA 14AWGPackaging: Spool Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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395451 | Harimatec Inc. |
Description: 63/37 CRYSL 502 3% .032DIA 20AWGPackaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 80 шт: термін постачання 21-31 дні (днів) |
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395465 | Harimatec Inc. |
Description: 63/37 CRYSL 502 3% .064DIA 14AWGPackaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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395467 | Harimatec Inc. |
Description: 60/40 370 5C 1.22MM 0.5KG AMPackaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 374°F (183 ~ 190°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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397102 | Harimatec Inc. |
Description: 63/37 400 2% .048DIA 16AWGPackaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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397127 | Harimatec Inc. |
Description: SN62 370 3% .024DIA 22AWGPackaging: Spool Diameter: 0.024" (0.61mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn62Pb38 (62/38) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: Rosin Activated (RA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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397952 | Harimatec Inc. |
Description: HMP 366 3% .022DIA. 23AWGPackaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5) Type: Wire Solder Melting Point: 565 ~ 574°F (296 ~ 301°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: Rosin Activated (RA) |
на замовлення 51 шт: термін постачання 21-31 дні (днів) |
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397982 | Harimatec Inc. |
Description: 63/37 CRYSL 502 3% .015DIA 27AWGPackaging: Spool Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 412183 | Harimatec Inc. |
Description: 96SC C511 3C 1.02MM 0.5KG .040"Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 412185 | Harimatec Inc. |
Description: 96SC C502 5C 0.56MM 0.25KG.022" |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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450314 | Harimatec Inc. |
Description: 63/37 400 2% .022DIA 23AWGPackaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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519430 | Harimatec Inc. |
Description: MP200 RWF SOLDER FLUX NO CLEANPackaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Tacky Solder Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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| 536290 | Harimatec Inc. |
Description: 97CU3 ARAX 4C 3.25MM 10KG AMPackaging: Bulk Diameter: 0.128" (3.25mm) Wire Gauge: 8 AWG, 10 SWG Composition: Sn97Cu3 (97/3) Type: Wire Solder Form: Spool, 22.05 lbs (10kg) Process: Lead Free Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 544784 | Harimatec Inc. |
Description: WS200 RWF 30G SYRINGEPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 550014 | Harimatec Inc. |
Description: 63/37 WS200 SOLDER PASTE 75GMPackaging: Dispenser Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 2.65 oz (75g) Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 556385 | Harimatec Inc. |
Description: DESOLDER BRAID NO-CLN 0.06" 100'Packaging: Bulk Length: 100' (30.5m) Type: No Clean Width: 0.060" (1.52mm) ESD Protection: Static Dissipative (SD) Product Type: Braid/Wick Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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583489 | Harimatec Inc. |
Description: 63/37 MP200 SOLDER FLUX 25GMPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 0.88 oz (25g) Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: Room Temperature Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 605500 | Harimatec Inc. |
Description: 96SC C511 5C 0.56MM 0.25KGPackaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 5.51 lbs (2.5kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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673828 | Harimatec Inc. |
Description: 97SC 400 2% .022DIA 23AWGPackaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 168 шт: термін постачання 21-31 дні (днів) |
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673829 | Harimatec Inc. |
Description: 97SC 400 2% .032DIA 20AWGPackaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 259 шт: термін постачання 21-31 дні (днів) |
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673831 | Harimatec Inc. |
Description: 97SC 400 2% .048DIA 16AWGPackaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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673832 | Harimatec Inc. |
Description: 97SC 400 2% .064DIA 14AWGPackaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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680290 | Harimatec Inc. |
Description: 99C BAR SOLDER 2LB +/- 0.2LBPackaging: Bulk Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Bar Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Bar, 2.5 lbs (1.13kg) Process: Lead Free Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 692857 | Harimatec Inc. |
Description: 96SC C511 5C 0.81MM 0.5KG AMPackaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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706397 | Harimatec Inc. |
Description: SOLDER TIP TINNER (ACTIVATOR)1PCPackaging: Bulk Type: Tip Tinner (Activator) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 716856 | Harimatec Inc. |
Description: 99C C511 3C 1.63MM 1KG AMPackaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 2.20 lbs (1kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 721440 | Harimatec Inc. |
Description: LOCTITE LF 318 97SCAGS885V 500GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 721471 | Harimatec Inc. |
Description: LOCTITE LF 318 97SCAGS885V 600GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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| 721472 | Harimatec Inc. |
Description: LOCTITE LF 318 97SCAGS885V 75G SPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 2.65 oz (75g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 721473 | Harimatec Inc. |
Description: LF318 TACKY FLUXPackaging: Bulk Type: Solder Paste Form: Syringe, 1.06 oz (30g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 727190 | Harimatec Inc. |
Description: 99C C511 3C 0.56MM 0.5KGPackaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 440 ~ 464°F (227 ~ 240°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
|
|
732977 | Harimatec Inc. |
Description: 97SC HYDRO-X 2% .064DIA 14AWGPackaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
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|
|
732998 | Harimatec Inc. |
Description: 97SC C511 2% .064DIA 14AWGPackaging: Bulk Diameter: 0.064" (1.63mm) Wire Gauge: 14 AWG, 16 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
|
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| 732999 | Harimatec Inc. |
Description: 97SC C511 3C 1.22MM 0.5KGPackaging: Bulk Diameter: 0.048" (1.22mm) Wire Gauge: 16 AWG, 18 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
|
733001 | Harimatec Inc. |
Description: 97SC C511 2% .022DIA 22AWG 24SWGPackaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 327 шт: термін постачання 21-31 дні (днів) |
|
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|
|
733002 | Harimatec Inc. |
Description: 97SC C511 2% .032DIA 20AWGPackaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 97 шт: термін постачання 21-31 дні (днів) |
|
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| 733010 | Harimatec Inc. |
Description: 96SC C511 3C 0.81MM 0.5KG .032"Packaging: Bulk Diameter: 0.032" (0.81mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 733024 | Harimatec Inc. |
Description: 96SC C400 3C 0.56MM 0.25KG.022"Packaging: Bulk Diameter: 0.022" (0.56mm) Wire Gauge: 23 AWG, 24 SWG Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 760088 | Harimatec Inc. |
Description: FLUX - NO CLEAN PENPackaging: Bulk Type: Flux - No Clean Form: Pen, 0.34 oz (9.64g) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
|
796037 | Harimatec Inc. |
Description: 97SC C511 2% .015DIA 27AWGPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: Rosin Mildly Activated (RMA) Part Status: Active |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
|
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|
796065 | Harimatec Inc. |
Description: 97SC 400 2% 0.38 DIAPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423°F (217°C) Form: Spool, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
|
| 386825 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 1% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 1% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
| 386826 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 1% .020DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 1% .020DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
| 386827 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 370 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 98 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3397.03 грн |
| 5+ | 2818.91 грн |
| 10+ | 2643.87 грн |
| 40+ | 2181.78 грн |
| 80+ | 2045.45 грн |
| 386832 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 370 3% .064DIA. 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .064DIA. 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 39 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3378.25 грн |
| 5+ | 2803.50 грн |
| 10+ | 2629.40 грн |
| 386838 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 C511 5C 1.22MM 0.5KG.048"
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Description: 60/40 C511 5C 1.22MM 0.5KG.048"
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 386839 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 370 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: 63/37 370 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товару немає в наявності
В кошику
од. на суму грн.
| 386840 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 370, 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: 63/37 370, 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товару немає в наявності
В кошику
од. на суму грн.
| 386844 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2195.82 грн |
| 5+ | 1822.76 грн |
| 10+ | 1709.60 грн |
| 40+ | 1411.11 грн |
| 386848 |
![]() |
Виробник: Harimatec Inc.
Description: 96SC C502 5C 0.81MM 0.5KG AM
Description: 96SC C502 5C 0.81MM 0.5KG AM
товару немає в наявності
В кошику
од. на суму грн.
| 386851 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 39 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4368.78 грн |
| 5+ | 3625.39 грн |
| 10+ | 3400.02 грн |
| 386857 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 3% .032DIA 20AWG
Packaging: Spool
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
| 386862 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3627.31 грн |
| 386876 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .024DIA 22AWG
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3683.66 грн |
| 5+ | 3057.02 грн |
| 10+ | 2867.03 грн |
| 386927 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3568.52 грн |
| 5+ | 2961.40 грн |
| 10+ | 2777.47 грн |
| 389261 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 370 3% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 3% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 76 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2517.56 грн |
| 5+ | 2089.96 грн |
| 10+ | 1960.21 грн |
| 25+ | 1689.96 грн |
| 389283 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 HX 3C 0.38MM 0.25KG .015"
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
Description: 63/37 HX 3C 0.38MM 0.25KG .015"
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Water Soluble
товару немає в наявності
В кошику
од. на суму грн.
| 392249 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3888.62 грн |
| 5+ | 3227.03 грн |
| 10+ | 3026.58 грн |
| 395437 |
![]() |
Виробник: Harimatec Inc.
Description: HMP 366 3% .028DIA 21AWG
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .028DIA 21AWG
Packaging: Bulk
Diameter: 0.028" (0.71mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 316 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3148.79 грн |
| 5+ | 2613.36 грн |
| 10+ | 2451.05 грн |
| 40+ | 2022.73 грн |
| 80+ | 1896.38 грн |
| 120+ | 1826.01 грн |
| 395439 |
![]() |
Виробник: Harimatec Inc.
Description: HMP 366 3% .050DIA 16AWG
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .050DIA 16AWG
Packaging: Bulk
Diameter: 0.050" (1.27mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 152 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3072.85 грн |
| 5+ | 2550.61 грн |
| 10+ | 2392.08 грн |
| 40+ | 1974.13 грн |
| 80+ | 1850.84 грн |
| 120+ | 1782.15 грн |
| 395442 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 1% .064DIA 14AWG
Packaging: Spool
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: 63/37 400 1% .064DIA 14AWG
Packaging: Spool
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
| 395451 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 3% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 80 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3901.69 грн |
| 5+ | 3237.88 грн |
| 10+ | 3036.73 грн |
| 40+ | 2505.78 грн |
| 80+ | 2349.07 грн |
| 395465 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 CRYSL 502 3% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3889.44 грн |
| 5+ | 3228.28 грн |
| 10+ | 3027.61 грн |
| 395467 |
![]() |
Виробник: Harimatec Inc.
Description: 60/40 370 5C 1.22MM 0.5KG AM
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Description: 60/40 370 5C 1.22MM 0.5KG AM
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 374°F (183 ~ 190°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3361.92 грн |
| 5+ | 2789.81 грн |
| 10+ | 2616.50 грн |
| 40+ | 2159.25 грн |
| 397102 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 63/37 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3455.83 грн |
| 5+ | 2867.98 грн |
| 10+ | 2689.79 грн |
| 397127 |
![]() |
Виробник: Harimatec Inc.
Description: SN62 370 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb38 (62/38)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: SN62 370 3% .024DIA 22AWG
Packaging: Spool
Diameter: 0.024" (0.61mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn62Pb38 (62/38)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: Rosin Activated (RA)
товару немає в наявності
В кошику
од. на суму грн.
| 397952 |
![]() |
Виробник: Harimatec Inc.
Description: HMP 366 3% .022DIA. 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: HMP 366 3% .022DIA. 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: Rosin Activated (RA)
на замовлення 51 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2087.22 грн |
| 5+ | 1732.33 грн |
| 10+ | 1624.84 грн |
| 40+ | 1341.17 грн |
| 397982 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 CRYSL 502 3% .015DIA 27AWG
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
Description: 63/37 CRYSL 502 3% .015DIA 27AWG
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 412183 |
![]() |
Виробник: Harimatec Inc.
Description: 96SC C511 3C 1.02MM 0.5KG .040"
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 3C 1.02MM 0.5KG .040"
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
| 412185 |
![]() |
Виробник: Harimatec Inc.
Description: 96SC C502 5C 0.56MM 0.25KG.022"
Description: 96SC C502 5C 0.56MM 0.25KG.022"
товару немає в наявності
В кошику
од. на суму грн.
| 450314 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: 63/37 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
на замовлення 54 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4243.84 грн |
| 5+ | 3522.06 грн |
| 10+ | 3303.22 грн |
| 40+ | 2725.51 грн |
| 519430 |
![]() |
Виробник: Harimatec Inc.
Description: MP200 RWF SOLDER FLUX NO CLEAN
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: MP200 RWF SOLDER FLUX NO CLEAN
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3570.97 грн |
| 5+ | 3152.01 грн |
| 10+ | 2722.27 грн |
| 536290 |
![]() |
Виробник: Harimatec Inc.
Description: 97CU3 ARAX 4C 3.25MM 10KG AM
Packaging: Bulk
Diameter: 0.128" (3.25mm)
Wire Gauge: 8 AWG, 10 SWG
Composition: Sn97Cu3 (97/3)
Type: Wire Solder
Form: Spool, 22.05 lbs (10kg)
Process: Lead Free
Part Status: Obsolete
Description: 97CU3 ARAX 4C 3.25MM 10KG AM
Packaging: Bulk
Diameter: 0.128" (3.25mm)
Wire Gauge: 8 AWG, 10 SWG
Composition: Sn97Cu3 (97/3)
Type: Wire Solder
Form: Spool, 22.05 lbs (10kg)
Process: Lead Free
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 544784 |
![]() |
Виробник: Harimatec Inc.
Description: WS200 RWF 30G SYRINGE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: WS200 RWF 30G SYRINGE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 550014 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 WS200 SOLDER PASTE 75GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 2.65 oz (75g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: 63/37 WS200 SOLDER PASTE 75GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 2.65 oz (75g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 35°F ~ 50°F (2°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 556385 |
![]() |
Виробник: Harimatec Inc.
Description: DESOLDER BRAID NO-CLN 0.06" 100'
Packaging: Bulk
Length: 100' (30.5m)
Type: No Clean
Width: 0.060" (1.52mm)
ESD Protection: Static Dissipative (SD)
Product Type: Braid/Wick
Part Status: Obsolete
Description: DESOLDER BRAID NO-CLN 0.06" 100'
Packaging: Bulk
Length: 100' (30.5m)
Type: No Clean
Width: 0.060" (1.52mm)
ESD Protection: Static Dissipative (SD)
Product Type: Braid/Wick
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 583489 |
![]() |
Виробник: Harimatec Inc.
Description: 63/37 MP200 SOLDER FLUX 25GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 0.88 oz (25g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: Room Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: 63/37 MP200 SOLDER FLUX 25GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 0.88 oz (25g)
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: Room Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 605500 |
![]() |
Виробник: Harimatec Inc.
Description: 96SC C511 5C 0.56MM 0.25KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 5C 0.56MM 0.25KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 5.51 lbs (2.5kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
| 673828 |
![]() |
Виробник: Harimatec Inc.
Description: 97SC 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .022DIA 23AWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 168 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4446.36 грн |
| 5+ | 3690.03 грн |
| 10+ | 3460.65 грн |
| 40+ | 2855.33 грн |
| 80+ | 2676.61 грн |
| 120+ | 2577.03 грн |
| 673829 |
![]() |
Виробник: Harimatec Inc.
Description: 97SC 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 259 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7644.96 грн |
| 5+ | 6343.02 грн |
| 20+ | 5576.44 грн |
| 40+ | 4905.53 грн |
| 60+ | 4722.94 грн |
| 100+ | 4501.95 грн |
| 673831 |
![]() |
Виробник: Harimatec Inc.
Description: 97SC 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC 400 2% .048DIA 16AWG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
| 673832 |
![]() |
Виробник: Harimatec Inc.
Description: 97SC 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC 400 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7471.84 грн |
| 5+ | 6199.43 грн |
| 680290 |
![]() |
Виробник: Harimatec Inc.
Description: 99C BAR SOLDER 2LB +/- 0.2LB
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 99C BAR SOLDER 2LB +/- 0.2LB
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Bar Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Bar, 2.5 lbs (1.13kg)
Process: Lead Free
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
| 692857 |
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Виробник: Harimatec Inc.
Description: 96SC C511 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C511 5C 0.81MM 0.5KG AM
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
| 706397 |
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Виробник: Harimatec Inc.
Description: SOLDER TIP TINNER (ACTIVATOR)1PC
Packaging: Bulk
Type: Tip Tinner (Activator)
Part Status: Obsolete
Description: SOLDER TIP TINNER (ACTIVATOR)1PC
Packaging: Bulk
Type: Tip Tinner (Activator)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 716856 |
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Виробник: Harimatec Inc.
Description: 99C C511 3C 1.63MM 1KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 2.20 lbs (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 99C C511 3C 1.63MM 1KG AM
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 2.20 lbs (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 721440 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 721471 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 600G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 18 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 14888.16 грн |
| 5+ | 12348.53 грн |
| 721472 |
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Виробник: Harimatec Inc.
Description: LOCTITE LF 318 97SCAGS885V 75G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LOCTITE LF 318 97SCAGS885V 75G S
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 2.65 oz (75g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 721473 |
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Виробник: Harimatec Inc.
Description: LF318 TACKY FLUX
Packaging: Bulk
Type: Solder Paste
Form: Syringe, 1.06 oz (30g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: LF318 TACKY FLUX
Packaging: Bulk
Type: Solder Paste
Form: Syringe, 1.06 oz (30g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 727190 |
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Виробник: Harimatec Inc.
Description: 99C C511 3C 0.56MM 0.5KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 99C C511 3C 0.56MM 0.5KG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 440 ~ 464°F (227 ~ 240°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 732977 |
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Виробник: Harimatec Inc.
Description: 97SC HYDRO-X 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 97SC HYDRO-X 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8376.63 грн |
| 732998 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .064DIA 14AWG
Packaging: Bulk
Diameter: 0.064" (1.63mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7445.71 грн |
| 5+ | 6178.36 грн |
| 20+ | 5431.76 грн |
| 732999 |
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Виробник: Harimatec Inc.
Description: 97SC C511 3C 1.22MM 0.5KG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Description: 97SC C511 3C 1.22MM 0.5KG
Packaging: Bulk
Diameter: 0.048" (1.22mm)
Wire Gauge: 16 AWG, 18 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
товару немає в наявності
В кошику
од. на суму грн.
| 733001 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .022DIA 22AWG 24SWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .022DIA 22AWG 24SWG
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 327 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4456.97 грн |
| 5+ | 3699.31 грн |
| 10+ | 3469.22 грн |
| 40+ | 2862.44 грн |
| 80+ | 2683.27 грн |
| 120+ | 2583.44 грн |
| 733002 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC C511 2% .032DIA 20AWG
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 97 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7665.38 грн |
| 5+ | 6360.32 грн |
| 20+ | 5591.66 грн |
| 40+ | 4918.94 грн |
| 60+ | 4735.84 грн |
| 733010 |
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Виробник: Harimatec Inc.
Description: 96SC C511 3C 0.81MM 0.5KG .032"
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Description: 96SC C511 3C 0.81MM 0.5KG .032"
Packaging: Bulk
Diameter: 0.032" (0.81mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 733024 |
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Виробник: Harimatec Inc.
Description: 96SC C400 3C 0.56MM 0.25KG.022"
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
Description: 96SC C400 3C 0.56MM 0.25KG.022"
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Wire Gauge: 23 AWG, 24 SWG
Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 59°F ~ 86°F (15°C ~ 30°C)
товару немає в наявності
В кошику
од. на суму грн.
| 760088 |
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Виробник: Harimatec Inc.
Description: FLUX - NO CLEAN PEN
Packaging: Bulk
Type: Flux - No Clean
Form: Pen, 0.34 oz (9.64g)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: FLUX - NO CLEAN PEN
Packaging: Bulk
Type: Flux - No Clean
Form: Pen, 0.34 oz (9.64g)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| 796037 |
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Виробник: Harimatec Inc.
Description: 97SC C511 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
Description: 97SC C511 2% .015DIA 27AWG
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: Rosin Mildly Activated (RMA)
Part Status: Active
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4578.65 грн |
| 5+ | 3799.96 грн |
| 10+ | 3563.66 грн |
| 40+ | 2940.31 грн |
| 796065 |
![]() |
Виробник: Harimatec Inc.
Description: 97SC 400 2% 0.38 DIA
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: 97SC 400 2% 0.38 DIA
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423°F (217°C)
Form: Spool, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4478.21 грн |
| 5+ | 3716.14 грн |
| 10+ | 3485.11 грн |
| 40+ | 2875.50 грн |


































