| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|
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EVB-EV1340QI | Intel |
 Description: EVAL BOARD FOR EV1340QI |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||
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EN2390QI | Intel |
Description: DC DC CONVERTER 0.75-3.3V Features: Remote On/Off, OTP, SCP, UVLO Packaging: Cut Tape (CT) Package / Case: 76-PowerBFQFN Module Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 14V Efficiency: 89% Current - Output (Max): 9A Supplier Device Package: 76-QFN (11x10) Voltage - Input (Min): 4.5V Voltage - Output 1: 0.75 ~ 3.3V Control Features: Enable, Active High Part Status: Obsolete Number of Outputs: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EN2390QI | Intel |
Description: DC DC CONVERTER 0.75-3.3V Features: Remote On/Off, OTP, SCP, UVLO Packaging: Tape & Reel (TR) Package / Case: 76-PowerBFQFN Module Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm) Mounting Type: Surface Mount Type: Non-Isolated PoL Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 14V Efficiency: 89% Current - Output (Max): 9A Supplier Device Package: 76-QFN (11x10) Voltage - Input (Min): 4.5V Voltage - Output 1: 0.75 ~ 3.3V Control Features: Enable, Active High Part Status: Obsolete Number of Outputs: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EPCQL1024F24IN | Intel |
Description: IC QUAD-SERIAL LOW VOLTAGE CONFI Packaging: Tray Package / Case: 24-LBGA Mounting Type: Surface Mount Memory Size: 1GB Programmable Type: In System Programmable Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 2V Supplier Device Package: 24-FBGA (6x8) Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EN6310QI | Intel |
Description: IC REG BUCK ADJUSTABLE 1A 30QFN Packaging: Tape & Reel (TR) Package / Case: 30-FQFN Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 1A Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive Frequency - Switching: 2.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 30-QFN (4x5) Synchronous Rectifier: Yes Voltage - Output (Max): 3.3V Voltage - Input (Min): 2.7V Voltage - Output (Min/Fixed): 0.6V Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ET4040QI | Intel |
Description: IC REG CONV DDR 1OUT 46QFN Packaging: Tape & Reel (TR) Package / Case: 46-VFQFN Exposed Pad Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 4.5V ~ 14.5V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 46-QFN (5.5x7.5) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EVB-EN2342QI | Intel |
Description: EVAL BOARD FOR BUCK REG 4.0A Packaging: Box Voltage - Output: 0.75V ~ 5V Voltage - Input: 4.5V ~ 14V Current - Output: 4A Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: EN2342QI Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1, Non-Isolated |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EN6310QI | Intel |
Description: IC REG BUCK ADJUSTABLE 1A 30QFN Packaging: Cut Tape (CT) Package / Case: 30-FQFN Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 1A Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive Frequency - Switching: 2.2MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 30-QFN (4x5) Synchronous Rectifier: Yes Voltage - Output (Max): 3.3V Voltage - Input (Min): 2.7V Voltage - Output (Min/Fixed): 0.6V Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ET4040QI | Intel |
Description: IC REG CONV DDR 1OUT 46QFN Packaging: Cut Tape (CT) Package / Case: 46-VFQFN Exposed Pad Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 4.5V ~ 14.5V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 46-QFN (5.5x7.5) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EC7100VQI | Intel |
Description: IC REG CTRLR FPGA 1OUT 20QFN Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Voltage - Output: 0.5V ~ 5V Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 3.3V ~ 25V Operating Temperature: -10°C ~ 100°C Applications: Controller, FPGA Supplier Device Package: 20-QFN (3x4) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EC7401QI | Intel |
Description: IC REG CTRLR BUCK 40QFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Output Type: PWM Signal Mounting Type: Surface Mount Function: Step-Down Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive, Isolation Capable Frequency - Switching: 80kHz ~ 1MHz Topology: Buck Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Supplier Device Package: 40-QFN (6x6) Control Features: Enable, Frequency Control, Power Good, Soft Start Output Phases: 4 Duty Cycle (Max): 66.7% Clock Sync: No Number of Outputs: 4 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ER2120QI | Intel |
Description: IC REG BUCK ADJUSTABLE 2A 24QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ER3105DI | Intel |
Description: IC REG BUCK ADJ 500MA 12DFN Packaging: Tape & Reel (TR) Package / Case: 12-VFDFN Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 500mA Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Positive Frequency - Switching: 300kHz ~ 2MHz Voltage - Input (Max): 36V Topology: Buck Supplier Device Package: 12-DFN (4x3) Synchronous Rectifier: Yes Voltage - Output (Max): 34V Voltage - Input (Min): 3V Voltage - Output (Min/Fixed): 0.6V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ES1010SI | Intel |
Description: IC HOT SWAP CTRLR GP 8SOIC Packaging: Tape & Reel (TR) Features: Latched Fault Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Hot Swap Controller Operating Temperature: -40°C ~ 85°C Voltage - Supply: 10.2V ~ 13.8V Applications: General Purpose Internal Switch(s): No Supplier Device Package: 8-SOIC Programmable Features: Current Limit, Fault Timeout, Slew Rate, UVLO Part Status: Obsolete Number of Channels: 1 Current - Supply: 3 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EY1602SI-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 50MA 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Current - Output: 50mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 24 µA Voltage - Input (Max): 40V Number of Regulators: 1 Supplier Device Package: 8-SOIC-EP Voltage - Output (Max): 12V Voltage - Output (Min/Fixed): 1.223V Control Features: Enable PSRR: 58dB (100Hz) Voltage Dropout (Max): 0.35V @ 50mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 82 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EY1603TI-ADJ | Intel |
Description: IC REG LIN POS ADJ 14HTSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 24 µA Voltage - Input (Max): 40V Number of Regulators: 1 Supplier Device Package: 14-HTSSOP Voltage - Output (Max): 12V Voltage - Output (Min/Fixed): 1.223V Control Features: Enable PSRR: 66dB (100Hz) Voltage Dropout (Max): 0.46V @ 150mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 125 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EC7100VQI | Intel |
Description: IC REG CTRLR FPGA 1OUT 20QFN Packaging: Cut Tape (CT) Package / Case: 20-VFQFN Exposed Pad Voltage - Output: 0.5V ~ 5V Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 3.3V ~ 25V Operating Temperature: -10°C ~ 100°C Applications: Controller, FPGA Supplier Device Package: 20-QFN (3x4) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ER2120QI | Intel |
Description: IC REG BUCK ADJUSTABLE 2A 24QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ED8106N00QI | Intel | Description: IC REG CTRLR BUCK 24QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EVB-ER3105DI | Intel |
Description: EVAL DC-DC BUCK CONVERTER .5A Packaging: Box Voltage - Input: 3V ~ 36V Current - Output: 500mA Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: ER3105DI Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1, Non-Isolated Part Status: Obsolete |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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EVB-ES1010SI | Intel |
Description: EVAL BOARD FOR ES1010SI Packaging: Box Function: Hot Swap Controller Type: Power Management Contents: Board(s) Utilized IC / Part: ES1010SI Supplied Contents: Board(s) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EVB-EY1602SI-ADJ | Intel |
Description: EVAL BOARD LINEAR REG 50MA 40V Packaging: Box Voltage - Output: 2.5V ~ 12V Voltage - Input: 6V ~ 40V Current - Output: 50mA Regulator Type: Positive Adjustable Board Type: Fully Populated Utilized IC / Part: EY1602 Supplied Contents: Board(s) Channels per IC: 1 - Single Part Status: Obsolete |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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EVB-EY1603TI-ADJ | Intel |
Description: EVAL BOARD LINEAR REG 150MA 40V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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ED8106N00QI | Intel | Description: IC REG CTRLR BUCK 24QFN |
на замовлення 1754 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||
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5CSEBA2U19C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA4U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA4U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U19I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CGXFC5C6F23A7N | Intel |
Description: IC FPGA 240 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 77000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 29080 Total RAM Bits: 5001216 Number of I/O: 240 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CGXFC7D6F31A7N | Intel |
Description: IC FPGA 480 I/O 896FBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U19C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 99 шт: термін постачання 21-31 дні (днів) |
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5CSEBA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA2U23C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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5CSEBA2U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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5CSEBA2U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
на замовлення 207 шт: термін постачання 21-31 дні (днів) |
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5CSEBA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEBA4U23C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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5CSEBA4U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA2U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA4U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5CSEMA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
| EVB-EV1340QI |
|
Виробник: Intel
Description: EVAL BOARD FOR EV1340QI
Description: EVAL BOARD FOR EV1340QI
на замовлення 1 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EN2390QI |
|
Виробник: Intel
Description: DC DC CONVERTER 0.75-3.3V
Features: Remote On/Off, OTP, SCP, UVLO
Packaging: Cut Tape (CT)
Package / Case: 76-PowerBFQFN Module
Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 14V
Efficiency: 89%
Current - Output (Max): 9A
Supplier Device Package: 76-QFN (11x10)
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.75 ~ 3.3V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
Description: DC DC CONVERTER 0.75-3.3V
Features: Remote On/Off, OTP, SCP, UVLO
Packaging: Cut Tape (CT)
Package / Case: 76-PowerBFQFN Module
Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 14V
Efficiency: 89%
Current - Output (Max): 9A
Supplier Device Package: 76-QFN (11x10)
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.75 ~ 3.3V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
товару немає в наявності
В кошику
од. на суму грн.
| EN2390QI |
|
Виробник: Intel
Description: DC DC CONVERTER 0.75-3.3V
Features: Remote On/Off, OTP, SCP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 76-PowerBFQFN Module
Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 14V
Efficiency: 89%
Current - Output (Max): 9A
Supplier Device Package: 76-QFN (11x10)
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.75 ~ 3.3V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
Description: DC DC CONVERTER 0.75-3.3V
Features: Remote On/Off, OTP, SCP, UVLO
Packaging: Tape & Reel (TR)
Package / Case: 76-PowerBFQFN Module
Size / Dimension: 0.43" L x 0.39" W x 0.12" H (11.0mm x 10.0mm x 3.0mm)
Mounting Type: Surface Mount
Type: Non-Isolated PoL Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 14V
Efficiency: 89%
Current - Output (Max): 9A
Supplier Device Package: 76-QFN (11x10)
Voltage - Input (Min): 4.5V
Voltage - Output 1: 0.75 ~ 3.3V
Control Features: Enable, Active High
Part Status: Obsolete
Number of Outputs: 1
товару немає в наявності
В кошику
од. на суму грн.
| EPCQL1024F24IN |
|
Виробник: Intel
Description: IC QUAD-SERIAL LOW VOLTAGE CONFI
Packaging: Tray
Package / Case: 24-LBGA
Mounting Type: Surface Mount
Memory Size: 1GB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 2V
Supplier Device Package: 24-FBGA (6x8)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC QUAD-SERIAL LOW VOLTAGE CONFI
Packaging: Tray
Package / Case: 24-LBGA
Mounting Type: Surface Mount
Memory Size: 1GB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 2V
Supplier Device Package: 24-FBGA (6x8)
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| EN6310QI |
|
Виробник: Intel
Description: IC REG BUCK ADJUSTABLE 1A 30QFN
Packaging: Tape & Reel (TR)
Package / Case: 30-FQFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 30-QFN (4x5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
Description: IC REG BUCK ADJUSTABLE 1A 30QFN
Packaging: Tape & Reel (TR)
Package / Case: 30-FQFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 30-QFN (4x5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| ET4040QI |
|
Виробник: Intel
Description: IC REG CONV DDR 1OUT 46QFN
Packaging: Tape & Reel (TR)
Package / Case: 46-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 4.5V ~ 14.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 46-QFN (5.5x7.5)
Description: IC REG CONV DDR 1OUT 46QFN
Packaging: Tape & Reel (TR)
Package / Case: 46-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 4.5V ~ 14.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 46-QFN (5.5x7.5)
товару немає в наявності
В кошику
од. на суму грн.
| EVB-EN2342QI |
|
Виробник: Intel
Description: EVAL BOARD FOR BUCK REG 4.0A
Packaging: Box
Voltage - Output: 0.75V ~ 5V
Voltage - Input: 4.5V ~ 14V
Current - Output: 4A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: EN2342QI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Description: EVAL BOARD FOR BUCK REG 4.0A
Packaging: Box
Voltage - Output: 0.75V ~ 5V
Voltage - Input: 4.5V ~ 14V
Current - Output: 4A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: EN2342QI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
товару немає в наявності
В кошику
од. на суму грн.
| EN6310QI |
|
Виробник: Intel
Description: IC REG BUCK ADJUSTABLE 1A 30QFN
Packaging: Cut Tape (CT)
Package / Case: 30-FQFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 30-QFN (4x5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
Description: IC REG BUCK ADJUSTABLE 1A 30QFN
Packaging: Cut Tape (CT)
Package / Case: 30-FQFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 1A
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2.2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 30-QFN (4x5)
Synchronous Rectifier: Yes
Voltage - Output (Max): 3.3V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| ET4040QI |
|
Виробник: Intel
Description: IC REG CONV DDR 1OUT 46QFN
Packaging: Cut Tape (CT)
Package / Case: 46-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 4.5V ~ 14.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 46-QFN (5.5x7.5)
Description: IC REG CONV DDR 1OUT 46QFN
Packaging: Cut Tape (CT)
Package / Case: 46-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 4.5V ~ 14.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 46-QFN (5.5x7.5)
товару немає в наявності
В кошику
од. на суму грн.
| EC7100VQI |
|
Виробник: Intel
Description: IC REG CTRLR FPGA 1OUT 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: 0.5V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3.3V ~ 25V
Operating Temperature: -10°C ~ 100°C
Applications: Controller, FPGA
Supplier Device Package: 20-QFN (3x4)
Part Status: Obsolete
Description: IC REG CTRLR FPGA 1OUT 20QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: 0.5V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3.3V ~ 25V
Operating Temperature: -10°C ~ 100°C
Applications: Controller, FPGA
Supplier Device Package: 20-QFN (3x4)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| EC7401QI |
|
Виробник: Intel
Description: IC REG CTRLR BUCK 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Output Type: PWM Signal
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive, Isolation Capable
Frequency - Switching: 80kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Supplier Device Package: 40-QFN (6x6)
Control Features: Enable, Frequency Control, Power Good, Soft Start
Output Phases: 4
Duty Cycle (Max): 66.7%
Clock Sync: No
Number of Outputs: 4
Description: IC REG CTRLR BUCK 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Output Type: PWM Signal
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive, Isolation Capable
Frequency - Switching: 80kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Supplier Device Package: 40-QFN (6x6)
Control Features: Enable, Frequency Control, Power Good, Soft Start
Output Phases: 4
Duty Cycle (Max): 66.7%
Clock Sync: No
Number of Outputs: 4
товару немає в наявності
В кошику
од. на суму грн.
| ER2120QI |
|
Виробник: Intel
Description: IC REG BUCK ADJUSTABLE 2A 24QFN
Description: IC REG BUCK ADJUSTABLE 2A 24QFN
товару немає в наявності
В кошику
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| ER3105DI |
|
Виробник: Intel
Description: IC REG BUCK ADJ 500MA 12DFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 300kHz ~ 2MHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: 12-DFN (4x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 34V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.6V
Description: IC REG BUCK ADJ 500MA 12DFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 300kHz ~ 2MHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: 12-DFN (4x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 34V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.6V
товару немає в наявності
В кошику
од. на суму грн.
| ES1010SI |
|
Виробник: Intel
Description: IC HOT SWAP CTRLR GP 8SOIC
Packaging: Tape & Reel (TR)
Features: Latched Fault
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Hot Swap Controller
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 10.2V ~ 13.8V
Applications: General Purpose
Internal Switch(s): No
Supplier Device Package: 8-SOIC
Programmable Features: Current Limit, Fault Timeout, Slew Rate, UVLO
Part Status: Obsolete
Number of Channels: 1
Current - Supply: 3 mA
Description: IC HOT SWAP CTRLR GP 8SOIC
Packaging: Tape & Reel (TR)
Features: Latched Fault
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Hot Swap Controller
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 10.2V ~ 13.8V
Applications: General Purpose
Internal Switch(s): No
Supplier Device Package: 8-SOIC
Programmable Features: Current Limit, Fault Timeout, Slew Rate, UVLO
Part Status: Obsolete
Number of Channels: 1
Current - Supply: 3 mA
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| EY1602SI-ADJ |
|
Виробник: Intel
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 24 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: 8-SOIC-EP
Voltage - Output (Max): 12V
Voltage - Output (Min/Fixed): 1.223V
Control Features: Enable
PSRR: 58dB (100Hz)
Voltage Dropout (Max): 0.35V @ 50mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 82 µA
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 24 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: 8-SOIC-EP
Voltage - Output (Max): 12V
Voltage - Output (Min/Fixed): 1.223V
Control Features: Enable
PSRR: 58dB (100Hz)
Voltage Dropout (Max): 0.35V @ 50mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 82 µA
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| EY1603TI-ADJ |
|
Виробник: Intel
Description: IC REG LIN POS ADJ 14HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 24 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: 14-HTSSOP
Voltage - Output (Max): 12V
Voltage - Output (Min/Fixed): 1.223V
Control Features: Enable
PSRR: 66dB (100Hz)
Voltage Dropout (Max): 0.46V @ 150mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 125 µA
Description: IC REG LIN POS ADJ 14HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 24 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: 14-HTSSOP
Voltage - Output (Max): 12V
Voltage - Output (Min/Fixed): 1.223V
Control Features: Enable
PSRR: 66dB (100Hz)
Voltage Dropout (Max): 0.46V @ 150mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 125 µA
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| EC7100VQI |
|
Виробник: Intel
Description: IC REG CTRLR FPGA 1OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: 0.5V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3.3V ~ 25V
Operating Temperature: -10°C ~ 100°C
Applications: Controller, FPGA
Supplier Device Package: 20-QFN (3x4)
Part Status: Obsolete
Description: IC REG CTRLR FPGA 1OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: 0.5V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3.3V ~ 25V
Operating Temperature: -10°C ~ 100°C
Applications: Controller, FPGA
Supplier Device Package: 20-QFN (3x4)
Part Status: Obsolete
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| ER2120QI |
|
Виробник: Intel
Description: IC REG BUCK ADJUSTABLE 2A 24QFN
Description: IC REG BUCK ADJUSTABLE 2A 24QFN
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| ED8106N00QI |
Виробник: Intel
Description: IC REG CTRLR BUCK 24QFN
Description: IC REG CTRLR BUCK 24QFN
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| EVB-ER3105DI |
|
Виробник: Intel
Description: EVAL DC-DC BUCK CONVERTER .5A
Packaging: Box
Voltage - Input: 3V ~ 36V
Current - Output: 500mA
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: ER3105DI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
Description: EVAL DC-DC BUCK CONVERTER .5A
Packaging: Box
Voltage - Input: 3V ~ 36V
Current - Output: 500mA
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: ER3105DI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4964.03 грн |
| EVB-ES1010SI |
|
Виробник: Intel
Description: EVAL BOARD FOR ES1010SI
Packaging: Box
Function: Hot Swap Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ES1010SI
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVAL BOARD FOR ES1010SI
Packaging: Box
Function: Hot Swap Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ES1010SI
Supplied Contents: Board(s)
Part Status: Obsolete
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| EVB-EY1602SI-ADJ |
|
Виробник: Intel
Description: EVAL BOARD LINEAR REG 50MA 40V
Packaging: Box
Voltage - Output: 2.5V ~ 12V
Voltage - Input: 6V ~ 40V
Current - Output: 50mA
Regulator Type: Positive Adjustable
Board Type: Fully Populated
Utilized IC / Part: EY1602
Supplied Contents: Board(s)
Channels per IC: 1 - Single
Part Status: Obsolete
Description: EVAL BOARD LINEAR REG 50MA 40V
Packaging: Box
Voltage - Output: 2.5V ~ 12V
Voltage - Input: 6V ~ 40V
Current - Output: 50mA
Regulator Type: Positive Adjustable
Board Type: Fully Populated
Utilized IC / Part: EY1602
Supplied Contents: Board(s)
Channels per IC: 1 - Single
Part Status: Obsolete
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5191.57 грн |
| EVB-EY1603TI-ADJ |
|
Виробник: Intel
Description: EVAL BOARD LINEAR REG 150MA 40V
Description: EVAL BOARD LINEAR REG 150MA 40V
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| ED8106N00QI |
Виробник: Intel
Description: IC REG CTRLR BUCK 24QFN
Description: IC REG CTRLR BUCK 24QFN
на замовлення 1754 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| 5CSEBA2U19C6N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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| 5CSEBA2U19C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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| 5CSEBA2U19I7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
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| 5CSEBA4U19I7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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| 5CSEMA4U23C6N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEMA4U23I7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEBA2U19I7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
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| 5CGXFC5C6F23A7N |
|
Виробник: Intel
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 77000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 29080
Total RAM Bits: 5001216
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 77000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 29080
Total RAM Bits: 5001216
Number of I/O: 240
DigiKey Programmable: Not Verified
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| 5CGXFC7D6F31A7N |
|
Виробник: Intel
Description: IC FPGA 480 I/O 896FBGA
Description: IC FPGA 480 I/O 896FBGA
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| 5CSEBA2U19C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
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од. на суму грн.
| 5CSEBA2U19C7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
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од. на суму грн.
| 5CSEBA2U19C8SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 99 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5406.21 грн |
| 5CSEBA2U23C6N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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| 5CSEBA2U23C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| 5CSEBA2U23C7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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од. на суму грн.
| 5CSEBA2U23C8SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5929.88 грн |
| 5CSEBA2U23I7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 11759.71 грн |
| 5CSEBA2U23I7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19C7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19C8SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U19I7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 207 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 10120.90 грн |
| 5CSEBA4U23A7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U23C7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U23C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEBA4U23C8SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7494.46 грн |
| 5CSEBA4U23I7SN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEMA2U23A7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEMA2U23C6N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEMA2U23C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEMA2U23C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEMA2U23I7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEMA4U23A7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEMA4U23C7N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| 5CSEMA4U23C8N |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
товару немає в наявності
В кошику
од. на суму грн.