Продукція > MEIG SMART TECHNOLOGY > Всі товари виробника MEIG SMART TECHNOLOGY (17) > Сторінка 1 з 1
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
750VE71S | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi Operating temperature: -40...85°C Kind of network: WiFi Type of communications module: LTE Dimensions: 29x32x2.9mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; I2C; PCM; SD; SGMII; UART; USB Downlink transfer rate: 150Mbps Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA Uplink ransfer rate: 50Mbps |
на замовлення 11 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
770ACE4A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm Operating temperature: -40...85°C Type of communications module: LTE Dimensions: 29x32x2.4mm Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP Case: LCC+LGA Interface: PCM; SIM; UART; USB Downlink transfer rate: 150Mbps Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA Uplink ransfer rate: 50Mbps |
на замовлення 15 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M156LA0A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; EGPRS,GNSS,LTE Cat.NB2,LTE CAT1; 21x20x2.3mm Operating temperature: -35...75°C Type of communications module: LTE Dimensions: 21x20x2.3mm Communictions protocol: DNS; DTLS; HTTP client; IPv4; IPv6; LwM2M; MQTT; TCP Interface: ADC; I2C; I2S; PCM; SIM; UART; USB Transmission: EGPRS; GNSS; LTE CAT1; LTE Cat.NB2 |
на замовлення 36 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M320PE1A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm Operating temperature: -30...70°C Kind of network: WiFi Type of communications module: LTE Dimensions: 32x29x2.4mm Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Bluetooth version: 4.2 Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB Downlink transfer rate: 10Mbps Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps |
на замовлення 28 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M320PE2C | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm Operating temperature: -30...70°C Kind of network: WiFi Type of communications module: LTE Dimensions: 32x29x2.4mm Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Bluetooth version: 4.2 Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB Downlink transfer rate: 10Mbps Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps |
на замовлення 20 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M326E00A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps Operating temperature: -30...75°C Kind of network: WiFi Type of communications module: LTE Dimensions: 27.6x25.4x2.3mm Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP Bluetooth version: 4.2; BLE Interface: I2C; I2S; SIM; SPI; UART; USB Downlink transfer rate: 10Mbps Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD Uplink ransfer rate: 5Mbps |
на замовлення 29 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M326LZBA | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation |
на замовлення 1 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M750ZE1A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi Operating temperature: -40...85°C Kind of network: WiFi Type of communications module: LTE Dimensions: 32x29x2.8mm Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP Case: LCC Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB Downlink transfer rate: 10Mbps Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA Uplink ransfer rate: 5Mbps |
на замовлення 40 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M815N44A | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm Operating temperature: -40...85°C Components: Qualcomm X62 Type of communications module: IoT Dimensions: 30x52x2.3mm Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP Case: M.2 Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G |
на замовлення 5 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M815NEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: LTE; Comp: SRM815 Type of development kit: LTE Components: SRM815 Connection: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB |
на замовлення 1 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M825W5GH | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation |
на замовлення 1 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M82824AA | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm Type of communications module: LTE Downlink transfer rate: 300Mbps Uplink ransfer rate: 50Mbps Case: Mini PCIe Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Dimensions: 51x30x4.5mm Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Operating temperature: -40...85°C Kind of network: WiFi |
на замовлення 4 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M828G23B | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm Operating temperature: -30...75°C Type of communications module: LTE Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Case: LGA Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Downlink transfer rate: 600Mbps Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA Uplink ransfer rate: 150Mbps |
на замовлення 20 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M828G23D | MEIG SMART TECHNOLOGY |
Category: M2M (GPRS/LTE/5G) modulesDescription: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm Case: LGA Type of communications module: LTE Operating temperature: -30...75°C Dimensions: 37x39.5x2.8mm Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART Downlink transfer rate: 300Mbps Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA Uplink ransfer rate: 50Mbps |
на замовлення 19 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
M828GEVB | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Connection: D-Sub 9pin x2; RJ11; SD; SIM x2; solder pads; USB |
на замовлення 2 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
MPEVB00B | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: evaluation Type of development kit: evaluation Connection: D-Sub 9pin x2; pin header; power supply; SIM; solder pads; USB |
на замовлення 4 шт: термін постачання 14-30 дні (днів) |
|
||||||||
|
NBEVB00A | MEIG SMART TECHNOLOGY |
Category: Development kits for data transmission Description: Dev.kit: IoT; Comp: SLM156 Type of development kit: IoT Components: SLM156 Connection: D-Sub 9pin x2; nanoSIM; pin header; USB x2 |
на замовлення 1 шт: термін постачання 14-30 дні (днів) |
|
| 750VE71S |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Operating temperature: -40...85°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 29x32x2.9mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Downlink transfer rate: 150Mbps
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Uplink ransfer rate: 50Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; 29x32x2.9mm; Network: WiFi
Operating temperature: -40...85°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 29x32x2.9mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; I2C; PCM; SD; SGMII; UART; USB
Downlink transfer rate: 150Mbps
Transmission: GNSS; GSM; LTE CAT4; LTE-FDD; LTE-TDD; PCM; WCDMA
Uplink ransfer rate: 50Mbps
на замовлення 11 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2495.65 грн |
| 770ACE4A |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Operating temperature: -40...85°C
Type of communications module: LTE
Dimensions: 29x32x2.4mm
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Case: LCC+LGA
Interface: PCM; SIM; UART; USB
Downlink transfer rate: 150Mbps
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 50Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 150Mbps; Up: 50Mbps; LCC+LGA; 29x32x2.4mm
Operating temperature: -40...85°C
Type of communications module: LTE
Dimensions: 29x32x2.4mm
Communictions protocol: DTLS; DTMF; FTP; HTTP; MQTT; PPP; TCP; UDP
Case: LCC+LGA
Interface: PCM; SIM; UART; USB
Downlink transfer rate: 150Mbps
Transmission: GSM; LTE CAT4; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 50Mbps
на замовлення 15 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1848.63 грн |
| 2+ | 1653.04 грн |
| 3+ | 1635.71 грн |
| 10+ | 1587.84 грн |
| M156LA0A |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; EGPRS,GNSS,LTE Cat.NB2,LTE CAT1; 21x20x2.3mm
Operating temperature: -35...75°C
Type of communications module: LTE
Dimensions: 21x20x2.3mm
Communictions protocol: DNS; DTLS; HTTP client; IPv4; IPv6; LwM2M; MQTT; TCP
Interface: ADC; I2C; I2S; PCM; SIM; UART; USB
Transmission: EGPRS; GNSS; LTE CAT1; LTE Cat.NB2
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; EGPRS,GNSS,LTE Cat.NB2,LTE CAT1; 21x20x2.3mm
Operating temperature: -35...75°C
Type of communications module: LTE
Dimensions: 21x20x2.3mm
Communictions protocol: DNS; DTLS; HTTP client; IPv4; IPv6; LwM2M; MQTT; TCP
Interface: ADC; I2C; I2S; PCM; SIM; UART; USB
Transmission: EGPRS; GNSS; LTE CAT1; LTE Cat.NB2
на замовлення 36 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1291.37 грн |
| 3+ | 1175.20 грн |
| 10+ | 1136.41 грн |
| M320PE1A |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Operating temperature: -30...70°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 32x29x2.4mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Downlink transfer rate: 10Mbps
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Operating temperature: -30...70°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 32x29x2.4mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Downlink transfer rate: 10Mbps
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
на замовлення 28 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1107.40 грн |
| 3+ | 992.81 грн |
| 10+ | 963.93 грн |
| M320PE2C |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Operating temperature: -30...70°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 32x29x2.4mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Downlink transfer rate: 10Mbps
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2; Down: 10Mbps; Up: 5Mbps; 32x29x2.4mm
Operating temperature: -30...70°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 32x29x2.4mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2
Interface: I2C; I2S; SDIO; SIM; SPI; UART; USB
Downlink transfer rate: 10Mbps
Transmission: GPRS; GPS; GSM; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
на замовлення 20 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 911.87 грн |
| 3+ | 817.03 грн |
| 4+ | 810.43 грн |
| 10+ | 779.07 грн |
| M326E00A |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps
Operating temperature: -30...75°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 27.6x25.4x2.3mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2; BLE
Interface: I2C; I2S; SIM; SPI; UART; USB
Downlink transfer rate: 10Mbps
Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Bluetooth: 4.2,BLE; Down: 10Mbps; Up: 5Mbps
Operating temperature: -30...75°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 27.6x25.4x2.3mm
Communictions protocol: CoAP; FTP; FTPS; HTTP; HTTPS; LwM2M; MQTT; TCP; UDP
Bluetooth version: 4.2; BLE
Interface: I2C; I2S; SIM; SPI; UART; USB
Downlink transfer rate: 10Mbps
Transmission: GPRS; LTE CAT1; LTE-FDD; LTE-TDD
Uplink ransfer rate: 5Mbps
на замовлення 29 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1132.29 грн |
| 3+ | 987.04 грн |
| 10+ | 978.78 грн |
| M326LZBA |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
на замовлення 1 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3248.43 грн |
| M750ZE1A |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Operating temperature: -40...85°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Case: LCC
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Downlink transfer rate: 10Mbps
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 5Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 10Mbps; Up: 5Mbps; LCC; 32x29x2.8mm; Network: WiFi
Operating temperature: -40...85°C
Kind of network: WiFi
Type of communications module: LTE
Dimensions: 32x29x2.8mm
Communictions protocol: DTMF; FTP; HTTP; MQTT; PING; PPP; QMI; SSL; TCP; UDP
Case: LCC
Interface: ADC; I2C; PCM; SD; SDIO; SGMII; UART; USB
Downlink transfer rate: 10Mbps
Transmission: GSM; LTE CAT1; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 5Mbps
на замовлення 40 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2177.47 грн |
| 2+ | 1965.82 грн |
| 3+ | 1962.52 грн |
| 10+ | 1888.24 грн |
| M815N44A |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Operating temperature: -40...85°C
Components: Qualcomm X62
Type of communications module: IoT
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Case: M.2
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
Category: M2M (GPRS/LTE/5G) modules
Description: Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm
Operating temperature: -40...85°C
Components: Qualcomm X62
Type of communications module: IoT
Dimensions: 30x52x2.3mm
Communictions protocol: ECM; NDIS; RNDIS; TCP; UDP
Case: M.2
Interface: E-SIM; GPIO; PCIe; PCM; SIM; UART; USB
Transmission: 5G; LTE; LTE-FDD; LTE-TDD; Sub-6G
на замовлення 5 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15062.77 грн |
| 3+ | 13458.68 грн |
| 5+ | 13433.92 грн |
| M815NEVB |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Components: SRM815
Connection: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: LTE; Comp: SRM815
Type of development kit: LTE
Components: SRM815
Connection: antenna socket; power supply; RJ11; RJ45; SD; SIM; solder pads; USB
на замовлення 1 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 24928.94 грн |
| M825W5GH |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
на замовлення 1 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9300.03 грн |
| M82824AA |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -40...85°C
Kind of network: WiFi
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; Mini PCIe; 51x30x4.5mm
Type of communications module: LTE
Downlink transfer rate: 300Mbps
Uplink ransfer rate: 50Mbps
Case: Mini PCIe
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Dimensions: 51x30x4.5mm
Communictions protocol: DTMF; FTP; HTTPS; PING; PPP; QMI; SSL; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Operating temperature: -40...85°C
Kind of network: WiFi
на замовлення 4 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4270.51 грн |
| M828G23B |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Operating temperature: -30...75°C
Type of communications module: LTE
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Case: LGA
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Downlink transfer rate: 600Mbps
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 150Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 600Mbps; Up: 150Mbps; LGA; 37x39.5x2.8mm
Operating temperature: -30...75°C
Type of communications module: LTE
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Case: LGA
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Downlink transfer rate: 600Mbps
Transmission: GNSS; LTE CAT12; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 150Mbps
на замовлення 20 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4750.44 грн |
| 4+ | 4372.34 грн |
| 10+ | 4236.99 грн |
| M828G23D |
![]() |
Виробник: MEIG SMART TECHNOLOGY
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Case: LGA
Type of communications module: LTE
Operating temperature: -30...75°C
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Downlink transfer rate: 300Mbps
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 50Mbps
Category: M2M (GPRS/LTE/5G) modules
Description: Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm
Case: LGA
Type of communications module: LTE
Operating temperature: -30...75°C
Dimensions: 37x39.5x2.8mm
Communictions protocol: DHCP; IPv4; IPv6; QMI; RNDIS; TCP; UDP
Interface: ADC; GPIO; I2C; PCIe; PCM; SDIO; SIM; SPI; UART
Downlink transfer rate: 300Mbps
Transmission: GNSS; LTE CAT6; LTE-FDD; LTE-TDD; WCDMA
Uplink ransfer rate: 50Mbps
на замовлення 19 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3614.60 грн |
| 3+ | 3304.42 грн |
| M828GEVB |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Connection: D-Sub 9pin x2; RJ11; SD; SIM x2; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Connection: D-Sub 9pin x2; RJ11; SD; SIM x2; solder pads; USB
на замовлення 2 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4451.82 грн |
| MPEVB00B |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Connection: D-Sub 9pin x2; pin header; power supply; SIM; solder pads; USB
Category: Development kits for data transmission
Description: Dev.kit: evaluation
Type of development kit: evaluation
Connection: D-Sub 9pin x2; pin header; power supply; SIM; solder pads; USB
на замовлення 4 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4433.16 грн |
| NBEVB00A |
Виробник: MEIG SMART TECHNOLOGY
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Connection: D-Sub 9pin x2; nanoSIM; pin header; USB x2
Category: Development kits for data transmission
Description: Dev.kit: IoT; Comp: SLM156
Type of development kit: IoT
Components: SLM156
Connection: D-Sub 9pin x2; nanoSIM; pin header; USB x2
на замовлення 1 шт:
термін постачання 14-30 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5541.44 грн |



















