Продукція > CLM
| Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||
|---|---|---|---|---|---|---|---|---|
| CLM-113-02-FM-D-P-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-FM-D-PA | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tray Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||
| CLM-113-02-FM-D-PA | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-FM-D-PA-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-113-02-FM-D-PA-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-G-D | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-K | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-K-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-P-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-P-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-PA-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-PA-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-G-D-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-H-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-H-D | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-H-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-H-D-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-H-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-H-D-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-H-D-P | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-H-D-P-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-H-D-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D | Samtec | Conn Micro Socket Strip SKT 26 POS 1mm Solder ST SMD Tube | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 39 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-K | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-K-TR | Samtec | Conn Micro Socket Strip SKT 26 POS 1mm Solder ST SMD T/R | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-P | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-P | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-P-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-P-TR | Samtec | Conn Socket Strip SKT 26 POS 1mm Solder ST SMD T/R | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-P-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 130 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-A-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-BE | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-BE | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Packaging: Tube Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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| CLM-113-02-L-D-BE-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-BE-A | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Board Guide Packaging: Tube Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-K | Samtec | Headers & Wire Housings Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-K | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-K-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-K-TR | Samtec | Conn Micro Socket Strip SKT 26 POS 1mm Solder ST SMD T/R | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-K-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-P | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 16 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-P | Samtec | Conn Micro Socket Strip SKT 26 POS 1mm Solder ST SMD Tube | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-P | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 42 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-P-TR | Samtec | Conn Micro Socket Strip SKT 26 POS 1mm Solder ST SMD T/R | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-P-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-P-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-PA | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tray Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-PA | Samtec | Conn Micro Socket Strip SKT 26 POS 1mm Solder ST SMD Tray | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-PA | Samtec | Headers & Wire Housings Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-PA | Samtec | Conn Micro Socket Strip SKT 26 POS 1mm Solder ST SMD Tray | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-PA-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-PA-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-L-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-LM-D-A-P | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD | товару немає в наявності | Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||
| CLM-113-02-LM-D-K-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-LM-D-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-LM-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1675 шт В кошику од. на суму грн. | ||||
| CLM-113-02-LM-D-P | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-LM-D-P | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 122 шт: термін постачання 21-31 дні (днів) |
| ||||
| CLM-113-02-LM-D-PA | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD Features: Pick and Place Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-113-02-LM-D-TR | Samtec Inc. | Description: CONN RCPT 26POS 0.039 GOLD SMD | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-114-02-F-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-114-02-F-D | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 238 шт: термін постачання 21-31 дні (днів) |
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| CLM-114-02-F-D-A | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Board Guide Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 39 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-A-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-A-K | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Board Guide, Pick and Place Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 39 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-A-K-TR | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1125 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-A-P | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Board Guide, Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 39 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-A-P-TR | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-A-P-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-BE | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Packaging: Tube Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 39 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-BE | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-BE-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-BE-A | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Board Guide Packaging: Tube Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 39 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-BE-PA | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tray Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-BE-PA-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-BE-PA-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-K | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 170 шт: термін постачання 21-31 дні (днів) |
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| CLM-114-02-F-D-K-TR | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1225 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1225 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-P | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-P | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 121 шт: термін постачання 21-31 дні (днів) |
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| CLM-114-02-F-D-P-TR | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1225 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-PA | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tray Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-PA-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-PA-TR | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 650 шт В кошику од. на суму грн. | ||||
| CLM-114-02-F-D-TR | Samtec Inc. | Description: CONN RCPT 28POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 28 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1225 шт В кошику од. на суму грн. |

