Продукція > CLM
| Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CLM-103-02-LM-D-BE | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-103-02-LM-D-BE-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-103-02-LM-D-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||
| CLM-103-02-LM-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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| CLM-104-02-F-D | Samtec | Headers & Wire Housings Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-A | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 20 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-A-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-A-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE | SAMTEC | Description: SAMTEC - CLM-104-02-F-D-BE - Printbuchse, Einführung unten, Board-to-Board, 1 mm, 2 Reihe(n), 8 Kontakt(e), Oberflächenmontage tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbindermontage: Oberflächenmontage Anzahl der Kontakte: 8Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Produktpalette: Tiger Claw CLM productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm | на замовлення 31 шт: термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-A | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-A-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle, Bottom Entry Features: Board Guide Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-K | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tube Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 126 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-K-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-PA | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Features: Pick and Place Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-PA | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-PA-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 700 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-PA-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 700 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-PA-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 700 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-BE-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-K | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 126 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-K-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-PA | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-PA | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tray Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-PA-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 700 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-PA-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 700 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-TR | Morethanall | CLM-104-02-F-D-TR PBD1.0-8-SMD Розетка 8 конт. в плату, 2-х ряд., шаг 1,0мм позолоч. SMT Розніми штирьові, розетки, вилки (крім IDC) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Cut Tape (CT) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 830 шт: термін постачання 21-31 дні (днів) |
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| CLM-104-02-F-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 845 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-F-D-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-FM-D | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 411 шт: термін постачання 21-31 дні (днів) |
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| CLM-104-02-FM-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-FM-D-A-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-FM-D-A-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-FM-D-BE | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle, Bottom Entry Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-FM-D-BE-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle, Bottom Entry Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-FM-D-PA-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-FM-D-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-FM-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-A | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle Features: Board Guide Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-BE | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-BE | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle, Bottom Entry Packaging: Bulk | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-BE-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-BE-A | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-BE-PA-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle, Bottom Entry Features: Pick and Place Packaging: Tape & Reel (TR) | товару немає в наявності | Мінімальне замовлення: 700 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-BE-PA-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 700 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-BE-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-BE-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-G-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-H-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 151 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-H-D | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-H-D-BE | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 46 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-H-D-BE | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-H-D-PA-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle Features: Pick and Place Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-H-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-H-D-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle Packaging: Tape & Reel (TR) | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 160 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD | на замовлення 1531 шт: термін постачання 21-31 дні (днів) |
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| CLM-104-02-L-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-A | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-A-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-A-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1100 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-A | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-FR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Packaging: Tape & Reel (TR) | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-K | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Packaging: Tube Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle, Bottom Entry Features: Pick and Place | товару немає в наявності | Мінімальне замовлення: 126 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-PA | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tray Features: Pick and Place Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-PA | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-PA-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle, Bottom Entry Features: Pick and Place Packaging: Tape & Reel (TR) | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-TR | Samtec Inc. | Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-BE-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-K | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 126 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-K-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | товару немає в наявності | Мінімальне замовлення: 1650 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-PA | Samtec | Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Tray | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-PA | Samtec | Headers & Wire Housings Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | В кошику од. на суму грн. | ||||||||||
| CLM-104-02-L-D-PA | Samtec | Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Tray | товару немає в наявності | Мінімальне замовлення: 102 шт В кошику од. на суму грн. |